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1. 发明申请

US20110316422A1 FAILURE MITIGATION IN ARRAYS OF LIGHT-EMITTING DEVICES 有权
标题翻译：发光装置阵列失效减速
公开(公告)号：US20110316422A1
公开(公告)日：2011-12-29
申请号：US13183684
申请日：2011-07-15
申请人： Michael Tischler , Philippe Schick , Calvin Wade Sheen , Paul Jungwirth
发明人： Michael Tischler , Philippe Schick , Calvin Wade Sheen , Paul Jungwirth
IPC分类号： H05B39/10 , F21S4/00 , F21V21/00
CPC分类号： H05B33/089 , F21K9/20 , H05B33/08 , H05B33/0821 , H05K2201/09263 , H05K2201/10106 , H05K2201/10174 , Y10T29/49002
摘要： In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
摘要翻译：根据某些实施例，包括多个功率串的照明系统具有促进对沿着每个功率线连接的一个或多个发光元件的故障进行补偿的元件。

2. 发明申请

US20150236214A1 ELECTRONIC DEVICES WITH YIELDING SUBSTRATES 有权
标题翻译：带有焊接基板的电子设备
公开(公告)号：US20150236214A1
公开(公告)日：2015-08-20
申请号：US14704334
申请日：2015-05-05
申请人： Michael A. Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
发明人： Michael A. Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
IPC分类号： H01L33/44 , H01L33/62 , H01L33/48 , H01L33/32
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
摘要翻译：根据某些实施例，尽管半导体管芯的表面具有任何非平面性或半导体管芯接触件的非共面性，半导体管芯也用压力激活的粘合剂直接粘附到屈服基底上。

3. 发明授权

US08466488B2 Electronic devices with yielding substrates 有权
标题翻译：具有屈服底物的电子设备
公开(公告)号：US08466488B2
公开(公告)日：2013-06-18
申请号：US13466288
申请日：2012-05-08
申请人： Michael Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
发明人： Michael Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
IPC分类号： H01L29/72
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： In accordance with certain embodiments, an unpackaged inorganic LED die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the unpackaged inorganic LED die or non-coplanarity of the contacts thereof.
摘要翻译：根据某些实施例，未封装的无机LED管芯具有压敏激光粘合剂直接粘附到屈服基底上，尽管未封装的无机LED裸片的表面具有任何非平面性，也不与其接触的非共面性。

4. 发明申请

US20100096993A1 Integrated Modular Lighting Unit 审中-公开
标题翻译：集成模块化照明单元
公开(公告)号：US20100096993A1
公开(公告)日：2010-04-22
申请号：US11960310
申请日：2007-12-19
申请人： Ian Ashdown , Paul Jungwirth , Shane P. Robinson , Philippe Schick , Ingo Speier , Allan Brent York
发明人： Ian Ashdown , Paul Jungwirth , Shane P. Robinson , Philippe Schick , Ingo Speier , Allan Brent York
IPC分类号： H01J13/32
CPC分类号： F21V29/51 , F21K9/00 , F21S6/00 , F21V29/717 , F21V29/74 , F21Y2115/10 , H05B33/0803 , H05B33/0821 , H05B33/0869
摘要： The present invention provides an integrated self-contained lighting module which can be used on its own, or in conjunction with other modules to produce white light, or light of any other colour within the colour spectrum. Each module comprises one or more light-emitting elements, a drive and control system, a feedback system, thermal management system, optical system, and optionally a communication system enabling communication between modules and/or other control systems. Depending on the configuration, the lighting module can operate autonomously or its functionality can be determined based on either or both internal signals and externally received signals.
摘要翻译：本发明提供一种集成的独立照明模块，其可以单独使用，或与其它模块结合使用以产生白光，或者在色谱范围内的任何其它颜色的光。每个模块包括一个或多个发光元件，驱动和控制系统，反馈系统，热管理系统，光学系统和可选地实现模块和/或其他控制系统之间的通信的通信系统。根据配置，照明模块可以自主操作，或者可以基于内部信号和外部接收信号中的一个或两个来确定其功能。

5. 发明授权

US07505268B2 Electronic device package with an integrated evaporator 有权
标题翻译：带集成蒸发器的电子设备包装
公开(公告)号：US07505268B2
公开(公告)日：2009-03-17
申请号：US11398234
申请日：2006-04-05
申请人： Philippe Schick
发明人： Philippe Schick
IPC分类号： H05K7/20 , H01L23/34 , H01B9/06 , B60Q1/00
CPC分类号： F21V29/51 , F21V29/54 , F21V29/83 , F28D15/0275 , F28D15/04 , H01L23/3675 , H01L23/427 , H01L33/648 , H01L2924/0002 , H01L2924/12044 , H05K1/0203 , H05K1/0209 , H05K2201/10106 , H01L2924/00
摘要： The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to an attachable thermal management system. The electronic device package according to the present invention comprises a housing that is specifically designed to couple with an evaporator portion of a thermal management system, for example a heat pipe. One or more electronic devices are mounted in thermal contact with the evaporator portion of the thermal management system. Upon completion of the fabrication of the package using standard techniques, the evaporator portion of the electronic device package is operatively coupled with a secondary portion of the thermal management system. In this manner the electronic device package can be fabricated to incorporate a desired thermal management system, while being fabricated using standard package fabrication processes and machinery.
摘要翻译：本发明提供一种可以使用标准封装制造技术制造的电子器件封装，同时向可附接的热管理系统提供期望水平的热传递能力。根据本发明的电子器件封装包括专门设计成与热管理系统（例如热管）的蒸发器部分连接的壳体。一个或多个电子装置与热管理系统的蒸发器部分热接触地安装。在使用标准技术完成封装的制造之后，电子器件封装的蒸发器部分与热管理系统的次级部分可操作地耦合。以这种方式，可以制造电子器件封装以并入期望的热管理系统，同时使用标准封装制造工艺和机械制造。

6. 发明授权

US09696019B2 LED lighting structure 有权
公开(公告)号：US09696019B2
公开(公告)日：2017-07-04
申请号：US14711891
申请日：2015-05-14
申请人： Paul Palfreyman , Philippe Schick , Michael A. Tischler
发明人： Paul Palfreyman , Philippe Schick , Michael A. Tischler
IPC分类号： F21V21/14 , F21V23/06 , G09F13/00 , G09F13/22 , F21V33/00 , F21L4/00 , G06F1/16 , F21V31/00 , F21L4/08 , F21V17/00 , F21V21/08 , F21K9/20 , F21Y105/10 , F21Y115/10
CPC分类号： F21V21/14 , F21K9/20 , F21L4/00 , F21L4/08 , F21V17/007 , F21V21/08 , F21V23/06 , F21V31/005 , F21V33/00 , F21Y2105/10 , F21Y2115/10 , G06F1/1616 , G09F13/00 , G09F13/22 , G09F2013/222
摘要： In accordance with various embodiments, planar light sheets are conformed to interior volumes of housings to produce predetermined spatial optical characteristics such as luminous intensity distributions.

8. 发明申请

US20150014708A1 PACKAGE FOR LIGHT EMITTING AND RECEIVING DEVICES 审中-公开
标题翻译：用于发光和接收装置的包装
公开(公告)号：US20150014708A1
公开(公告)日：2015-01-15
申请号：US14334189
申请日：2014-07-17
申请人： Ingo Speier , Ian Ashdown , Philippe Schick
发明人： Ingo Speier , Ian Ashdown , Philippe Schick
IPC分类号： H01L25/16 , H01L33/50 , H01L33/58 , H01L33/62 , H01L33/48 , H01L33/60 , H01L33/54
CPC分类号： H01L25/167 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： In various embodiments, packages include one or more lighting devices having electrical contact points, a flexible substrate for supporting the lighting devices, a plurality of electrically conductive traces defined on the substrate and electrically connected to the contact points of the lighting devices, and an adhesive layer mounting each of the lighting devices on the substrate.
摘要翻译：在各种实施例中，包装包括具有电接触点的一个或多个照明装置，用于支撑照明装置的柔性基板，限定在基板上并电连接到照明装置的接触点的多个导电迹线，以及粘合剂将每个照明装置的层安装在基板上。

9. 发明授权

US08653539B2 Failure mitigation in arrays of light-emitting devices 有权
标题翻译：在发光器件阵列中的故障缓解
公开(公告)号：US08653539B2
公开(公告)日：2014-02-18
申请号：US13183684
申请日：2011-07-15
申请人： Michael Tischler , Philippe Schick , Calvin Wade Sheen , Paul Jungwirth
发明人： Michael Tischler , Philippe Schick , Calvin Wade Sheen , Paul Jungwirth
IPC分类号： H01L27/15
CPC分类号： H05B33/089 , F21K9/20 , H05B33/08 , H05B33/0821 , H05K2201/09263 , H05K2201/10106 , H05K2201/10174 , Y10T29/49002
摘要： In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
摘要翻译：根据某些实施例，包括多个功率串的照明系统具有促进对沿着每个功率线连接的一个或多个发光元件的故障进行补偿的元件。

10. 发明申请

US20130056749A1 BROAD-AREA LIGHTING SYSTEMS 审中-公开
标题翻译：广域照明系统
公开(公告)号：US20130056749A1
公开(公告)日：2013-03-07
申请号：US13604880
申请日：2012-09-06
申请人： Michael Tischler , Philippe Schick , Calvin Wade Sheen
发明人： Michael Tischler , Philippe Schick , Calvin Wade Sheen
IPC分类号： H01L33/60 , H01L33/44
CPC分类号： H05K3/32 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L33/08 , H01L33/44 , H01L33/48 , H01L33/50 , H01L2221/6834 , H01L2221/68363 , H01L2224/16225 , H01L2224/24101 , H01L2224/24227 , H01L2224/245 , H01L2224/24992 , H01L2224/32238 , H01L2224/73204 , H01L2224/82104 , H01L2224/82105 , H01L2224/82138 , H01L2224/82855 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83486 , H01L2224/96 , H01L2924/01029 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/15787 , H05K3/321 , H05K13/00 , Y10T29/49117 , Y10T29/4913 , H01L2924/00014 , H01L2924/01049 , H01L2924/0105 , H01L2924/053 , H01L2224/82 , H01L2924/01013 , H01L2924/01079 , H01L2924/01047 , H01L2924/01078 , H01L2924/00
摘要： In accordance with certain embodiments, illumination systems are formed by aligning light-emitting elements with optical elements and/or disposing light-conversion materials on the light-emitting elements, as well as by providing electrical connectivity to the light-emitting elements
摘要翻译：根据某些实施例，通过将发光元件与光学元件对准和/或在发光元件上设置光转换材料以及通过提供与发光元件的电连接来形成照明系统

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