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    • 2. 发明授权
    • Nonvolatile semiconductor storage device
    • 非易失性半导体存储器件
    • US08723248B2
    • 2014-05-13
    • US13404073
    • 2012-02-24
    • Naoki YasudaJun Fujiki
    • Naoki YasudaJun Fujiki
    • H01L21/28H01L27/115H01L29/66H01L29/788H01L29/792
    • H01L21/28282H01L27/1157H01L29/66833H01L29/792
    • In one embodiment, there is provided a nonvolatile semiconductor storage device. The device includes: a plurality of nonvolatile memory cells. Each of the nonvolatile memory cells includes: a first semiconductor layer including a first source region, a first drain region, and a first channel region; a block insulating film formed on the first channel region; a charge storage layer formed on the block insulating film; a tunnel insulating film formed on the charge storage layer; a second semiconductor layer formed on the tunnel insulating film and including a second source region, a second drain region, and a second channel region. The second channel region is formed on the tunnel insulating film such that the tunnel insulating film is located between the second source region and the second drain region. A dopant impurity concentration of the first channel region is higher than that of the second channel region.
    • 在一个实施例中,提供了一种非易失性半导体存储装置。 该装置包括:多个非易失性存储单元。 每个非易失性存储单元包括:第一半导体层,包括第一源极区,第一漏极区和第一沟道区; 形成在所述第一沟道区上的块绝缘膜; 形成在所述块绝缘膜上的电荷存储层; 形成在电荷存储层上的隧道绝缘膜; 形成在所述隧道绝缘膜上并且包括第二源极区域,第二漏极区域和第二沟道区域的第二半导体层。 第二沟道区形成在隧道绝缘膜上,使得隧道绝缘膜位于第二源区和第二漏区之间。 第一沟道区的掺杂剂杂质浓度高于第二沟道区的掺杂剂杂质浓度。
    • 5. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20130234222A1
    • 2013-09-12
    • US13598748
    • 2012-08-30
    • Naoki YASUDAMasaaki HiguchiKatsuyuki SekineMasao Shingu
    • Naoki YASUDAMasaaki HiguchiKatsuyuki SekineMasao Shingu
    • H01L29/78
    • H01L27/11582G11C16/0483
    • A semiconductor memory device includes a substrate, a structure body, a semiconductor layer, and a memory film. The memory film is provided between the semiconductor layer and the plurality of electrode films. The memory film includes a charge storage film, a block film, and a tunnel film. The block film is provided between the charge storage film and the plurality of electrode films. The tunnel film is provided between the charge storage film and the semiconductor layer. The tunnel film includes a first film containing silicon oxide, a second film containing silicon oxide, and a third film provided between the first film and the second film and containing silicon oxynitride. When a composition of the silicon oxynitride contained in the third film is expressed by a ratio x of silicon oxide and a ratio (1−x) of silicon nitride, 0.5≦x
    • 半导体存储器件包括衬底,结构体,半导体层和存储膜。 存储膜设置在半导体层和多个电极膜之间。 存储膜包括电荷存储膜,块膜和隧道膜。 阻挡膜设置在电荷存储膜和多个电极膜之间。 隧道膜设置在电荷存储膜和半导体层之间。 隧道膜包括含有氧化硅的第一膜,含有氧化硅的第二膜和设置在第一膜和第二膜之间并含有氮氧化硅的第三膜。 当第三膜中所含的氮氧化硅的组成由氧化硅的比率x和氮化硅的比例(1-x)表示时,0.5×x≤1。
    • 8. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 非易失性半导体存储器件及其制造方法
    • US20130087845A1
    • 2013-04-11
    • US13428185
    • 2012-03-23
    • Naoki YASUDA
    • Naoki YASUDA
    • H01L29/792H01L21/20
    • H01L27/11582H01L21/28282H01L29/7926
    • According to one embodiment, a method of manufacturing a nonvolatile semiconductor memory device is provided. In the method, a conductive film serving as a control gate is formed above a substrate. A hole extending through the conductive film from its upper surface to its lower surface is formed. A block insulating film, a charge storage layer, a tunnel insulating film, and a semiconductor layer are formed on the inner surface of the hole. A film containing a material having an oxygen dissociation catalytic action is formed on the semiconductor layer not to fill the hole. The interface between the tunnel insulating film and the semiconductor layer is oxidized through the film from the inside of the hole.
    • 根据一个实施例,提供一种制造非易失性半导体存储器件的方法。 在该方法中,在基板上形成用作控制栅极的导电膜。 形成从其上表面到其下表面延伸穿过导电膜的孔。 在孔的内表面上形成块绝缘膜,电荷存储层,隧道绝缘膜和半导体层。 在不填充孔的半导体层上形成含有具有氧解离催化作用的材料的膜。 隧道绝缘膜与半导体层之间的界面从孔的内部通过膜氧化。