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1. 发明授权

US06859029B2 System and method for monitoring high-frequency circuits 有权
标题翻译：监控高频电路的系统和方法
公开(公告)号：US06859029B2
公开(公告)日：2005-02-22
申请号：US10625740
申请日：2003-07-24
申请人： Kazunori Yamanaka , Isao Nakazawa , Masafumi Shigaki , Manabu Kai
发明人： Kazunori Yamanaka , Isao Nakazawa , Masafumi Shigaki , Manabu Kai
IPC分类号： H01P5/08 , H01P5/18 , G01S3/02
CPC分类号： H01P5/183
摘要： A monitoring system for high-frequency circuits which minimizes the insertion loss of additional monitoring circuits while requiring only a small space. An input coupler is placed at the input of a high-frequency circuit whose frequency response is to be monitored. The input coupler has a space where a given high-frequency probing signal can propagate, and it combines this propagating signal with a given electrical input signal. The combined signal is processed by the high-frequency circuit, and the resulting signal is supplied to an output coupler. The output coupler has a space for propagation of a high-frequency probing signal component contained in the received combined signal. The output coupler extracts this propagating signal component for the purpose of monitoring.
摘要翻译：一种用于高频电路的监控系统，其最小化附加监控电路的插入损耗，同时只需要较小的空间。输入耦合器放置在要监视其频率响应的高频电路的输入端。输入耦合器具有给定的高频探测信号可以传播的空间，并且将该传播信号与给定的电输入信号组合。组合信号由高频电路处理，结果信号被提供给输出耦合器。输出耦合器具有用于传播包含在接收的组合信号中的高频探测信号分量的空间。输出耦合器提取该传播信号分量用于监视。

2. 发明申请

US20070001910A1 Antenna device, radio-wave receiver and radio-wave transmitter 有权
标题翻译：天线装置，无线电波接收机和无线电波发射机
公开(公告)号：US20070001910A1
公开(公告)日：2007-01-04
申请号：US11454197
申请日：2006-06-16
申请人： Kazunori Yamanaka , Masafumi Shigaki , Isao Nakazawa
发明人： Kazunori Yamanaka , Masafumi Shigaki , Isao Nakazawa
IPC分类号： H01Q1/38
CPC分类号： H01Q21/064 , H01Q1/364 , H01Q9/0407 , H01Q13/02 , H01Q13/06 , H01Q21/062 , H01Q21/065
摘要： An antenna device includes a plane-type antenna element, a heat insulation container for blocking heat entering from the outside, the heat insulation container having a radio-wave window allowing a radio wave to pass therethrough, and housing the plane-type antenna element, a waveguide housed in the heat insulation container and arranged between the radio-wave window and an antenna pattern formation surface of the plane-type antenna element, and cooling means for cooling the plane-type antenna element. The waveguide is shaped and dimensioned so that the directivity of the plane-type antenna element is enhanced, and a superconducting film is used for the antenna pattern of the plane-type antenna element.
摘要翻译：天线装置包括平面型天线元件，用于阻挡从外部进入的热的绝热容器，具有允许无线电波通过的无线电波窗口的隔热容器，以及容纳该平面型天线元件，容纳在隔热容器中并布置在平面型天线元件的无线电波窗口和天线图案形成表面之间的波导，以及用于冷却平面型天线元件的冷却装置。波导的形状和尺寸使得平面型天线元件的方向性增强，并且超导膜用于平面型天线元件的天线图案。

3. 发明授权

US4855895A Frequency dividing apparatus for high frequency 失效
标题翻译：高频分频装置
公开(公告)号：US4855895A
公开(公告)日：1989-08-08
申请号：US196620
申请日：1988-05-19
申请人： Masafumi Shigaki , Hiroshi Kurihara , Hidetoshi Nishi
发明人： Masafumi Shigaki , Hiroshi Kurihara , Hidetoshi Nishi
IPC分类号： H03K21/00 , H03B21/02 , H03K3/0233 , H03K3/356 , H03K23/68
CPC分类号： H03B21/02 , H03K23/68 , H03K3/0233 , H03K3/356034
摘要： A frequency dividing apparatus having an input signal terminal and a divided signal terminal, whereby a high frequency input to the input signal terminal is divided by a mixer having a first input terminal connected to the input signal terminal having a second input terminal, and having an output terminal connected to the divided signal terminal. A frequency divider is provided having a fixed frequency dividing ratio. The frequency divider has an input terminal connected to the divided signal terminal and an output terminal connected to the second input terminal of the mixer.

4. 发明授权

US4612514A Feedback amplifier 失效
标题翻译：反馈放大器
公开(公告)号：US4612514A
公开(公告)日：1986-09-16
申请号：US593428
申请日：1984-03-26
申请人： Masafumi Shigaki , Yukio Takeda
发明人： Masafumi Shigaki , Yukio Takeda
IPC分类号： H03F1/34 , H03F1/48 , H03F3/16 , H03F3/193 , H03F3/34 , H03F3/345 , H03F3/347 , H03G3/30
CPC分类号： H03F1/342 , H03F1/483 , H03F3/1935 , H03F3/345 , H03F2200/372
摘要： A feedback amplifier circuit includes an inversion circuit, a level shift circuit, and a feedback resistive element. The inversion circuit includes an input active element and a load element connected in cascade with respect to a voltage source. The level shift circuit includes a field effect transistor having a gate connected to the output of the inversion circuit, a diode or diodes, a constant current active load connected in cascade with respect to the voltage source, and the feedback resistive element is connected between the output of the level shift circuit and the input of the inversion circuit.
摘要翻译：反馈放大器电路包括反相电路，电平移位电路和反馈电阻元件。反相电路包括输入有源元件和相对于电压源级联连接的负载元件。电平移位电路包括具有连接到反相电路的输出的栅极的场效应晶体管，二极管或二极管，相对于电压源级联连接的恒流有源负载，反馈电阻元件连接在电平移位电路的输出和反相电路的输入。

5. 发明授权

US07495615B2 Antenna coupling module 有权
标题翻译：天线耦合模块
公开(公告)号：US07495615B2
公开(公告)日：2009-02-24
申请号：US10790769
申请日：2004-03-03
申请人： Kazunori Yamanaka , Isao Nakazawa , Masafumi Shigaki
发明人： Kazunori Yamanaka , Isao Nakazawa , Masafumi Shigaki
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0457 , H01Q1/364
摘要： An antenna coupling module for electromagnetically coupling a planar antenna and a planar type oxide superconductive high frequency circuit not reducing the antenna effective area and sharply reducing the signal loss due to coupling, comprised of a planar antenna and a substrate forming a planar superconductive high frequency circuit arranged in a perpendicular direction with respect to the element surface of the planar antenna and having the planar antenna and the superconductive high frequency circuit electromagnetically coupled.
摘要翻译：一种用于电磁耦合平面天线和平面型氧化物超导高频电路的天线耦合模块，其不减少天线有效面积并且显着降低由耦合引起的信号损耗，包括平面天线和形成平面超导高频电路的衬底相对于平面天线的元件表面垂直布置，并且具有平面天线和电磁耦合的超导高频电路。

6. 发明申请

US20080144287A1 MOUNTING DEVICE FOR HIGH FREQUENCY MICROWAVE DEVICES 有权
标题翻译：高频微波器件的安装设备
公开(公告)号：US20080144287A1
公开(公告)日：2008-06-19
申请号：US11873445
申请日：2007-10-17
申请人： Masafumi Shigaki , Isao Nakazawa , Kazunori Yamanaka
发明人： Masafumi Shigaki , Isao Nakazawa , Kazunori Yamanaka
IPC分类号： H05K7/20
CPC分类号： H05K1/021 , H01L23/66 , H01L25/165 , H01L2223/6627 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/1616 , H01L2924/16195 , H01L2924/16315 , H01L2924/166 , H01L2924/19032 , H05K1/0203 , H05K1/0243 , H05K1/142 , H05K1/182 , H05K3/0061 , H05K2201/0323 , H05K2201/09745 , H05K2201/10166 , H05K2201/10409
摘要： In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N/cm2 or greater owing to fastening.
摘要翻译：在用于将封装安装在外壳上的封装安装结构中，其中封装内部包含微波至毫米波段使用的高频晶体管，MIC和MMIC中的至少一个，其基极由金属和作为地面，具有优异的导热性并具有恢复性并且具有与包装的基座的尺寸相同的尺寸的导电片被放置在封装承载位置的壳体上，封装和片材通过两个或更多的螺钉，并且当由于紧固而被按压10N / cm 2以上的压力时，该片被安装在外壳上。

7. 发明申请

US20050029546A1 Mounting structure 有权
标题翻译：安装结构
公开(公告)号：US20050029546A1
公开(公告)日：2005-02-10
申请号：US10930350
申请日：2004-08-27
申请人： Masafumi Shigaki , Isao Nakazawa , Kazunori Yamanaka
发明人： Masafumi Shigaki , Isao Nakazawa , Kazunori Yamanaka
IPC分类号： H01L23/373 , H01L23/40 , H01L23/66 , H01L31/109 , H05K1/02 , H05K1/14 , H05K1/18
CPC分类号： H05K1/021 , H01L23/66 , H01L25/165 , H01L2223/6627 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/1616 , H01L2924/16195 , H01L2924/16315 , H01L2924/166 , H01L2924/19032 , H05K1/0203 , H05K1/0243 , H05K1/142 , H05K1/182 , H05K3/0061 , H05K2201/0323 , H05K2201/09745 , H05K2201/10166 , H05K2201/10409
摘要： In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N/cm2 or greater owing to fastening.
摘要翻译：在用于将封装安装在外壳上的封装安装结构中，其中封装内部包含微波至毫米波段使用的高频晶体管，MIC和MMIC中的至少一个，其基极由金属和作为地面，具有优异的导热性并具有恢复性并且具有与包装的基座的尺寸相同的尺寸的导电片被放置在封装承载位置的壳体上，封装和片材通过两个或更多的螺钉，并且当由于紧固而被压制10N / cm 2或更大的压力时，该片被安装在外壳上。

8. 发明授权

US06486734B2 Amplifier apparatus 有权
标题翻译：放大器装置
公开(公告)号：US06486734B2
公开(公告)日：2002-11-26
申请号：US09791038
申请日：2001-02-23
申请人： Keiichi Oguro , Masafumi Shigaki
发明人： Keiichi Oguro , Masafumi Shigaki
IPC分类号： H03F126
CPC分类号： H03F1/345
摘要： An amplifier apparatus including a first dividing circuit disposed at the input side of an amplifier, for dividing an input signal into a primary signal to be amplified by the amplifier and an auxiliary signal for distortion detection, a distortion compensating signal generating circuit for generating a distortion compensating signal, based on the auxiliary signal and the output of the amplifier, to compensate a distortion component contained in the output of the primary amplifier and inputting the generated signal into the amplifier, and a primary signal combining circuit for combining the primary signal obtained by the first dividing circuit 1 with the distortion compensating signal. The result is that even using an auxiliary amplifier whose gain is small or without using such auxiliary amplifier in a feedback system, the distortion component contained in the output of the amplifier can be effectively compensated.
摘要翻译：一种放大器装置，包括设置在放大器的输入侧的第一分频电路，用于将输入信号划分成放大器放大的主信号和用于失真检测的辅助信号;失真补偿信号产生电路，用于产生失真补偿信号，基于辅助信号和放大器的输出，以补偿包含在主放大器的输出中的失真分量并将生成的信号输入到放大器中;以及主信号组合电路，用于组合由具有失真补偿信号的第一分频电路1。结果是，即使使用增益小的辅助放大器或者在反馈系统中不使用这种辅助放大器，可以有效地补偿放大器的输出中包含的失真分量。

9. 发明授权

US06377118B1 Linearizer for power amplifier 有权
标题翻译：功率放大器线性化器
公开(公告)号：US06377118B1
公开(公告)日：2002-04-23
申请号：US09385721
申请日：1999-08-30
申请人： Masafumi Shigaki , Takao Sasaki
发明人： Masafumi Shigaki , Takao Sasaki
IPC分类号： H03F126
CPC分类号： H03F1/3276
摘要： A linearizer includes an input terminal, an output terminal, and a field-effect transistor having a gate connected to the input terminal, a drain connected to the output terminal and a source grounded. A supply voltage is supplied through a load circuit to the drain of the transistor. A gate voltage is supplied through a bias line to the gate of the transistor. The transistor is biased at a bias point at which a drain current of the transistor in response to the gate voltage is in an unsaturated region.
摘要翻译：线性化器包括输入端子，输出端子和具有连接到输入端子的栅极的场效应晶体管，连接到输出端子的漏极和源极接地。电源电压通过负载电路提供给晶体管的漏极。栅极电压通过偏置线提供给晶体管的栅极。晶体管偏置在晶体管的漏极电流响应于栅极电压处于不饱和区域的偏置点处。

10. 发明授权

US07729129B2 Mounting device for high frequency microwave devices 有权
标题翻译：高频微波器件的安装装置
公开(公告)号：US07729129B2
公开(公告)日：2010-06-01
申请号：US11873445
申请日：2007-10-17
申请人： Masafumi Shigaki , Isao Nakazawa , Kazunori Yamanaka
发明人： Masafumi Shigaki , Isao Nakazawa , Kazunori Yamanaka
IPC分类号： H05K9/00
CPC分类号： H05K1/021 , H01L23/66 , H01L25/165 , H01L2223/6627 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/1616 , H01L2924/16195 , H01L2924/16315 , H01L2924/166 , H01L2924/19032 , H05K1/0203 , H05K1/0243 , H05K1/142 , H05K1/182 , H05K3/0061 , H05K2201/0323 , H05K2201/09745 , H05K2201/10166 , H05K2201/10409
摘要： In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N/cm2 or greater owing to fastening.
摘要翻译：在用于将封装安装在外壳上的封装安装结构中，其中封装内部包含微波至毫米波段中使用的高频晶体管，MIC和MMIC中的至少一个，其基极由金属和作为地面，具有优异的导热性并具有恢复性并且具有与包装的基座的尺寸相同的尺寸的导电片被放置在封装承载位置的壳体上，封装和片材通过两个或更多的螺钉，并且当由于紧固而以10N / cm 2或更大的压力按压时，该片被安装在外壳上。

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