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    • 2. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20120319077A1
    • 2012-12-20
    • US13560557
    • 2012-07-27
    • Naoki YASUDADaisuke MATSUSHITAKoichi MURAOKA
    • Naoki YASUDADaisuke MATSUSHITAKoichi MURAOKA
    • H01L47/00
    • H01L27/101H01L27/1021H01L27/2418H01L27/2481
    • According to one embodiment, a nonvolatile semiconductor memory device includes a plurality of first interconnections arranged parallel, a plurality of second interconnections arranged parallel to intersect the first interconnections, and memory cell portions respectively arranged at intersecting portions between the first and second interconnections and each configured by laminating a variable-resistance element and a diode element. The diode element has a laminated structure having a first insulating film, a conductive fine grain layer and a second insulating film. The physical film thickness of the second insulating film is greater than the first insulating film and the dielectric constant of the second insulating film is greater than the first insulating film.
    • 根据一个实施例,非易失性半导体存储器件包括平行布置的多个第一互连,并行布置成与第一互连相交的多个第二互连,以及分别布置在第一和第二互连之间的相交部分处的每个配置的存储单元部分 通过层叠可变电阻元件和二极管元件。 二极管元件具有具有第一绝缘膜,导电细晶粒层和第二绝缘膜的层叠结构。 第二绝缘膜的物理膜厚度大于第一绝缘膜,并且第二绝缘膜的介电常数大于第一绝缘膜。
    • 7. 发明授权
    • NAND-type nonvolatile semiconductor memory device
    • NAND型非易失性半导体存储器件
    • US07999303B2
    • 2011-08-16
    • US12353586
    • 2009-01-14
    • Shoko KikuchiYasushi NakasakiKoichi Muraoka
    • Shoko KikuchiYasushi NakasakiKoichi Muraoka
    • H01L29/788
    • H01L27/11568H01L21/28282H01L29/513H01L29/517H01L29/78
    • The present invention provides a high-performance MONOS-type NAND-type nonvolatile semiconductor memory device using an aluminum oxide film as a part of gate insulating film in a select transistor and as a block insulating film in a memory transistor. The NAND-type nonvolatile semiconductor memory device has, on a semiconductor substrate, a plurality of memory cell transistors connected to each other in series and a select transistor. The memory cell transistor includes a first insulating film on the semiconductor substrate, a charge trapping layer, a second insulating film made of aluminum oxide,a first control gate electrode, and a first source/drain region. The select transistor includes a third insulating film on the semiconductor substrate, a fourth insulating film made of an aluminum oxide containing at least one of a tetravalent cationic element, a pentavalent cationic element, and N (nitrogen), a second control gate electrode, and a second source/drain region.
    • 本发明提供一种在选择晶体管中使用氧化铝膜作为栅绝缘膜的一部分的高性能MONOS型NAND型非易失性半导体存储器件,并且作为存储晶体管中的块绝缘膜。 NAND型非易失性半导体存储器件在半导体衬底上具有串联连接的多个存储单元晶体管和选择晶体管。 存储单元晶体管包括半导体衬底上的第一绝缘膜,电荷俘获层,由氧化铝制成的第二绝缘膜,第一控制栅极电极和第一源极/漏极区域。 选择晶体管包括半导体衬底上的第三绝缘膜,由包含四价阳离子元素,五价阳离子元素和N(氮)中的至少一种的氧化铝制成的第四绝缘膜,第二控制栅电极和 第二源极/漏极区域。