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1. 发明授权

US11749549B2 Substrate processing apparatus with an air curtain in a loading/unloading part 有权
公开(公告)号：US11749549B2
公开(公告)日：2023-09-05
申请号：US16748834
申请日：2020-01-22
申请人： KCTECH CO., LTD.
发明人： Dong Min Kim
IPC分类号： H01L21/677 , C23C16/44 , H01L21/67 , B24B57/02 , B05C11/06 , B05D3/04
CPC分类号： H01L21/67739 , B05C11/06 , B24B57/02 , C23C16/4412 , H01L21/6719 , B05D3/04 , H01L21/67051 , Y10S55/29 , Y10S414/139
摘要： The present disclosure relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus capable of blocking the introduction of external air and external particles into a chamber by forming an air curtain at a loading/unloading part when the chamber is open. The substrate processing apparatus of the present disclosure includes a chamber in which a space is formed, and a fluid injection part configured to inject a fluid from an outer side of a substrate loading/unloading part of the chamber through which a substrate is loaded and unloaded.

2. 发明授权

US09884726B2 Semiconductor wafer handling transport 有权
公开(公告)号：US09884726B2
公开(公告)日：2018-02-06
申请号：US14216829
申请日：2014-03-17
申请人： Brooks Automation, Inc.
发明人： Peter van der Meulen , Christopher C. Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号： H01L21/677 , B65G25/02 , B65G37/00 , H01L21/67 , H01L21/687
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

3. 发明授权

US09457464B2 Substrate processing systems and robot apparatus for transporting substrates in electronic device manufacturing 有权
标题翻译：用于在电子设备制造中传送基板的基板处理系统和机器人装置
公开(公告)号：US09457464B2
公开(公告)日：2016-10-04
申请号：US14297675
申请日：2014-06-06
申请人： Applied Materials, Inc.
发明人： Izya Kremerman , Jeffrey C. Hudgens
IPC分类号： B25J9/06 , B25J9/04 , B25J9/10 , H01L21/677
CPC分类号： B25J9/043 , B25J9/042 , B25J9/107 , H01L21/67742 , Y10S414/139 , Y10S901/15 , Y10T74/20305
摘要： Robot apparatus, substrate transport systems, and methods are described. The robot apparatus and systems are adapted to efficiently put or pick substrates at a destination by rotating a boom linkage to a position adjacent to the destination and then actuating robot assemblies to put or pick the substrates at the destination. Numerous other aspects are provided.
摘要翻译：描述了机器人装置，基板输送系统和方法。机器人装置和系统适于通过将动臂联动件旋转到与目的地相邻的位置，然后致动机器人组件来将目标物放置或拾取基板，从而有效地将目标物体放置或拾取目的地。提供了许多其他方面。

4. 发明申请

US20150308008A1 ANODIZING APPARATUS 审中-公开
公开(公告)号：US20150308008A1
公开(公告)日：2015-10-29
申请号：US14673611
申请日：2015-03-30
申请人： Solexel, Inc.
发明人： Yasuyoshi MIYAJI , Noriyuki HAYASHI , Takamitsu INAHARA , Takao YONEHARA , Karl-Josef KRAMER , Subramanian TAMILMANI
IPC分类号： C25D11/00 , C25D17/02 , C25D17/00
CPC分类号： C25D11/005 , C25D17/002 , C25D17/005 , C25D17/02 , Y10S414/135 , Y10S414/136 , Y10S414/137 , Y10S414/138 , Y10S414/139 , Y10S414/14 , Y10S414/141
摘要： An apparatus for anodizing substrates immersed in an electrolyte solution. A substrate holder mounted in a storage tank includes a first support unit having first support elements for supporting, in a liquid-tight condition, portions of the substrates, and a second support unit attachable to and detachable from the first support unit and having second support elements for supporting, in a liquid-tight condition, the remaining portions of the substrates. The second support unit includes a first portion second support unit having support elements for supporting first portions of the remaining portions of the surfaces of the substrates, and a second portion second support unit having support elements for supporting second portions of the remaining portions of the surfaces of the substrates.
摘要翻译：用于阳极氧化沉积在电解质溶液中的基底的装置。安装在储罐中的基板保持器包括第一支撑单元，该第一支撑单元具有第一支撑元件，用于在液密条件下支撑基板的一部分;以及第二支撑单元，其可附接到第一支撑单元并且可从第一支撑单元拆卸，用于在液密条件下支撑基底的其余部分的元件。第二支撑单元包括第一部分第二支撑单元，该第一支撑单元具有用于支撑基板的其余部分的第一部分的支撑元件，以及具有支撑元件的第二部分第二支撑单元，用于支撑表面的剩余部分的第二部分的基材。

5. 发明申请

US20150194327A1 VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD OF SEMICONDUCTOR PROCESSING SUBSTRATE 审中-公开
标题翻译：真空加工系统和半导体加工基板的真空加工方法
公开(公告)号：US20150194327A1
公开(公告)日：2015-07-09
申请号：US14663548
申请日：2015-03-20
申请人： HITACHI HIGH-TECHNOLOGIES CORPORATION
发明人： Susumu Tauchi , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
IPC分类号： H01L21/67 , H01L21/677
CPC分类号： H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67745 , H01L21/67769 , Y10S414/139
摘要： A vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same comprises an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer transferred from the atmospheric transfer chamber, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, a second vacuum transfer chamber connected to the transfer intermediate chamber, at least one vacuum processing chamber connected to the first vacuum transfer chamber, and two or more vacuum processing chambers connected to a rear side of the second vacuum transfer chamber, wherein the number of vacuum processing chambers connected to the first vacuum transfer chamber is smaller than the number of vacuum processing chambers connected to the second vacuum transfer chamber, or the number of use of vacuum processing chambers connected to the first vacuum transfer chamber is restricted to one.
摘要翻译：半导体处理基板的真空处理系统和使用其的真空处理方法包括具有多个用于传送晶片的盒架的大气传送室，用于存储从大气传送室转移的晶片的锁定室，第一真空传送室，来自锁定室的晶片被转印到该传送室，连接到第一真空传送室的传送中间室，连接到传送中间室的第二真空传送室，连接到第一真空传送室的至少一个真空处理室以及连接到第二真空传送室的后侧的两个或更多个真空处理室，其中连接到第一真空传送室的真空处理室的数量小于连接到第二真空传送室的真空处理室的数量，或使用真空加工台数连接到第一真空传送室的器件被限制为一个。

6. 发明授权

US09054146B2 Substrate transfer equipment and high speed substrate processing system using the same 有权
标题翻译：基板转移设备和高速基板处理系统使用相同
公开(公告)号：US09054146B2
公开(公告)日：2015-06-09
申请号：US12298972
申请日：2007-05-01
申请人： Soon-Im Wi
发明人： Soon-Im Wi
IPC分类号： H01L21/677 , H01L21/687 , H01L21/67
CPC分类号： H01L21/67742 , H01L21/67196 , H01L21/67745 , H01L21/68707 , Y10S414/139 , Y10S414/141 , Y10S901/30
摘要： There are provided a substrate transferring apparatus for continuously loading/unloading a plurality of substrates in and from a process chamber to reduce time spent on transferring the substrates and to improve productivity and a substrate processing system using the same. The substrate transfer apparatus is installed in the transfer chamber and transfers substrates between first and second process chambers which is positioned lateral sides of the transfer chamber and a load rock chamber. The substrate transfer apparatus includes a driving unit to supply a rotational force, a spindle connected to the driving unit, first swivel plate arms to load/unload substrate to/from first process chamber, and second swivel plate arms to load/unload substrate to/from second process chamber. Since substrates before and after being processed are rapidly exchanged during the simultaneous or continuous process of plural substrates, processing rate increases and overall productivity can be increased.
摘要翻译：提供了一种用于在处理室中和从处理室中连续地加载/卸载多个基板的基板转移装置，以减少用于转移基板的时间并提高生产率以及使用该基板处理系统的基板处理系统。衬底传送装置安装在传送室中，并且在位于传送室的侧面的第一和第二处理室和负载岩石室之间传送衬底。基板输送装置包括：提供旋转力的驱动单元，与驱动单元连接的主轴;第一旋转板臂，用于对第一处理室进行加载/卸载;第二旋转板臂，将基板装载到/ 从第二处理室。由于在多个基板的同时或连续的过程中快速更换处理前后的基板，因此加工速度提高，总体生产率提高。

7. 发明授权

US08950998B2 Batch substrate handling 有权
标题翻译：批量基板处理
公开(公告)号：US08950998B2
公开(公告)日：2015-02-10
申请号：US12106975
申请日：2008-04-21
申请人： Peter van der Meulen
发明人： Peter van der Meulen
IPC分类号： H01L21/67 , B65G25/02 , B25J9/16 , G05B19/418 , B65G37/00 , H01L21/677 , H01L21/687
CPC分类号： B65G25/02 , B25J9/161 , B65G37/00 , G05B19/41865 , H01L21/67167 , H01L21/67276 , H01L21/67742 , H01L21/68707 , Y10S414/139 , Y10S706/904
摘要： A substrate-handling vacuum robot includes a first robotic arm with a single-substrate end effector and a second robotic arm with a batch end effector. The single-substrate end effector permits single-substrate pick-and-place operations while the batch end effector permits batch handling of substrates within a vacuum environment.
摘要翻译：基板处理真空机器人包括具有单基板端部执行器的第一机器人臂和具有批尾端执行器的第二机器臂。单衬底端部执行器允许单衬底拾取和放置操作，而批处理末端执行器允许在真空环境内批处理衬底。

8. 发明申请

US20140286741A1 SUBSTRATE PROCESSING SYSTEMS AND ROBOT APPARATUS FOR TRANSPORTING SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING 审中-公开
标题翻译：用于在电子设备制造中运输基板的基板处理系统和机器人装置
公开(公告)号：US20140286741A1
公开(公告)日：2014-09-25
申请号：US14297675
申请日：2014-06-06
申请人： Applied Materials, Inc.
发明人： Izya Kremerman , Jeffrey C. Hudgens
IPC分类号： H01L21/677
CPC分类号： B25J9/043 , B25J9/042 , B25J9/107 , H01L21/67742 , Y10S414/139 , Y10S901/15 , Y10T74/20305
摘要： Robot apparatus, substrate transport systems, and methods are described. The robot apparatus and systems are adapted to efficiently put or pick substrates at a destination by rotating a boom linkage to a position adjacent to the destination and then actuating robot assemblies to put or pick the substrates at the destination. Numerous other aspects are provided.
摘要翻译：描述了机器人装置，基板输送系统和方法。机器人装置和系统适于通过将动臂联动件旋转到与目的地相邻的位置，然后致动机器人组件来将目标物放置或拾取基板，从而有效地将目标物体放置或拾取目的地。提供了许多其他方面。

9. 发明授权

US08807914B2 Seal device and method for operating the same and substrate processing apparatus comprising a vacuum chamber 有权
标题翻译：用于操作其的密封装置和方法以及包括真空室的基板处理装置
公开(公告)号：US08807914B2
公开(公告)日：2014-08-19
申请号：US12285489
申请日：2008-10-07
申请人： Hiroyuki Shinozaki
发明人： Hiroyuki Shinozaki
IPC分类号： B65H1/00 , C23C16/00 , C23F1/00 , F01D11/00
CPC分类号： H01L21/67126 , F16J15/406 , Y10S414/135 , Y10S414/139 , Y10S414/141
摘要： The present invention provides a seal device comprising a sealing passage which allows communication between a first space and a second space, and evacuation lines individually connected to the first space and the sealing passage. A gas feed line for feeding dry gas is connected to the sealing passage.
摘要翻译：本发明提供了一种密封装置，其包括允许第一空间和第二空间之间连通的密封通道，以及分别连接到第一空间和密封通道的抽空管线。用于供给干燥气体的气体供给管线连接到密封通道。

10. 发明授权

US08784033B2 Robot systems, apparatus and methods for transporting substrates 有权
标题翻译：用于运输基材的机器人系统，设备和方法
公开(公告)号：US08784033B2
公开(公告)日：2014-07-22
申请号：US12684780
申请日：2010-01-08
申请人： Izya Kremerman , Jeffrey C. Hudgens
发明人： Izya Kremerman , Jeffrey C. Hudgens
IPC分类号： B66C23/00 , B25J9/06 , H01L21/677 , H01L21/683 , B25J9/04 , B25J9/10
CPC分类号： B25J9/043 , B25J9/042 , B25J9/107 , H01L21/67742 , Y10S414/139 , Y10S901/15 , Y10T74/20305
摘要： Substrate transport systems, apparatus and methods are described. The systems are adapted to efficiently put or pick substrates at a destination by rotating a boom linkage to a position adjacent to the destination and then actuating a robot assembly to put or pick the substrate at the destination. Numerous other aspects are provided.
摘要翻译：描述了基板运输系统，装置和方法。这些系统适于通过将动臂联动件旋转到与目的地相邻的位置，然后致动机器人组件以将目标物置于或拾取基板，来有效地将目标物放置或拾取目的地的基板。提供了许多其他方面。

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