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    • 1. 发明授权
    • Method for cleaning substrate processing apparatus, substrate processing apparatus, program and recording medium having program recorded therein
    • 清洗基板处理装置,基板处理装置,具有记录在其中的程序的程序和记录介质的方法
    • US07846257B2
    • 2010-12-07
    • US11548872
    • 2006-10-12
    • Hiroshi NakamuraKiyohito Iijima
    • Hiroshi NakamuraKiyohito Iijima
    • B08B6/00
    • B08B7/00B08B9/00C23C16/4405C23C16/52H01L21/67028H01L21/67253H01L21/67276H01L21/6831Y10S134/902
    • The substrate processing apparatus includes a plurality of processing chambers. A given processing chamber is cleaned by first executing first processing during which voltage application control is executed to control a voltage applied to an electrostatic chuck based upon first processing voltage application information provided for the particular processing chamber while drawing an inert gas into the processing chamber and evacuating the processing chamber sustaining therein low pressure conditions therein and then executing second processing during which voltage application control is executed to control the voltage application to the electrostatic chuck based upon second processing voltage application information for the processing chamber while drawing in the inert gas and evacuating the processing chamber, the internal pressure of which is set to a high level. As a result, the inside of the processing chamber can be cleaned with voltage settings optimized for the structure adopted in the processing chamber.
    • 基板处理装置包括多个处理室。 通过首先执行第一处理来清洁给定的处理室,在该处理期间执行电压施加控制,以在将惰性气体吸入处理室的同时基于为特定处理室提供的第一处理电压施加信息来控制施加到静电卡盘的电压,以及 将其中保持有低压条件的处理室排空,然后执行第二处理,在该处理期间,在进行电压施加控制的同时,根据用于处理室的第二处理电压施加信息来控制对静电卡盘的施加电压,同时吸入惰性气体并排空 该处理室的内部压力被设定为高水平。 结果,处理室的内部可以用针对处理室中采用的结构优化的电压设置进行清洁。
    • 3. 发明授权
    • Semiconductor processing system and method of transferring workpiece
    • 半导体处理系统和工件传送方法
    • US06983195B2
    • 2006-01-03
    • US10432628
    • 2001-12-06
    • Kiyohito IijimaShigeru Ishizawa
    • Kiyohito IijimaShigeru Ishizawa
    • G06F7/00
    • H01L21/67276
    • A semiconductor processing system has processing apparatuses (24A, 24B), waiting ports (36A, 36B, 36C), a common transfer mechanism (40), and a control section (94). The control section (94) performs information processing, using a remaining process time and total transfer time, while a first target object is processed in a first one of the processing apparatuses (24A, 24B). The remaining process time is a time to complete a process on the first target object in the first processing apparatus, and to make the first target object ready for transfer from the first processing apparatus. The total transfer time is a time to take out a target object from a first one of the waiting ports (36A, 36B, 36C), and to transfer the target object to the waiting position for the first processing apparatus. The control section (94) starts transferring a new target object from the first waiting port toward the waiting position for the first processing apparatus, based on a result of the information processing.
    • 半导体处理系统具有处理装置(24A,24B),等待端口(36A,36B,36C),公共传输机构(40)和控制部分(94)。 当在第一个处理装置(24A,24B)中处理第一目标对象时,控制部分(94)使用剩余处理时间和总传送时间进行信息处理。 剩余的处理时间是完成第一处理装置中的第一目标对象的处理的时间,并且使第一目标对象准备好从第一处理装置传送。 总传送时间是从第一等待端口(36A,36B,36C)中取出目标对象的时间,并将目标对象传送到第一处理装置的等待位置。 控制部94基于信息处理的结果开始将新的目标对象从第一等待端口转移到第一处理装置的等待位置。
    • 4. 发明申请
    • CLEANING METHOD AND STORAGE MEDIUM
    • 清洁方法和储存介质
    • US20100089423A1
    • 2010-04-15
    • US12577347
    • 2009-10-12
    • Kiyohito IIJIMAMasahiro NumakuraHiroaki Mochizuki
    • Kiyohito IIJIMAMasahiro NumakuraHiroaki Mochizuki
    • B08B9/00
    • H01L21/67276H01J37/32862H01J37/32935
    • A cleaning method is provided to clean processing chambers of a substrate processing apparatus for transferring substrates included in each of lots to the processing chambers on a lot basis and processing the substrates in the processing chambers simultaneously. The cleaning method includes checking whether a lot is switched to another lot to which different cleaning conditions are applied prior to the processing in the processing chambers, performing a cleaning process on the processing chambers under cleaning conditions of a previous lot by transferring cleaning substrates into the processing chambers when it is determined that a lot is switched to another lot to which different cleaning conditions are applied, and omitting the cleaning process of the processing chambers when it is determined that a lot is switched to another lot to which the same cleaning conditions are applied.
    • 提供一种清洁方法,用于清洁基板处理装置的处理室,用于将批次中包含的基板批量传送到处理室,同时处理处理室中的基板。 清洁方法包括在处理室中的处理之前检查批次是否切换到施加了不同清洁条件的另一批次,通过将清洁基板转移到处理室中的清洁条件下对处理室进行清洁处理 当确定批次被切换到施加不同清洁条件的另一批次时,处理室,并且当确定批次被切换到具有相同清洁条件的另一批次时,省略处理室的清洁处理 应用。
    • 7. 发明授权
    • Substrate processing apparatus and substrate transfer method adopted therein
    • 基板处理装置及基板转印方法
    • US08145339B2
    • 2012-03-27
    • US12418869
    • 2009-04-06
    • Kiyohito IijimaHiroaki MochizukiMasahiro Numakura
    • Kiyohito IijimaHiroaki MochizukiMasahiro Numakura
    • G06F19/00
    • H01L21/67748H01L21/67253H01L21/67754
    • As an interrupt start button is depressed while control, under which product wafers Wp and dummy wafers Wd are transferred in an order defined in a normal transfer pattern, is repeatedly executed, a decision is made based upon wafer transfer history as to whether or not the most recent transfer pattern cycle has ended. If the cycle is determined to have ended, the operation immediately proceeds to the subsequent cycle to transfer interrupt wafers Wf and Wd in an order defined in the interrupt transfer pattern achieved by replacing Wp in the normal transfer pattern with Wf, whereas if the cycle is determined to be incomplete, the wafer transfer based upon the normal transfer pattern is carried on until the cycle ends and then the operation proceeds to the next cycle to transfer Wf and Wd in the order defined in the interrupt transfer pattern.
    • 当按照正常传送模式中定义的顺序传送产品晶片Wp和虚拟晶片Wd的控制下按下中断启动按钮时,基于晶片传送历史来决定是否 最近的转移模式周期已经结束。 如果确定该周期已经结束,则操作立即进行到随后的周期,以按照以Wf代替正常转移模式中的Wp而实现的以中断转移模式中定义的顺序传送中断晶片Wf和Wd,而如果周期为 确定为不完全,基于正常转移模式的晶片传送被继续进行,直到循环结束,然后操作进行到下一个周期,以按照中断传送模式中定义的顺序传送Wf和Wd。
    • 9. 发明申请
    • CONTROL DEVICE AND CONTROL METHOD OF PLASMA PROCESSING SYSTEM, AND STORAGE MEDIUM STORING CONTROL PROGRAM
    • 等离子体处理系统的控制装置和控制方法以及存储介质存储控制程序
    • US20100010658A1
    • 2010-01-14
    • US12496137
    • 2009-07-01
    • Kiyohito IIJIMAHiroaki MOCHIZUKI
    • Kiyohito IIJIMAHiroaki MOCHIZUKI
    • G05B13/02
    • G05B19/41865G05B2219/31443G05B2219/32097Y02P90/20
    • In a control device of a plasma processing system, a storage unit is configured to store a reference recipe indicating an order of the plasma processing. An operation unit calculates a state variation value of each of the plasma processing devices by a predetermined timing at a plurality of processing lot intervals. A table generation unit generates an adjusting table for adjusting the reference recipe from the calculated state variation value of each of the plasma processing devices. In addition, a process executing control unit adjusts the reference recipe by using one of the generated adjusting tables for the plasma processing devices by the table generation unit and performs the plasma processing on the target object in the corresponding plasma processing device according to an order of the adjusted reference recipe.
    • 在等离子体处理系统的控制装置中,存储单元被配置为存储指示等离子体处理的顺序的参考配方。 操作单元以多个处理批间隔计算每个等离子体处理装置的预定定时的状态变化值。 表生成单元从计算出的各等离子体处理装置的状态变化值生成用于调整基准食谱的调整表。 此外,处理执行控制单元通过使用生成的生成的等离子体处理装置的调整表之一通过表生成单元来调整参考配方,并且对相应的等离子体处理装置中的目标对象执行等离子体处理 调整后的参考食谱。
    • 10. 发明申请
    • CLEANING METHOD OF SUBSTRATE PROCESSING EQUIPMENT, SUBSTRATE PROCESSING EQUIPMENT, AND RECORDING MEDIUM FOR RECORDING PROGRAM THEREOF
    • 基板处理设备的清洁方法,基板处理设备及其记录程序的记录介质
    • US20070215180A1
    • 2007-09-20
    • US11686738
    • 2007-03-15
    • Kiyohito IIJIMA
    • Kiyohito IIJIMA
    • B08B7/04
    • H01L21/67028H01J37/32862H01L21/67276
    • A cleaning method of substrate processing equipment includes performing a processing chamber cleaning after a specific process is performed on a substrate transferred into the processing chamber. Further, in the cleaning method, the cleaning is performed by a kind of the process, based on specific cleaning setting information which is set in advance according to kinds of processes performed in the processing chamber. In addition, a further cleaning method of substrate processing equipment is provided, which includes performing a processing chamber cleaning after a specific process is performed on a substrate transferred into the processing chamber. Here, the cleaning is performed by a recipe for a kind of the process, based on cleaning recipes which are prepared by kinds of processes performed in the processing chamber and are pre-stored in a setting information memory unit.
    • 基板处理设备的清洁方法包括在对转移到处理室中的基板执行特定处理之后执行处理室清洁。 此外,在清洁方法中,基于根据在处理室中执行的处理的种类预先设置的特定清洁设置信息,通过一种处理执行清洁。 此外,提供了进一步的基板处理设备的清洁方法,其包括在对传送到处理室中的基板进行特定处理之后执行处理室清洁。 这里,基于通过在处理室中执行的各种处理准备并且预先存储在设置信息存储单元中的清洁配方,通过用于一种处理的配方执行清洁。