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1. 发明授权

US08735770B2 Laser processing method for forming a modified region in an object 有权
标题翻译：用于在物体中形成改质区域的激光加工方法
公开(公告)号：US08735770B2
公开(公告)日：2014-05-27
申请号：US12444125
申请日：2007-09-27
申请人： Koji Kuno , Tatsuya Suzuki , Kazuhiro Atsumi
发明人： Koji Kuno , Tatsuya Suzuki , Kazuhiro Atsumi
IPC分类号： B23K26/14 , B23K26/16 , B23K26/06
CPC分类号： B23K26/048 , B23K26/046 , B23K26/40 , B23K26/53 , B23K2103/50 , B28D5/0011 , H01L21/02381 , H01L21/02675 , H01L21/67092 , H01L21/78
摘要： While a converging lens 108 is relatively moved along a line 50 including a line to cut 5, measuring laser light L2 is converged with the lens 108 when the lens 108 is positioned on a processing region 30 having an outer shape between an object to be processed 1 and a frame 22, and a reflected light component of the laser light L2 reflected by a front face 3 of the object 1 is detected. While keeping a substantially constant distance between the front face 3 and the lens 108 such that a converging point P of processing laser light L1 is positioned at a constant distance from the front face 3 according to the detection, the laser light L1 is converged by the lens 108, so as to form a molten processed region 13 within the object 1.
摘要翻译：当会聚透镜108沿着包括切割线5的线50相对移动时，当透镜108位于具有处于被处理物体之间的外形的处理区域30时，测量激光L2与透镜108会聚检测出由物体1的正面3反射的激光L2的反射光分量。在保持前表面3和透镜108之间保持基本上恒定的距离的同时，根据检测，处理激光L1的会聚点P位于距前表面3的恒定距离处，激光L1被透镜108，以便在物体1内形成熔融处理区域13。

2. 发明授权

US08604383B2 Laser processing method 有权
标题翻译：激光加工方法
公开(公告)号：US08604383B2
公开(公告)日：2013-12-10
申请号：US11659376
申请日：2005-07-27
申请人： Koji Kuno , Tatsuya Suzuki , Takeshi Sakamoto
发明人： Koji Kuno , Tatsuya Suzuki , Takeshi Sakamoto
IPC分类号： B23K26/42 , H01L21/301
CPC分类号： H01L23/562 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/172 , B23K2103/50 , B28D1/221 , B28D5/0011 , C03B33/0222 , H01L2924/0002 , H01L2924/00
摘要： This laser processing method irradiates a substrate 4 with laser light L while locating a light-converging point P within the substrate 4, so as to form a quality modified region 71 to become a starting point region for cutting within the substrate 4 along a line to cut 5. Here, the laser light L is oscillated pulsewise along a desirable part RP in the line to cut 5, and continuously in a predetermined part RC in the line to cut 5. Consequently, the quality modified region 71 is formed within the substrate 4 along the desirable part RP in the line to cut 5, whereas no quality modified region 71 is formed within the substrate 4 along the predetermined part RC in the line to cut 5.
摘要翻译：该激光加工方法在将聚光点P定位在基板4内的状态下照射激光L的基板4，从而形成质量改质区域71，成为基板4内的切割起点区域，这里，激光L沿着要切割的线5中的期望部分RP脉动地沿着切割线5中的预定部分RC连续振荡。因此，质量改质区域71形成在基板内沿着要切割的线5中的期望部分RP 4，而沿着切割线5中的预定部分RC，在基板4内不形成质量改质区域71。

3. 发明授权

US08563893B2 Laser material processing system 有权
标题翻译：激光材料加工系统
公开(公告)号：US08563893B2
公开(公告)日：2013-10-22
申请号：US12096940
申请日：2006-12-12
申请人： Koji Kuno , Kenichi Muramatsu , Kazuhiro Atsumi , Tetsuya Osajima
发明人： Koji Kuno , Kenichi Muramatsu , Kazuhiro Atsumi , Tetsuya Osajima
IPC分类号： H01L21/78 , H01S3/13 , B23K26/00 , B23K26/06
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0617 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： A laser processing apparatus comprises a converging lens 31 for converging processing laser light and rangefinding laser light L2 toward a wafer 1, an actuator for actuating the lens 31, a shaping optical system 49 for adding astigmatism to reflected light L3 of the rangefinding laser light, a quadrant photodiode 42 for receiving the reflected light L3 and outputting voltage values corresponding to its light quantities, and a controller for regulating the actuator, and positions a converging point P2 of the rangefinding laser light L2 between a focal point P0 of the lens and the lens 31, so as to make it possible to form a modified region at a position deeper from the front face 3, thereby suppressing adverse effects due to the reflected light L3. The control is based on an arithmetic value subjected to a division by a sum of the voltage values, so as to prevent the arithmetic value from being changed by the quantity of reflected light.
摘要翻译：激光加工装置包括用于会聚处理激光的聚光透镜31和朝向晶片1的测距激光L2，用于致动透镜31的致动器，用于对测距激光的反射光L3增加散光的整形光学系统49，用于接收反射光L3并输出与其光量相对应的电压值的象限光电二极管42，以及用于调节致动器的控制器，并将测距激光L2的会聚点P2定位在透镜的焦点P0和透镜31，从而能够在比正面3更深的位置形成改质区域，由此抑制由反射光L3引起的不利影响。控制基于经过除以电压值之和的算术值，以防止算术值被反射光量改变。

4. 发明申请

US20120196427A1 LASER WORKING METHOD, LASER WORKING APPARATUS, AND ITS MANUFACTURING METHOD 审中-公开
标题翻译：激光工作方法，激光工作装置及其制造方法
公开(公告)号：US20120196427A1
公开(公告)日：2012-08-02
申请号：US13362781
申请日：2012-01-31
申请人： Makoto Nakano , Koji Kuno , Tetsuya Osajima , Takashi Inoue , Masayoshi Kumagai
发明人： Makoto Nakano , Koji Kuno , Tetsuya Osajima , Takashi Inoue , Masayoshi Kumagai
IPC分类号： H01L21/78 , B23P11/00 , B23K26/00
CPC分类号： H01L21/78 , B23K26/0006 , B23K26/046 , B23K26/0624 , B23K26/064 , B23K26/0861 , B23K26/128 , B23K26/40 , B23K26/402 , B23K26/53 , B23K2103/50 , B23K2103/56 , B28D1/221 , B28D5/00 , C03B33/0222 , H01L23/544 , H01L2223/54453 , Y10T29/49826
摘要： An object is irradiated with a laser light modulated by a reflection type spatial light modulator such that aberration of the laser light converged inside the object becomes a predetermined aberration or less. Therefore, aberration of the laser light generated at a position on which a converging point of the laser light is located is made as small as possible, to enhance the energy density of the laser light at that position, which makes it possible to form a modified region with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator is used, it is possible to improve the utilization efficiency of the laser light as compared with a transmissive type spatial light modulator.
摘要翻译：用由反射型空间光调制器调制的激光照射物体，使得会聚在物体内的激光的像差成为预定像差或更小。因此，在激光的会聚点所在的位置处产生的激光的像差尽可能地小，以增强该位置处的激光的能量密度，这使得可以形成经修改的具有高功能的区域作为切割的起点。此外，由于使用反射型空间光调制器，与透射型空间光调制器相比，可以提高激光的利用效率。

5. 发明申请

US20110193952A1 DEFECT DETECTION APPARATUS AND DEFECT DETECTION METHOD 审中-公开
标题翻译：缺陷检测装置和缺陷检测方法
公开(公告)号：US20110193952A1
公开(公告)日：2011-08-11
申请号：US13018817
申请日：2011-02-01
申请人： Akira KOZAKAI , Masataka Toda , Koji Kuno
发明人： Akira KOZAKAI , Masataka Toda , Koji Kuno
IPC分类号： G06K9/00 , H04N7/18
CPC分类号： G01N21/8851 , G01N21/474 , G01N21/8806 , G01N21/95 , G01N2021/8918
摘要： A defect detection apparatus, detecting a defect on an inspection surface of an inspection object, includes a table including a table surface, a lighting device emitting a light to the inspection surface, an image capturing device capturing an image of the inspection surface, a displacement mechanism changing a direction of at least of one of a relative direction of an optical axis of the lighting device relative to the table surface and a relative direction of an optical axis of the image capturing device relative to the table surface, an image data obtaining portion obtaining an image data from images captured by the image capturing device while changing the relative direction, a feature extracting portion extracting a feature representing a reflection characteristic of the inspection surface from the image data, and a defect specification portion specifying a type of the defect on the inspection surface based on the extracted feature.
摘要翻译：一种检测检查对象的检查面上的缺陷的缺陷检测装置，包括：台面，向检查面发射光的照明装置，摄像检查面的图像的摄像装置，位移改变照明装置的光轴相对于台面的相对方向和摄像装置相对于台面的相对方向中的至少一个的方向的机构，图像数据取得部在改变相对方向的同时从图像捕获装置拍摄的图像中获取图像数据，从图像数据中提取表示检查表面的反射特性的特征的特征提取部分，以及指定缺陷类型的缺陷指定部分基于提取的特征的检查表面。

6. 发明申请

US20100025386A1 LASER PROCESSING DEVICE 有权
标题翻译：激光加工设备
公开(公告)号：US20100025386A1
公开(公告)日：2010-02-04
申请号：US12443045
申请日：2007-09-26
申请人： Koji Kuno , Tatsuya Suzuki , Norio Kurita , Tetsuya Osajima
发明人： Koji Kuno , Tatsuya Suzuki , Norio Kurita , Tetsuya Osajima
IPC分类号： B23K26/06 , B23K26/38
CPC分类号： B23K26/38 , B23K26/048 , B23K26/0624 , B23K26/0676 , B23K26/0853 , B23K26/0869 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： The time required for forming a modified region within an object to be processed is shortened. An apparatus 100 comprises a mount table 107, a light source 101 for emitting linearly polarized laser light L, a light source 41 for emitting laser light L3, a wave plate 51 for changing the polarization direction of the laser light L, a polarizing plate 52 for splitting the laser light L into a laser light component L1 having a polarization direction in an X direction and a laser light component L2 having a polarization direction in a Y direction, a wave plate 55 for orienting the polarization direction of the split laser light component L2 to the X direction, a lens 31 for converging the laser light components L1, L3, a lens 32 which is arranged in parallel with the lens 31 along the X direction and converges the laser light component L2 having the polarization direction oriented to the X direction, a control section 105 for controlling a device 29 such that a converging point of the laser light component L2 is located at a predetermined position with reference to a front face 3 by detecting a reflected light component L4, and a control section 115 for moving the mount table 107 along a line 5 while making the X direction substantially coincide with the line 5.
摘要翻译：在待处理物体内形成改质区域所需的时间缩短。装置100包括安装台107，用于发射线偏振激光L的光源101，用于发射激光L3的光源41，用于改变激光L的偏振方向的波片51，偏振片52 为了将激光L分割成具有X方向的偏振方向的激光成分L1和Y方向的偏光方向的激光成分L2，将分割的激光成分的偏振方向定向的波片55 L2到X方向，用于使激光成分L1，L3聚光的透镜31，与透镜31平行配置的透镜32沿X方向会聚，具有偏振方向的激光成分L2朝向X 方向，控制部分105，用于控制装置29，使得激光部件L2的会聚点相对于前表面3位于预定位置，通过检测反射光分量L4;以及控制部分115，用于沿着线5移动安装台107，同时使X方向基本上与线5重合。

7. 发明申请

US20090039559A1 Laser Beam Machining Method 有权
标题翻译：激光束加工方法
公开(公告)号：US20090039559A1
公开(公告)日：2009-02-12
申请号：US11665263
申请日：2005-10-05
申请人： Koji Kuno , Tatsuya Suzuki
发明人： Koji Kuno , Tatsuya Suzuki
IPC分类号： B29C67/00
CPC分类号： B23K26/40 , B23K26/0665 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , H01L21/78
摘要： To provide a laser processing method which can highly accurately cut a planar object to be processed having an irregular surface as an entrance surface for processing laser light.This laser processing method irradiates a planar object to be processed with laser light while locating a light-converging point within the object, thereby forming modified regions 71 to 77 to become a starting point region for cutting along lines to cut 5. The entrance surface r for the laser light in the object is an irregular surface. The lines to cut 5 extend over a depressed area surface r2 and a protruded area surface r1 in the entrance surface r. The modified region 71 is formed inside by a predetermined distance from the depressed area surface r2. At the time of irradiation with laser light along a part 51a on the protruded area surface r1, the light-converging point is located on the outside of the object. The modified region 72 is formed inside by a predetermined distance from the protruded area surface r1. At the time of irradiation with laser light along a part 51b on the depressed area surface r2, the light-converging point is located on the outside of the object.
摘要翻译：提供一种可以高精度地切割具有不规则表面的待处理平面物体作为处理激光的入射面的激光加工方法。这种激光加工方法在将聚光点定位在物体内的同时用激光照射待处理的平面物体，从而形成改质区域71〜77，成为沿切割线5切割的起点区域。入射面r 对于物体中的激光是不规则的表面。切割线5在入口面r的凹陷区域表面r2和突出区域表面r1上延伸。改质区域71形成在与凹陷区域表面r2相距预定距离的内侧。在沿着突出区域表面r1上的部分51a照射激光时，聚光点位于物体的外侧。改质区域72形成在与突出面r1相距预定距离的内侧。在沿着凹陷区域表面r2上的部分51b照射激光时，聚光点位于物体的外侧。

8. 发明申请

US20080037003A1 Laser Processing Method And Device 有权
标题翻译：激光加工方法与装置
公开(公告)号：US20080037003A1
公开(公告)日：2008-02-14
申请号：US10585451
申请日：2004-12-13
申请人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
IPC分类号： B23K26/04
CPC分类号： B23K26/53 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2103/50
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam is provided.This laser processing method comprises a displacement acquiring step (S07 to S11) of irradiating an object to be processed with a rangefinding laser beam for measuring a displacement of a main surface of the object while converging the laser beam with a lens and acquiring the displacement of the main surface along a line to cut while detecting reflected light reflected by the main surface in response to the irradiation; and moves the processing objective lens and the object relative to each other along the main surface, while adjusting the gap between the processing objective lens and the surface according to the displacement acquired by the displacement acquiring step, thereby forming the modified region along the line to cut.
摘要翻译：提供一种可以有效地执行激光加工同时最小化激光束的会聚点的偏差的激光加工方法。这种激光加工方法包括：用用于测量物体的主表面的位移的测距激光束照射被处理物体的位移获取步骤（S07至S11），同时用激光束与透镜同步并获取沿着切割线的主表面的位移，同时响应于照射检测由主表面反射的反射光; 并且沿着主表面相对于彼此移动处理物镜和物体，同时根据由位移获取步骤获取的位移调节处理物镜与表面之间的间隙，从而沿着线形成修改区域切。

9. 发明授权

US08287990B2 Radio wave transmission cover and method of manufacturing the same 有权
标题翻译：无线电波传输盖及其制造方法
公开(公告)号：US08287990B2
公开(公告)日：2012-10-16
申请号：US12076523
申请日：2008-03-19
申请人： Hideto Maeda , Daiichiro Kawashima , Kimihiro Iimura , Koji Kuno , Mamoru Kato , Takayasu Ido , Muneo Furutani , Tetsuya Fujii
发明人： Hideto Maeda , Daiichiro Kawashima , Kimihiro Iimura , Koji Kuno , Mamoru Kato , Takayasu Ido , Muneo Furutani , Tetsuya Fujii
IPC分类号： B32B3/00 , B05D5/12
CPC分类号： H01Q1/40 , B29C45/1671 , B29C2045/1673 , B29K2995/0025 , B29K2995/0026 , B60R19/483 , G01S7/03 , G01S2013/9371 , G01S2013/9375 , H01Q1/3233 , H01Q1/42 , H01Q1/422 , Y10T428/24802 , Y10T428/24851
摘要： The present invention provides a radio wave transmission cover, which is provided in front of a radar device for vehicles, and a method of manufacturing the radio wave transmission cover. In the radio wave transmission cover, cover-side wall surfaces (50) are formed in a second cover layer (35) at positions adjacent to each other. Furthermore, substrate-side wall surfaces (60), which have shapes complementary to the cover-side wall surfaces (50), are formed in a substrate layer (4), which is provided on the rear surface of the second cover layer (35). The cover-side wall surfaces (50) and the corresponding substrate-side wall surfaces (60) are engaged to each other.
摘要翻译：本发明提供一种无线电波传输盖，其设置在用于车辆的雷达装置的前方，以及制造无线电波传输盖的方法。在无线电波传输盖中，在彼此相邻的位置处，在第二覆盖层（35）中形成盖侧壁面（50）。此外，在设置在第二覆盖层（35）的后表面上的基板层（4）中形成具有与盖侧壁面（50）互补的形状的基板侧壁面（60））。盖侧壁面（50）和相应的基板侧壁面（60）彼此接合。

10. 发明申请

US20100240159A1 MANUFACTURING METHOD OF SEMICONDUCTOR LASER ELEMENT 有权
标题翻译：半导体激光元件的制造方法
公开(公告)号：US20100240159A1
公开(公告)日：2010-09-23
申请号：US12676666
申请日：2008-09-02
申请人： Masayoshi Kumagai , Kenshi Fukumitsu , Koji Kuno
发明人： Masayoshi Kumagai , Kenshi Fukumitsu , Koji Kuno
IPC分类号： H01L21/304
CPC分类号： B23K26/0624 , B23K26/0853 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , C03B33/0222 , H01L21/78 , H01S5/0201 , Y02P40/57
摘要： Starting point regions for cutting 8a, 8b extending along lines to cut 5a, 5b are initially formed in an object to be processed 1. The starting point regions for cutting 8b have modified regions 7b formed by irradiating the object 1 with laser light while locating a converging point within the object 1 and are formed in parts extending along the lines to cut 5b excluding portions 34b intersecting the lines to cut 5a. This makes the starting point regions for cutting 8b much less influential when cutting the object 1 from the starting point regions for cutting 8a acting as a start point, whereby bars with precise cleavage surfaces can reliably be obtained. Therefore, it is unnecessary to form a starting point region for cutting along the lines to cut 5b in each of a plurality of bars, whereby the productivity of semiconductor laser elements can be improved.
摘要翻译：最初在被加工物1中形成沿切割线5a，5b延伸的用于切割的切割8a，8b的起点区域。用于切割8b的起点区域具有通过用激光照射物体1而形成的改变区域7b，同时定位在物体1内的会聚点，并且形成为沿着切割线的线延伸的部分，除了与切割线5a相交的部分34b。这样，从切点8a的起点区域切断物体1时，能够切割8b的起点区域的影响更小，从而可以可靠地获得具有精确的切割面的条。因此，不需要在多个条中形成沿着切割线5b切割的起点区域，从而可以提高半导体激光元件的生产率。

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