会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • Thermoplastic Polyolefin Blends
    • 热塑性聚烯烃共混物
    • US20110136982A1
    • 2011-06-09
    • US13027896
    • 2011-02-15
    • Mun F. TsePeijun Jiang
    • Mun F. TsePeijun Jiang
    • C08L23/08C08J3/00
    • C08L23/06C08L23/04C08L23/08C08L23/0807C08L23/0815C08L2205/02C08L2205/03C08L2314/06C08L2666/02C08L2666/06
    • This invention relates to a blend composition comprising: 1) a linear ethylene containing polymer, such as a LLDPE, a HDPE or the like; and at least 1 weight percent of an in-reactor polymer blend comprising: (a) a first ethylene containing polymer having a density of greater than 0.90 g/cm3 and a Mw of more than 20,000 g/mol; and (b) a second ethylene containing polymer having a density of less than 0.90 g/cm3, wherein the polymer blend has a Tm of at least 90° C. (DSC second melt), a density of less than 0.92 g/cm3, and the densities of the first and second polymers differ by at least 1%. Alternately the in-reactor polymer blend comprises: (a) a first ethylene polymer comprising 90 wt % to 100 wt % ethylene and from 0 wt % to less than 10 wt % comonomer, said first ethylene polymer component having density of greater than 0.920 g/cm3, an Mw of 20,000 g/mol or more; and (b) a second ethylene polymer comprising from 70 wt % to 90 wt % ethylene and 30 wt % to 10 wt % comonomer, said second ethylene polymer having a density of 0.910 g/cm3 or less, wherein the in-reactor polymer blend has one or more of the following characteristics: (a) at least 78 wt % ethylene; (b) a Tm of at least 100° C. over a density ranging from 0.84 to 0.92 g/cm3; (c) a elongation at break of 300% or more; (d) a strain hardening ratio M300/M100 of at least 1.2; (e) a ratio of complex viscosity at 0.01 rad/s to the complex viscosity at 100 rad/s of at least 30; and (f) a shear thinning index of less than −0.2.
    • 本发明涉及一种共混组合物,其包含:1)含线性乙烯的聚合物,例如LLDPE,HDPE等; 和至少1重量%的反应器内聚合物共混物,其包含:(a)密度大于0.90g / cm 3和Mw大于20,000g / mol的第一含乙烯聚合物; 和(b)密度小于0.90g / cm 3的第二含乙烯聚合物,其中聚合物共混物具有至少90℃的Tm(DSC第二熔体),小于0.92g / cm 3的密度, 并且第一和第二聚合物的密度相差至少1%。 或者,反应器内聚合物共混物包含:(a)包含90重量%至100重量%乙烯和0重量%至小于10重量%共聚单体的第一乙烯聚合物,所述第一乙烯聚合物组分的密度大于0.920g / cm3,Mw为20,000g / mol以上; 和(b)包含70重量%至90重量%乙烯和30重量%至10重量%共聚单体的第二乙烯聚合物,所述第二乙烯聚合物的密度为0.910g / cm 3或更小,其中反应器内聚合物共混物 具有以下一个或多个特征:(a)至少78重量%的乙烯; (b)在0.84至0.92g / cm 3的密度范围内至少100℃的Tm; (c)断裂伸长率在300%以上; (d)应变硬化率M300 / M100为至少1.2; (e)在0.01rad / s下的复数粘度与100rad / s下的复数粘度的比至少为30; 和(f)小于-0.2的剪切稀化指数。
    • 5. 发明授权
    • Hot melt adhesive of ethylene/unsaturated acid copolymer and epoxy
crosslinker
    • 乙烯/不饱和酸共聚物和环氧交联剂热熔胶
    • US5095046A
    • 1992-03-10
    • US475596
    • 1990-02-06
    • Mun F. Tse
    • Mun F. Tse
    • C09J123/08C09J123/26
    • C09J123/26C09J123/08Y10S525/936
    • A heat curable hot melt adhesive system is disclosed. The system uses an epoxy-crosslinking ethylene polymer component, a tackifier compatible therewith and an epoxy crosslinking agent having an epoxide functionality of at least 2. The ethylene polymer component may be either an ethylene copolymer of an .alpha.,.beta.-ethylenically unsaturated carboxylic acid, or an ethylene copolymer of an ethylenically unsaturated alcohol used in combination with a dicarboxylic acid anhydride. The dicarboxylic acid anhydride and/or the epoxy can be encapsulated to inhibit premature crosslinking. The formulation is applied to a substrate surface as a hot melt at a moderate temperature, and subsequently cured by heating the adhesive composition to a higher curing temperature.
    • 公开了一种可热固化的热熔粘合剂体系。 该系统使用环氧交联乙烯聚合物组分,与其相容的增粘剂和具有至少2的环氧官能度的环氧交联剂。乙烯聚合物组分可以是α,β-烯键式不饱和羧酸的乙烯共聚物, 或与二羧酸酐组合使用的烯属不饱和醇的乙烯共聚物。 二羧酸酐和/或环氧树脂可以被包封以抑制过早交联。 将配方在中等温度下作为热熔体施用于基材表面,然后通过将粘合剂组合物加热至更高的固化温度而固化。
    • 7. 发明授权
    • Water-curable, hot melt adhesive composition
    • 水可固化,热熔胶组合物
    • US5331049A
    • 1994-07-19
    • US542235
    • 1990-06-22
    • Jay D. AudettMun F. Tse
    • Jay D. AudettMun F. Tse
    • C09J143/04C09J151/06C08G81/02
    • C09J151/06C09J143/04Y10T156/10
    • A water-curable hot melt adhesive system is disclosed. The system uses silane hydrolyzable functionality grafted onto an ethylene polymer component, and a tackifier compatible therewith. The ethylene polymer component is a copolymer of ethylene and a hydrocarbyl ester of an .alpha.,.beta.-ethylenically unsaturated carboxylic acid, and the tackifier component provides the adhesive with sufficient silanol condensation catalytic activity to accelerate water curing. The formulation is applied to a substrate surface as a hot melt at a moderate temperature, and subsequently cured by moisture or in a warm water bath. The invention also embodies structural compositions having glass, metallic or leather surfaces adhered with the adhesive and a method for making structural composites.
    • 公开了一种水可固化热熔粘合剂体系。 该系统使用接枝到乙烯聚合物组分上的硅烷可水解官能团和与其相容的增粘剂。 乙烯聚合物组分是乙烯和α,β-烯键式不饱和羧酸的烃基酯的共聚物,并且增粘剂组分为粘合剂提供足够的硅烷醇缩合催化活性以加速水固化。 该配方在中等温度下作为热熔体施用于基材表面,随后通过水分或在温水浴中固化。 本发明还体现了具有粘合剂的玻璃,金属或皮革表面的结构组合物以及制备结构复合材料的方法。
    • 8. 发明授权
    • Blends of ethylene copolymers for hot melt adhesives
    • 乙烯共聚物用于热熔粘合剂的共混物
    • US5548014A
    • 1996-08-20
    • US406832
    • 1995-03-20
    • Mun F. TseVirginia R. CrossBarry C. Trudell
    • Mun F. TseVirginia R. CrossBarry C. Trudell
    • C09J123/04C09J123/08C09J123/20
    • C09J123/04C09J123/0815
    • Disclosed are hot melt adhesives comprising tackifier and a high M.sub.w, narrow MWD, narrow CD ethylene/alpha-olefin copolymer(s) and a low M.sub.w, narrow MWD, narrow MWD ethylene/alpha-olefin copolymer prepared with either supported or unsupported cyclopentadienyl derivatives of Group IV and catalysts for applications in hot melt adhesives, particularly in automotive product assembly, packaging and food packaging. These ethylene copolymers have a M.sub.w ranging from about 20,000 to about 100,000, an MWD of less than 6 and 3 to 17 mole percent comonomer, and composition distribution breadth index above 70 percent. These ethylene copolymer blends have a M.sub.w ranging from about 20,000 to about 100,000 and an MWD of less than 6. In addition, the copolymer blends have comonomer mole percent ranging from about 3 to about 17.
    • 公开了包含增粘剂和高Mw,窄MWD,窄CD乙烯/α-烯烃共聚物和低Mw,窄MWD,窄MWD乙烯/α-烯烃共聚物的热熔粘合剂,其用负载或未负载的环戊二烯基衍生物 的第IV族和用于热熔粘合剂的催化剂,特别是在汽车产品组装,包装和食品包装中。 这些乙烯共聚物的Mw为约20,000至约100,000,MWD小于6和3至17摩尔%的共聚单体,组成分布宽度指数高于70%。 这些乙烯共聚物共混物的Mw为约20,000至约100,000,MWD小于6.另外,共聚物共混物的共聚单体摩尔百分数范围为约3至约17。