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1. 发明授权

US08440546B2 Methods and devices for fabricating and assembling printable semiconductor elements 有权
公开(公告)号：US08440546B2
公开(公告)日：2013-05-14
申请号：US13113504
申请日：2011-05-23
申请人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
IPC分类号： H01L21/322
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

2. 发明申请

US20120171825A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SEMICONDUCTOR STRUCTURE 有权
标题翻译：半导体结构和半导体结构的制作方法
公开(公告)号：US20120171825A1
公开(公告)日：2012-07-05
申请号：US13412959
申请日：2012-03-06
申请人： Fujio Masuoka , Keon Jae LEE
发明人： Fujio Masuoka , Keon Jae LEE
IPC分类号： H01L21/8238
CPC分类号： H01L29/7827 , H01L21/823807 , H01L21/823828 , H01L21/823885 , H01L27/0922 , H01L29/045 , H01L29/0657 , H01L29/42356 , H01L29/66666 , H01L29/78642
摘要： In contrast to a conventional planar CMOS technique in design and fabrication for a field-effect transistor (FET), the present invention provides an SGT CMOS device formed on a conventional substrate using various crystal planes in association with a channel type and a pillar shape of an FET, without a need for a complicated device fabrication process. Further, differently from a design technique of changing a surface orientation in each planar FET, the present invention is designed to change a surface orientation in each SGT to achieve improvement in carrier mobility. Thus, a plurality of SGTs having various crystal planes can be formed on a common substrate to achieve a plurality of different carrier mobilities so as to obtain desired performance.
摘要翻译：与用于场效应晶体管（FET）的设计和制造中的常规平面CMOS技术相反，本发明提供了一种SGT CMOS器件，其形成在常规基板上，该传统基板使用与通道类型和柱形 FET，而不需要复杂的器件制造工艺。此外，与改变每个平面FET中的表面取向的设计技术不同，本发明被设计为改变每个SGT中的表面取向以实现载流子迁移率的改善。因此，可以在公共基板上形成具有各种晶面的多个SGT，以实现多种不同的载流子迁移率，从而获得期望的性能。

3. 发明授权

US08039847B2 Printable semiconductor structures and related methods of making and assembling 有权
标题翻译：可打印半导体结构及相关制造和组装方法
公开(公告)号：US08039847B2
公开(公告)日：2011-10-18
申请号：US12844492
申请日：2010-07-27
申请人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu , Heung Cho Ko , Shawn Mack
发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu , Heung Cho Ko , Shawn Mack
IPC分类号： H01L29/72 , H01L21/31 , B65C11/02 , C23F1/00
CPC分类号： H01L29/72 , B81C2201/0185 , B82Y10/00 , H01L21/02628 , H01L21/30 , H01L21/3083 , H01L21/31612 , H01L27/1285 , H01L27/1292 , H01L29/045 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/1606 , H01L29/66265 , H01L29/66462 , H01L29/7781 , H01L29/78603 , H01L29/78681 , H01L29/78684 , H01L29/78696 , H01L31/0392 , H01L31/03925 , H01L31/03926 , H01L31/18 , H01L31/1804 , H01L2924/0002 , H01L2924/12041 , H01L2924/13091 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
摘要翻译：本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性半导体器件。

4. 发明申请

US20140191236A1 Methods and Devices for Fabricating and Assembling Printable Semiconductor Elements 有权
标题翻译：用于制造和组装可印刷半导体元件的方法和装置
公开(公告)号：US20140191236A1
公开(公告)日：2014-07-10
申请号：US14155010
申请日：2014-01-14
申请人： Ralph G. NUZZO , John A. ROGERS , Etienne MENARD , Keon Jae LEE , Dahl-Young KHANG , Yugang SUN , Matthew MEITL , Zhengtao ZHU
发明人： Ralph G. NUZZO , John A. ROGERS , Etienne MENARD , Keon Jae LEE , Dahl-Young KHANG , Yugang SUN , Matthew MEITL , Zhengtao ZHU
IPC分类号： H01L29/06 , H01L29/04
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
摘要翻译：本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

5. 发明申请

US20090294803A1 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 有权
标题翻译：用于制作和组装可印刷的半导体元件的方法和装置
公开(公告)号：US20090294803A1
公开(公告)日：2009-12-03
申请号：US11145574
申请日：2005-06-02
申请人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
IPC分类号： H01L29/772 , H01L27/12 , H01L21/782 , H01L21/30 , H01L29/06 , H01L29/861
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
摘要翻译：本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

6. 发明申请

US20130001502A1 PHASE-CHANGE MEMORY DEVICE, FLEXIBLE PHASE-CHANGE MEMORY DEVICE USING INSULATING NANO-DOT AND MANUFACTURING METHOD FOR THE SAME 有权
标题翻译：相变存储器件，使用绝缘NANO-DOT的柔性相变存储器件及其制造方法
公开(公告)号：US20130001502A1
公开(公告)日：2013-01-03
申请号：US13401449
申请日：2012-02-21
申请人： Yeon Sik JUNG , Keon Jae Lee , Jae Won Jeong , Jae Suk Choi , Geon Tae Hwang , Beom Ho Mun , Byoung Kuk You , Seung Jun Kim
发明人： Yeon Sik JUNG , Keon Jae Lee , Jae Won Jeong , Jae Suk Choi , Geon Tae Hwang , Beom Ho Mun , Byoung Kuk You , Seung Jun Kim
IPC分类号： H01L45/00 , H01L21/02
CPC分类号： H01L45/06 , H01L27/2409 , H01L27/2436 , H01L27/2463 , H01L45/08 , H01L45/1233 , H01L45/126 , H01L45/144 , H01L45/146 , H01L45/1675
摘要： Provided are a phase-change memory device using insulating nanoparticles, a flexible phase-change memory device and a method for manufacturing the same. The phase-change memory device includes an electrode, and a phase-change layer in which a phase change occurs depending on heat generated from the electrode, wherein insulating nanoparticles formed from a self-assembled block copolymer are provided between the electrode and the phase-change layer undergoing crystallization and amorphization.
摘要翻译：提供了使用绝缘纳米颗粒的相变存储器件，柔性相变存储器件及其制造方法。相变存储器件包括电极和相变层，其中根据从电极产生的热量发生相变，其中由自组装的嵌段共聚物形成的绝缘纳米颗粒设置在电极和相 - 改变层正在进行结晶和非晶化。

7. 发明申请

US20120133247A1 FLEXIBLE NANOCOMPOSITE GENERATOR AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：柔性纳米复合发生器及其制造方法
公开(公告)号：US20120133247A1
公开(公告)日：2012-05-31
申请号：US13307870
申请日：2011-11-30
申请人： Keon Jae Lee , Kwi-Il Park , Do Kyung Kim , Sang Ouk Kim , Geon-Tae Hwang
发明人： Keon Jae Lee , Kwi-Il Park , Do Kyung Kim , Sang Ouk Kim , Geon-Tae Hwang
IPC分类号： H02N2/18 , H01L41/22 , H01L41/18 , B82Y99/00
CPC分类号： H01L41/37 , B82Y30/00 , H01L41/113 , H01L41/183
摘要： There are provided a flexible nanocomposite generator and a method of manufacturing the same. A flexible nanocomposite generator according to the present invention includes a piezoelectric layer formed of a flexible matrix containing piezoelectric nanoparticles and carbon nanostructures; and electrode layers disposed on the upper and lower surfaces of both sides of the piezoelectric layer, in which according to a method for manufacturing a flexible nanocomposite generator according to the present invention and a flexible nanogenerator, it is possible to manufacture a flexible nanogenerator with a large area and a small thickness. Therefore, the nanogenerator may be used as a portion of a fiber or cloth. Accordingly, the nanogenerator according to the present invention generates power in accordance with bending of attached cloth, such that it is possible to continuously generate power in accordance with movement of a human body.
摘要翻译：提供了一种柔性纳米复合发生器及其制造方法。根据本发明的柔性纳米复合发生器包括由含有压电纳米颗粒和碳纳米结构的柔性基体形成的压电层; 以及设置在压电体层的两侧的上表面和下表面上的电极层，其中根据本发明的柔性纳米复合材料发生器的制造方法和柔性纳米发生器，可以制造具有面积大，厚度小。因此，纳米发生器可以用作纤维或布的一部分。因此，根据本发明的纳米发生器根据附着的布的弯曲产生动力，使得可以根据人体的运动连续发电。

8. 发明申请

US20120115259A1 METHOD FOR FABRICATING FLEXIBLE ELECTRONIC DEVICE AND ELECTRONIC DEVICE FABRICATED THEREBY 审中-公开
标题翻译：制造柔性电子器件的方法及其制造的电子器件
公开(公告)号：US20120115259A1
公开(公告)日：2012-05-10
申请号：US13292772
申请日：2011-11-09
申请人： Keon Jae LEE , Min Koo , Geon Tae Hwang
发明人： Keon Jae LEE , Min Koo , Geon Tae Hwang
IPC分类号： H01L21/302 , B05D3/06 , B05D5/12 , H01L21/268 , H01L21/30
CPC分类号： H01M10/052 , H01M10/058
摘要： Disclosed are a method for fabricating a flexible electronic device using laser lift-off and an electronic device fabricated thereby. More particularly, disclosed are a method for fabricating a flexible electronic device using laser lift-off allowing for fabrication of a flexible electronic device in an economical and stable way by separating a device such as a secondary battery fabricated on a sacrificial substrate using laser, and an electronic device fabricated thereby.
摘要翻译：公开了一种使用激光剥离制造柔性电子装置的方法和由此制造的电子装置。更具体地，公开了一种使用激光剥离制造柔性电子器件的方法，其通过使用激光器分离诸如在牺牲基板上制造的二次电池的器件，以经济和稳定的方式制造柔性电子器件，以及由此制造的电子设备。

9. 发明申请

US20110174377A1 MANUFACTURING METHOD FOR FLEXIBLE DEVICE, FLEXIBLE DEVICE, SOLAR CELL, AND LIGHT EMITTING DEVICE 审中-公开
标题翻译：柔性装置，柔性装置，太阳能电池和发光装置的制造方法
公开(公告)号：US20110174377A1
公开(公告)日：2011-07-21
申请号：US13010108
申请日：2011-01-20
申请人： Keon Jae Lee , Sang Yong Lee
发明人： Keon Jae Lee , Sang Yong Lee
IPC分类号： H01L31/0264 , H01L21/30 , H01L29/20
摘要： Provided are a method of manufacturing a flexible device and the flexible device, a solar cell, and a light emitting device. The method of manufacturing a flexible device includes providing a device layer on a sacrificial substrate, contacting a flexible substrate on one side surface of the device layer, and removing the sacrificial substrate. A large area device may be transferred onto the flexible substrate with superior alignment to realize and manufacture the flexible device. In addition, since mass production is possible, the economic feasibility may be superior. Also, when a large area solar cell having a thin thickness is manufactured, since a limitation such as twisting of a thin film of a solar cell may be effectively solved, the economic feasibility and stability may be superior.
摘要翻译：提供了制造柔性装置和柔性装置，太阳能电池和发光装置的方法。柔性器件的制造方法包括在牺牲基片上提供器件层，与器件层的一个侧表面上的柔性衬底接触，以及去除牺牲衬底。可以将大面积的装置转移到具有较高对准的柔性基板上，以实现和制造柔性装置。另外，由于批量生产是可行的，经济可行性也可能更高。此外，当制造厚度薄的大面积太阳能电池时，由于可以有效地解决太阳能电池薄膜的扭转等限制，所以经济可行性和稳定性可以优异。

10. 发明授权

US07943491B2 Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp 有权
标题翻译：图案转印通过动态控制粘附到弹性印章上
公开(公告)号：US07943491B2
公开(公告)日：2011-05-17
申请号：US11423192
申请日：2006-06-09
申请人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
IPC分类号： H01L29/72
CPC分类号： H01L29/0665 , B82Y10/00 , B82Y20/00 , H01L29/0673 , H01L29/1606 , H01L29/78603 , H01L31/035281 , H01L31/0392 , H01L31/03925 , H01L31/072 , H01L31/109 , H01L31/18 , H01L31/1804 , H01L31/1892 , H01L2924/12041 , H01L2924/13091 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： The present invention provides methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods of the present invention utilize principles of ‘soft adhesion’ to guide the transfer, assembly and/or integration of features, such as printable semiconductor elements or other components of electronic devices. Methods of the present invention are useful for transferring features from a donor substrate to the transfer surface of an elastomeric transfer device and, optionally, from the transfer surface of an elastomeric transfer device to the receiving surface of a receiving substrate. The present methods and systems provide highly efficient, registered transfer of features and arrays of features, such as printable semiconductor element, in a concerted manner that maintains the relative spatial orientations of transferred features.
摘要翻译：本发明提供用于传送，组装和集成特征的阵列的方法，系统和系统组件，其具有所选择的纳米尺寸和/或微尺寸的物理尺寸，形状和空间取向。本发明的方法利用“软粘附”的原理来引导诸如可印刷半导体元件或电子器件的其它部件的特征的转移，组装和/或集成。本发明的方法可用于将特征从供体基底转移到弹性体转移装置的转移表面，并且可选地从弹性体转移装置的转移表面转移到接收基底的接收表面。本方法和系统以一致的方式提供特征和特征阵列的高效，注册传输，例如可印刷半导体元件，其保持所传送特征的相对空间取向。

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