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1. 发明授权

US09433542B2 Absorbent article and production method thereof 有权
标题翻译：吸收性物品及其制造方法
公开(公告)号：US09433542B2
公开(公告)日：2016-09-06
申请号：US14002762
申请日：2012-02-27
申请人： Nobuyuki Kato , Tatsuya Tamura , Toshihisa Hayashi , Masashi Kitagawa
发明人： Nobuyuki Kato , Tatsuya Tamura , Toshihisa Hayashi , Masashi Kitagawa
IPC分类号： A61F13/475 , A61F13/533 , A61F13/537 , A61F13/15 , A61F13/535 , A61F13/539 , A61F13/47
CPC分类号： A61F13/537 , A61F13/15617 , A61F13/15731 , A61F13/4704 , A61F13/4756 , A61F13/535 , A61F13/539 , Y10T156/1041
摘要： The absorbent article of the present invention comprises: a liquid-pervious surface sheet, a liquid-impervious backside sheet provided at the position opposing said surface sheet, and an absorption body provided between said surface sheet and said backside sheet, wherein the absorbent article comprises an endless compressed groove, surrounding a central part of said absorbent article, which is formed in said surface sheet and said absorption body in the thickness direction, and a plurality of concave parts, provided inside and outside said compressed groove, which are formed in said surface sheet and said absorption body in the thickness direction, and an uncompressed region bordering inner and outer edges of the compressed groove, wherein the closest distance between said compressed groove and the nearest concave parts is greater than the distance between adjacent ones of those same concave parts.
摘要翻译：本发明的吸收性物品包括：透液性表面片，设置在与所述表面片相对的位置处的不透液性背面片，以及设置在所述表面片和所述背面片之间的吸收体，其中，所述吸收性物品包含围绕形成在所述表面片和所述吸收体的厚度方向的所述吸收性物品的中心部分的无端压缩槽，以及设置在所述压缩槽的内部和外部的多个凹部，表面片和所述吸收体在厚度方向上，以及与所述压缩槽的内边缘和外边缘接合的未压缩区域，其中所述压缩槽和最近的凹入部分之间的最近距离大于相邻的相同凹部部分。

2. 发明授权

US08684712B2 Oil pump for a vehicle 失效
标题翻译：车用油泵
公开(公告)号：US08684712B2
公开(公告)日：2014-04-01
申请号：US12776456
申请日：2010-05-10
申请人： Hiroyasu Honda , Hideki Miyata , Nobuyuki Kato
发明人： Hiroyasu Honda , Hideki Miyata , Nobuyuki Kato
IPC分类号： F01C1/02 , F03C2/00
CPC分类号： F04C2/102 , F04C2/084 , F04C2240/50 , F05C2225/00
摘要： A plurality of convex portions that protrude radially outward from a plurality of positions separated in the circumferential direction are provided on the outer peripheral surface of a driven gear. Each convex portion has, in the circumferential direction of the driven gear, a rising surface that rises from a minimum diameter position to a maximum diameter position in the direction opposite the rotational direction of the driven gear, and a falling surface that falls from that maximum diameter position to a minimum diameter position that is adjacent to and in back of that maximum diameter position with respect to the rotational direction of the driven gear. The circumferential length of the falling surface is greater than the circumferential length of the rising surface.
摘要翻译：在从动齿轮的外周面设置有从圆周方向分离的多个位置向径向外侧突出的多个凸部。每个凸部在从动齿轮的圆周方向上具有从与从动齿轮的旋转方向相反的方向从最小直径位置升高到最大直径位置的上升面，以及从该最大直径位置落下的下降面直径位置相对于从动齿轮的旋转方向相邻于该最大直径位置的最小直径位置。落下面的圆周长度大于上升面的圆周长度。

3. 发明申请

US20130317470A1 ABSORBENT ARTICLE PACKAGE AND METHOD OF FOLDING THE SAME 有权
标题翻译：吸收性物品包装及其折叠方法
公开(公告)号：US20130317470A1
公开(公告)日：2013-11-28
申请号：US13976233
申请日：2011-12-27
申请人： Nobuyuki Kato , Masahiro Kashiwagi , Tatsuya Tamura , Masashi Kitagawa
发明人： Nobuyuki Kato , Masahiro Kashiwagi , Tatsuya Tamura , Masashi Kitagawa
IPC分类号： A61F13/551 , A61F13/15
CPC分类号： A61F13/5514 , A61F13/15577 , A61F13/15747
摘要： An absorbent article package is individually packaged by folding a packaging sheet and an absorbent article in a state where the absorbent article is arranged on the packaging sheet. In a state where the individually-packaged absorbent article is opened, in the packaging sheet and the absorbent article, a first folding line based on which the absorbent article and the packaging sheet are folded towards the topsheet side, and a second folding line based on which the absorbent article and the packaging sheet are folded towards the backsheet side are formed adjacent to each other in the longitudinal direction.
摘要翻译：通过在吸收性物品配置在包装片上的状态下折叠包装片和吸收性物品，分别包装吸收性物品包装。在打开单独包装的吸收性物品的状态下，在包装用片材和吸收性物品中，将吸收性物品和包装用片材朝向顶片侧折叠的第一折叠线和基于所述吸收性物品和所述包装用薄片朝向所述背面侧折叠而形成为在长度方向上彼此相邻地形成。

4. 发明申请

US20110129868A1 CELL CAPABLE OF REPLICATING NOVEL HCV REPLICON, CELL CAPABLE OF REPLICATING FULL-LENGTH HCV RNA, AND USE OF THOSE CELLS 审中-公开
标题翻译：更换新HCV复制细胞的细胞，更换全长HCV RNA的细胞和这些细胞的使用
公开(公告)号：US20110129868A1
公开(公告)日：2011-06-02
申请号：US13054905
申请日：2009-09-01
申请人： Nobuyuki Kato , Masanori Ikeda
发明人： Nobuyuki Kato , Masanori Ikeda
IPC分类号： C12Q1/02 , C12N15/87 , C12N5/071 , C12N7/00
CPC分类号： G01N33/5008 , A61K31/00 , C07K14/005 , C12N7/00 , C12N15/86 , C12N2770/24222 , C12N2770/24243 , C12N2770/24252 , G01N2333/186
摘要： According to the present invention, an HCV replicon-replicating cell is produced by a production method including a step of introducing RNA containing an HCV replicon sequence and a selectable marker gene sequence into a Li23 cell or a cured cell derived from a Li23 cell. Further, a full-length HCV RNA-replicating cell is produced by a production method including a step of introducing RNA containing a full-length HCV genome sequence and a selectable marker gene sequence into a Li23 cell or a cured cell derived from a Li23 cell. The use of these cells enables the construction of an HCV life cycle reproduction system that is derived from a cell line other than the HuH-7 cell line and that has capabilities equivalent to those of an HCV life cycle reproduction system derived from the HuH-7 cell line.
摘要翻译：根据本发明，通过包括将含有HCV复制子序列和选择标记基因序列的RNA引入到Li23细胞或来自Li23细胞的固化细胞的步骤的制备方法制备HCV复制子复制细胞。此外，通过包括将含有全长HCV基因组序列和选择性标记基因序列的RNA引入到Li23细胞或源自Li23细胞的固化细胞的步骤的制备方法制备全长HCV RNA复制细胞。这些细胞的使用使得能够构建来自除了HuH-7细胞系之外的细胞系的HCV生命周期再生系统，并且具有与源自HuH-7的HCV生命周期再生系统相当的能力细胞系。

5. 发明申请

US20100290941A1 OIL PUMP FOR A VEHICLE 失效
标题翻译：油泵油
公开(公告)号：US20100290941A1
公开(公告)日：2010-11-18
申请号：US12776456
申请日：2010-05-10
申请人： Hiroyasu HONDA , Hideki Miyata , Nobuyuki Kato
发明人： Hiroyasu HONDA , Hideki Miyata , Nobuyuki Kato
IPC分类号： F01C1/18
CPC分类号： F04C2/102 , F04C2/084 , F04C2240/50 , F05C2225/00
摘要： A plurality of convex portions that protrude radially outward from a plurality of positions separated in the circumferential direction are provided on the outer peripheral surface of a driven gear. Each convex portion has, in the circumferential direction of the driven gear, a rising surface that rises from a minimum diameter position to a maximum diameter position in the direction opposite the rotational direction of the driven gear, and a falling surface that falls from that maximum diameter position to a minimum diameter position that is adjacent to and in back of that maximum diameter position with respect to the rotational direction of the driven gear. The circumferential length of the falling surface is greater than the circumferential length of the rising surface.
摘要翻译：在从动齿轮的外周面设置有从圆周方向分离的多个位置向径向外侧突出的多个凸部。每个凸部在从动齿轮的圆周方向上具有从与从动齿轮的旋转方向相反的方向从最小直径位置升高到最大直径位置的上升面，以及从该最大直径位置落下的下降面直径位置相对于从动齿轮的旋转方向相邻于该最大直径位置的最小直径位置。落下面的圆周长度大于上升面的圆周长度。

6. 发明申请

US20070158850A1 Method for manufacturing mold type semiconductor device 有权
标题翻译：模具型半导体器件的制造方法
公开(公告)号：US20070158850A1
公开(公告)日：2007-07-12
申请号：US11702498
申请日：2007-02-06
申请人： Naohiko Hirano , Nobuyuki Kato , Takanori Teshima , Yoshitsugu Sakamoto , Shoji Miura , Akihiro Niimi
发明人： Naohiko Hirano , Nobuyuki Kato , Takanori Teshima , Yoshitsugu Sakamoto , Shoji Miura , Akihiro Niimi
IPC分类号： H01L23/48
CPC分类号： H01L24/33 , H01L23/482 , H01L23/485 , H01L23/488 , H01L24/32 , H01L24/48 , H01L2224/05599 , H01L2224/291 , H01L2224/29111 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/04941 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/3025 , H01L2924/351 , H01L2924/01014 , H01L2924/01028 , H01L2924/3512 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.
摘要翻译：一种模具型半导体器件，包括：包括半导体部件的半导体芯片; 金属层; 焊料层; 以及通过金属层和焊料层连接到半导体芯片的金属构件。焊料层由屈服应力小于金属层的焊料制成。即使当用树脂模具密封半导体芯片时，也防止金属层开裂。

7. 发明授权

US07193326B2 Mold type semiconductor device 有权
标题翻译：模具型半导体器件
公开(公告)号：US07193326B2
公开(公告)日：2007-03-20
申请号：US10859130
申请日：2004-06-03
申请人： Naohiko Hirano , Nobuyuki Kato , Takanori Teshima , Yoshitsugu Sakamoto , Shoji Miura , Akihiro Niimi
发明人： Naohiko Hirano , Nobuyuki Kato , Takanori Teshima , Yoshitsugu Sakamoto , Shoji Miura , Akihiro Niimi
IPC分类号： H01L23/48
CPC分类号： H01L24/33 , H01L23/482 , H01L23/485 , H01L23/488 , H01L24/32 , H01L24/48 , H01L2224/05599 , H01L2224/291 , H01L2224/29111 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/04941 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/3025 , H01L2924/351 , H01L2924/01014 , H01L2924/01028 , H01L2924/3512 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.
摘要翻译：一种模具型半导体器件，包括：包括半导体部件的半导体芯片; 金属层; 焊料层; 以及通过金属层和焊料层连接到半导体芯片的金属构件。焊料层由屈服应力小于金属层的焊料制成。即使当用树脂模具密封半导体芯片时，也防止金属层开裂。

8. 发明申请

US20060055056A1 Semiconductor equipment having a pair of heat radiation plates 审中-公开
标题翻译：具有一对散热板的半导体设备
公开(公告)号：US20060055056A1
公开(公告)日：2006-03-16
申请号：US10991490
申请日：2004-11-19
申请人： Shoji Miura , Yoshihiko Ozeki , Yoshimi Nakase , Nobuyuki Kato , Tetsuji Kondou , Takanori Teshima , Naoki Hirasawa
发明人： Shoji Miura , Yoshihiko Ozeki , Yoshimi Nakase , Nobuyuki Kato , Tetsuji Kondou , Takanori Teshima , Naoki Hirasawa
IPC分类号： H01L23/48
CPC分类号： H01L24/05 , H01L23/34 , H01L23/4334 , H01L23/4824 , H01L23/492 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/04042 , H01L2224/05556 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48247 , H01L2224/4847 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19043 , H01L2924/2076 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： Semiconductor equipment includes: a semiconductor device; a pair of upper and lower heat radiation plates; and a heat radiation block. The heat radiation block has a planar shape, which is smaller than a planer shape of the semiconductor device. The semiconductor device includes a heat generation portion facing the heat radiation block. The heat generation portion has a periphery edge, which is determined such that a distance between the periphery edge of the heat generation portion and a periphery edge of the heat radiation block is equal to or shorter than 1.0 mm.
摘要翻译：半导体设备包括：半导体器件; 一对上下热辐射板; 和散热块。散热块的平面形状小于半导体器件的平面形状。半导体器件包括面向散热块的发热部。发热部具有外围边缘，其被确定为使得发热部分的周边边缘与散热块的周缘之间的距离等于或小于1.0mm。

9. 发明申请

US20050077617A1 Semiconductor device having heat radiation plate and bonding member 有权
标题翻译：具有散热板和接合构件的半导体装置
公开(公告)号：US20050077617A1
公开(公告)日：2005-04-14
申请号：US10895947
申请日：2004-07-22
申请人： Naohiko Hirano , Nobuyuki Kato , Kuniaki Mamitsu , Yoshimi Nakase
发明人： Naohiko Hirano , Nobuyuki Kato , Kuniaki Mamitsu , Yoshimi Nakase
IPC分类号： H01L21/60 , H01L23/00 , H01L23/36 , H01L23/42 , H01L23/433 , H01L23/492 , H01L23/58
CPC分类号： H01L23/492 , H01L23/4334 , H01L23/562 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2224/83801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/15724 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , H01L2924/19043 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/01051 , H01L2924/3512 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要： A semiconductor device includes a heat generation element; a bonding member; first and second heat radiation plates disposed on first and second sides of the heat generation element through the bonding member; a heat radiation block disposed between the first heat radiation plate and the heat generation element through the bonding member; and a resin mold. The heat radiation block has a thickness in a range between 0.5 mm and 1.5 mm. The semiconductor device has high reliability of the bonding member.
摘要翻译：半导体器件包括发热元件; 接合部件; 第一和第二散热板，其通过接合构件设置在发热体的第一和第二侧上; 散热块，其通过所述接合构件设置在所述第一散热板和所述发热体之间; 和树脂模具。散热块的厚度在0.5mm至1.5mm的范围内。半导体器件具有高粘合部件的可靠性。

10. 发明授权

US6090334A Heat-resistance pressure-resistance and self standing container and method of producing thereof 失效
标题翻译：耐热耐压性和自立式容器及其制造方法
公开(公告)号：US6090334A
公开(公告)日：2000-07-18
申请号：US218145
申请日：1998-07-14
申请人： Kenji Matsuno , Nobuyuki Kato , Hiroo Ikegami , Setsuko Nakamaki , Kimio Takeuchi , Hotaka Fukabori , Yoshitsugu Maruhashi , Hideo Kurashima
发明人： Kenji Matsuno , Nobuyuki Kato , Hiroo Ikegami , Setsuko Nakamaki , Kimio Takeuchi , Hotaka Fukabori , Yoshitsugu Maruhashi , Hideo Kurashima
IPC分类号： B29C35/08 , B29C49/06 , B29C49/08 , B29C49/12 , B29C49/18 , B29C49/64 , B29C49/66 , B29C61/02 , B29K105/00 , B29L22/00 , B65D1/02
CPC分类号： B65D1/0284 , B29C49/12 , B29C49/18 , B29C49/649 , B65D1/0207 , B29B2911/14693 , B29B2911/147 , B29B2911/14713 , B29B2911/14906 , B29B2911/14933 , B29C2035/0822 , B29C2049/1219 , B29C49/06 , B29C49/66 , B29C61/02 , B29K2995/004 , B29L2031/7158 , Y10S264/906
摘要： A container obtained by biaxially stretch-blow-molding a resin. Except the mouth-and-neck portion, vicinities thereof and the center of the bottom portion, the container as a whole is reduced in thickness under a highly drawing condition without accompanied by whitening, and a portion constituting the bottom valley portions has an yielding load of not smaller than 25 kg/cm at 70.degree. C. The container exhibits excellent heat resistance, pressure resistance, shock resistance as well as self-standing ability.
摘要翻译：通过双轴拉伸吹塑树脂获得的容器。除了口颈部，其附近和底部的中心之外，容器整体在高拉伸条件下的厚度减小，而不伴随着白化，构成底部谷部的部分具有屈服载荷在70℃下不小于25kg / cm 2。容器表现出优异的耐热性，耐压性，抗冲击性以及自立能力。

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