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1. 发明授权

US11408589B2 Monolithic multi-focus light source device 有权
公开(公告)号：US11408589B2
公开(公告)日：2022-08-09
申请号：US16704280
申请日：2019-12-05
申请人： Optiz, Inc.
发明人： Vage Oganesian
IPC分类号： H01L23/538 , H01L23/13 , F21V5/04 , H01L33/62 , H01L23/14 , H01L23/498 , H01L25/075 , F21V19/00 , F21V7/28 , F21V5/00 , H01L21/48 , H01L33/48 , F21V9/04 , F21V13/14 , F21Y105/12 , F21Y115/10
摘要： A light source device that includes a light device assembly and a monolithic lens. The light device assembly includes a first substrate with opposing top and bottom surfaces and a plurality of cavities formed into the top surface, a plurality of light source chips each disposed at least partially in one of the plurality of cavities and each including a light emitting device and electrical contacts, and a plurality of electrodes each extending between the top and bottom surfaces and each electrically connected to one of the electrical contacts. The monolithic lens is disposed over the top surface of the first substrate, and includes a unitary substrate with a plurality of lens segments each disposed over one of the light source chips.

2. 发明授权

US09996725B2 Under screen sensor assembly 有权
公开(公告)号：US09996725B2
公开(公告)日：2018-06-12
申请号：US15343141
申请日：2016-11-03
申请人： Optiz, Inc.
发明人： Vage Oganesian
IPC分类号： G06K9/00
CPC分类号： G06K9/00053
摘要： A sensor assembly that includes a silicon substrate and a sensor integrally formed on or in its top surface. Bond pads are formed at the substrate top surface and electrically coupled to the sensor. A trench is formed into the top surface, extending toward but not reaching the substrate's bottom surface. Conductive first traces each extend from one of the bond pads and down into the trench. One or more holes are formed into the bottom surface of the substrate and extend toward but do not reach the top surface. The one or more holes terminate at the bottom of the trench in a manner exposing the conductive first traces. Conductive second traces each extend from one of the conductive first traces at the bottom of the trench, along a sidewall of the one or more holes, and along the bottom surface of the silicon substrate.

3. 发明申请

US20170222065A1 Method Of Forming A Wire Bond Sensor Package 审中-公开
公开(公告)号：US20170222065A1
公开(公告)日：2017-08-03
申请号：US15492592
申请日：2017-04-20
申请人： Optiz, Inc.
发明人： Vage Oganesian , Zhenhua Lu
IPC分类号： H01L31/02 , H01L31/0203 , H01L27/146
CPC分类号： H01L31/02002 , H01L27/14618 , H01L27/14636 , H01L27/14683 , H01L31/0203 , H01L31/18 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2924/10155 , H01L2924/10156 , H01L2924/15311 , H01L2924/16235 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A packaged chip assembly with a semiconductor substrate, a semiconductor device integrally formed on or in the substrate's top surface, and first bond pads at the substrate's top surface electrically coupled to the semiconductor device. A second substrate includes a first aperture and one or more second apertures extending therethrough, second and third bond pads at the second substrate's top and bottom surfaces, respectively, and conductors electrically coupled to the second and third bond pads. The semiconductor substrate's top surface is secured to the second substrate's bottom surface such that the semiconductor device is aligned with the first aperture, and each of the first bond pads is aligned with one of the second apertures. A plurality of wires are each electrically connected between one of the first bond pads and one of the second bond pads and each passing through one of the one or more second apertures.

4. 发明授权

US09570634B2 Sensor package with exposed sensor array and method of making same 有权
标题翻译：带传感器阵列的传感器封装及其制作方法
公开(公告)号：US09570634B2
公开(公告)日：2017-02-14
申请号：US14824966
申请日：2015-08-12
申请人： Optiz, Inc.
发明人： Vage Oganesian , Zhenhua Lu
IPC分类号： H01L31/0203 , H01L31/0232 , H01L27/146 , G01N27/414 , H01L23/053
CPC分类号： H01L31/0203 , G01N27/414 , H01L23/053 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L31/02325 , H01L2224/48091 , H01L2224/73265 , H01L2924/10156 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
摘要： A packaged sensor assembly and method of forming that includes a first substrate having opposing first and second surfaces and a plurality of conductive elements each extending between the first and second surfaces. A second substrate comprises opposing front and back surfaces, one or more detectors formed on or in the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors. A third substrate is mounted to the front surface to define a cavity between the third substrate and the front surface, wherein the third substrate includes a first opening extending from the cavity through the third substrate. The back surface is mounted to the first surface. A plurality of wires each extend between and electrically connecting one of the contact pads and one of the conductive elements.
摘要翻译：一种封装的传感器组件和形成方法，包括具有相对的第一和第二表面的第一基底和各自在第一和第二表面之间延伸的多个导电元件。第二基板包括相对的前表面和后表面，形成在前表面上或表面上的一个或多个检测器，以及形成在前表面处的电耦合到一个或多个检测器的多个接触焊盘。第三基板安装到前表面以在第三基板和前表面之间限定空腔，其中第三基板包括从空腔延伸穿过第三基板的第一开口。后表面安装到第一表面。多个导线各自在接触焊盘之一和导电元件中的一个之间延伸并电连接。

5. 发明申请

US20170033136A1 Method Of Making A Sensor Package With Cooling Feature 审中-公开
标题翻译：制造具有冷却特性的传感器封装的方法
公开(公告)号：US20170033136A1
公开(公告)日：2017-02-02
申请号：US15290522
申请日：2016-10-11
申请人： Optiz, Inc.
发明人： Vage Oganesian , Zhenhua Lu
IPC分类号： H01L27/144 , H01L21/48 , H01L31/02 , H01L25/18 , H01L23/367 , H01L23/467 , H01L23/00 , H01L31/024 , H01L23/498
CPC分类号： H01L31/024 , H01L21/481 , H01L23/13 , H01L23/367 , H01L23/3672 , H01L23/3677 , H01L23/467 , H01L23/49833 , H01L24/16 , H01L24/17 , H01L24/73 , H01L25/18 , H01L27/1446 , H01L31/02002 , H01L31/02005 , H01L31/02019 , H01L2224/16145 , H01L2224/16225 , H01L2224/17181 , H01L2224/48091 , H01L2224/73257 , H01L2924/00 , H01L2924/0002 , H01L2924/12043 , H01L2924/1433 , H01L2924/00014
摘要： A sensor device includes a first substrate of semiconductor material having opposing first and second surfaces, photodetectors configured to receive light impinging on the first surface, and first contact pads each exposed at both the first and second surfaces and electrically coupled to at least one of the photodetectors. A second substrate comprises opposing first and second surfaces, electrical circuits, a second contact pads each disposed at the first surface of the second substrate and electrically coupled to at least one of the electrical circuits, and a plurality of cooling channels formed as first trenches extending into the second surface of the second substrate but not reaching the first surface of the second substrate. The first substrate second surface is mounted to the second substrate first surface such that each of the first contact pads is electrically coupled to at least one of the second contact pads.
摘要翻译：传感器装置包括具有相对的第一和第二表面的半导体材料的第一衬底，被配置为接收入射在第一表面上的光的光电探测器，以及每个在第一和第二表面都暴露的第一接触焊盘，并电耦合到光电探测器第二基板包括相对的第一和第二表面，电路，每个设置在第二基板的第一表面处并电耦合到至少一个电路的第二接触焊盘，以及形成为第一沟槽延伸的多个冷却通道进入第二基板的第二表面，但不到达第二基板的第一表面。第一衬底第二表面安装到第二衬底第一表面，使得每个第一接触焊盘电耦合到第二接触焊盘中的至少一个。

6. 发明申请

US20160380018A1 Method Of Making Low Profile Sensor Package With Cooling Feature 审中-公开
标题翻译：制造薄型传感器封装的方法与冷却功能
公开(公告)号：US20160380018A1
公开(公告)日：2016-12-29
申请号：US15263555
申请日：2016-09-13
申请人： Optiz, Inc.
发明人： Vage Oganesian , Zhenhua Lu
IPC分类号： H01L27/146 , H01L31/024
CPC分类号： H01L27/14632 , H01L27/14618 , H01L27/1462 , H01L27/14634 , H01L27/14636 , H01L27/14687 , H01L31/02005 , H01L31/024 , H01L2224/04042 , H01L2224/05548 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2924/15153 , H01L2924/00014 , H01L2924/00
摘要： A sensor device and method of making same that includes a silicon substrate with opposing first and second surfaces, a sensor formed at or in the first surface, a plurality of first contact pads formed at the first surface which are electrically coupled to the sensor, and a plurality of cooling channels formed as first trenches extending into the second surface but not reaching the first surface. The cooling channels instead can be formed on one or more separate substrates that are attached to the silicon substrate for cooling the silicon substrate.
摘要翻译：一种传感器装置及其制造方法，其包括具有相对的第一和第二表面的硅衬底，形成在第一表面处或第一表面中的传感器，形成在第一表面处的电耦合到传感器的多个第一接触焊盘，以及形成为延伸到第二表面但不到达第一表面的第一沟槽的多个冷却通道。冷却通道可以形成在一个或多个单独的衬底上，所述衬底附接到硅衬底以冷却硅衬底。

7. 发明授权

US09219091B2 Low profile sensor module and method of making same 有权
标题翻译：薄型传感器模块及其制作方法
公开(公告)号：US09219091B2
公开(公告)日：2015-12-22
申请号：US14200158
申请日：2014-03-07
申请人： Optiz, Inc.
发明人： Vage Oganesian , Zhenhua Lu
IPC分类号： H01L27/146
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14685 , H01L2224/10
摘要： A host substrate assembly includes a first substrate with opposing first and second surfaces, an aperture extending therethrough, circuit layers, and first contact pads electrically coupled to the circuit layers. A sensor chip includes a second substrate with opposing first and second surfaces, a plurality of photo detectors formed on or in the second substrate and configured to receive light incident on the second substrate first surface, and a plurality of second contact pads formed at the second substrate first or second surfaces and are electrically coupled to the photo detectors. A spacer is mounted to the second substrate first surface. A protective substrate is mounted to the spacer and disposed over the photo detectors. Electrically conductive conduits each extend through the spacer and are in electrical contact with one of the second contact pads. Electrical connectors electrically connect the first contact pads and the conduits.
摘要翻译：主机基板组件包括具有相对的第一和第二表面的第一基板，延伸穿过其中的孔，电路层和电耦合到电路层的第一接触焊盘。传感器芯片包括具有相对的第一和第二表面的第二基板，形成在第二基板上或第二基板中并被配置为接收入射在第二基板第一表面上的光的多个光电检测器，以及形成在第二基板上的多个第二接触焊盘基板第一或第二表面，并且电耦合到光电检测器。间隔件安装到第二基板第一表面。保护衬底被安装到间隔件并设置在光电检测器上。导电导管各自延伸穿过间隔件并与第二接触垫中的一个电接触。电连接器电连接第一接触垫和导管。

8. 发明申请

US20150303231A1 Color Filter And Photodiode Patterning Configuration 有权
标题翻译：彩色滤光片和光电二极管图案配置
公开(公告)号：US20150303231A1
公开(公告)日：2015-10-22
申请号：US14618510
申请日：2015-02-10
申请人： Optiz, Inc.
发明人： Vage Oganesian , Zhenhua Lu
IPC分类号： H01L27/146
CPC分类号： H01L27/14621 , H01L27/14603 , H01L27/14667
摘要： An imaging device that includes an array of photo detectors each configured to generate an electrical signal in response to received light, and an array of color filters disposed over the array of photo detectors such that the photo detectors receive light passing through the color filters. Each of the color filters has a color transmission characteristic, which vary. To even out color balance, some of the color filters are disposed over a plurality of the photo detectors while others are disposed over only one of the photo detectors. Additional color balance can be achieved by varying the relative area sizes of the color filters and underlying photo detectors based on color transmission characteristics, to compensate for the varying absorption coefficient of the photo detectors at different colors.
摘要翻译：一种成像装置，其包括每个被配置为响应于接收到的光产生电信号的光电检测器阵列，以及设置在光电检测器阵列上的彩色滤光器阵列，使得光电检测器接收通过滤色器的光。每个滤色器具有不同的颜色传输特性。为了平衡色彩平衡，一些滤色器被布置在多个光电检测器上，而另外一些滤色器仅设置在一个光检测器上。可以通过基于颜色透射特性改变滤色器和下面的光电检测器的相对面积尺寸来补偿不同颜色的光电检测器的变化的吸收系数来实现附加的颜色平衡。

9. 发明申请

US20150189204A1 Semiconductor Device On Cover Substrate And Method Of Making Same 审中-公开
标题翻译：封装基板上的半导体器件及其制造方法
公开(公告)号：US20150189204A1
公开(公告)日：2015-07-02
申请号：US14562349
申请日：2014-12-05
申请人： Optiz, Inc.
发明人： Vage Oganesian , Zhenhua Lu
IPC分类号： H04N5/369 , G06K9/00
CPC分类号： G06K9/00013 , H01L2224/48091 , H01L2224/8592 , H01L2924/10155 , H01L2924/10156 , H01L2924/00014
摘要： A sensor device comprising a sensor die, a second substrate and a conductor assembly. The sensor die includes a first substrate having front and back surfaces, a sensor disposed in or at the front surface, bond pads disposed in or at the front surface and electrically coupled to the sensor, and a plurality of openings each extending from the back surface to one of the bond pads. The second substrate has top and bottom surfaces, wherein the bottom surface of the second substrate is mounted to the front surface of the first substrate. The conductor assembly is electrically coupled to at least some of the bond pads through at least some of the openings.
摘要翻译：一种传感器装置，包括传感器芯片，第二基板和导体组件。传感器管芯包括具有前表面和后表面的第一基底，设置在前表面中或表面上的传感器，设置在前表面中或其表面上并且电耦合到传感器的接合焊盘，以及多个开口，每个开口从后表面延伸到一个键盘。第二基板具有顶表面和底表面，其中第二基板的底表面安装到第一基板的前表面。导体组件通过至少一些开口电耦合到至少一些接合焊盘。

10. 发明授权

US11614361B1 Hyperspectral camera 有权
公开(公告)号：US11614361B1
公开(公告)日：2023-03-28
申请号：US17561441
申请日：2021-12-23
申请人： Optiz, Inc.
发明人： Rob Heeman , Edwin Wolterink
IPC分类号： G01J3/04 , G01J3/28 , G01J3/02 , G01J3/18
摘要： A camera includes a first lens configured to focus incoming light onto a reflective slit assembly. The reflective slit assembly comprises an elongated strip of reflective material configured to reflect some but not all of the incoming light as return light. The first lens is configured to at least partially collimate the return light from the elongated strip of reflective material. A first mirror is configured to reflect the return light from the first lens. A second mirror is configured to reflect the return light from the first mirror. An optical element is configured to separate the return light from the first mirror as a function of wavelength. A second lens is configured to focus the return light from the optical element onto a first detector. The first detector is configured to measure intensities of the return light as a function of two dimensional position on the first detector.

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