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1. 发明授权

US09640652B2 Semiconductor devices including epitaxial layers and related methods 有权
公开(公告)号：US09640652B2
公开(公告)日：2017-05-02
申请号：US13608350
申请日：2012-09-10
申请人： Brett Adam Hull , Qingchun Zhang
发明人： Brett Adam Hull , Qingchun Zhang
IPC分类号： H01L29/78 , H01L29/08 , H01L29/06 , H01L29/16 , H01L29/45
CPC分类号： H01L29/0847 , H01L29/0623 , H01L29/1608 , H01L29/45 , H01L29/7828
摘要： A semiconductor device may include a semiconductor layer having a first conductivity type, a well region of a second conductivity type in the semiconductor layer wherein the first and second conductivity types are different, and a terminal region of the first conductivity type in the well region. An epitaxial semiconductor layer may be on the surface of the semiconductor layer including the well region and the terminal region with the epitaxial semiconductor layer having the first conductivity type across the well and terminal regions. A gate electrode may be on the epitaxial semiconductor layer so that the epitaxial semiconductor layer is between the gate electrode and portions of the well region surrounding the terminal region at the surface of the semiconductor layer.

2. 发明授权

US09337268B2 SiC devices with high blocking voltage terminated by a negative bevel 有权
标题翻译：具有高阻断电压的SiC器件由负斜角端接
公开(公告)号：US09337268B2
公开(公告)日：2016-05-10
申请号：US13108366
申请日：2011-05-16
申请人： Qingchun Zhang , Craig Capell , Anant Agarwal , Sei-Hyung Ryu
发明人： Qingchun Zhang , Craig Capell , Anant Agarwal , Sei-Hyung Ryu
IPC分类号： H01L29/06 , H01L29/10 , H01L29/36 , H01L29/732 , H01L29/739 , H01L29/74 , H01L29/78 , H01L29/861 , H01L29/16
CPC分类号： H01L29/7813 , H01L21/0465 , H01L29/0615 , H01L29/0661 , H01L29/1004 , H01L29/1016 , H01L29/1095 , H01L29/1608 , H01L29/36 , H01L29/732 , H01L29/7397 , H01L29/74 , H01L29/861
摘要： A negative bevel edge termination for a Silicon Carbide (SiC) semiconductor device is disclosed. In one embodiment, the negative bevel edge termination includes multiple steps that approximate a smooth negative bevel edge termination at a desired slope. More specifically, in one embodiment, the negative bevel edge termination includes at least five steps, at least ten steps, or at least 15 steps. The desired slope is, in one embodiment, less than or equal to fifteen degrees. In one embodiment, the negative bevel edge termination results in a blocking voltage for the semiconductor device of at least 10 kilovolts (kV) or at least 12 kV. The semiconductor device is preferably, but not necessarily, a thyristor such as a power thyristor, a Bipolar Junction Transistor (BJT), an Insulated Gate Bipolar Transistor (IGBT), a U-channel Metal-Oxide-Semiconductor Field Effect Transistor (UMOSFET), or a PIN diode.
摘要翻译：公开了一种用于碳化硅（SiC）半导体器件的负斜面边缘终端。在一个实施例中，负斜边缘终端包括以期望的斜率近似平滑负斜面边缘终止的多个步骤。更具体地，在一个实施例中，负斜边缘终止包括至少五个步骤，至少十个步骤或至少15个步骤。在一个实施例中，期望的斜率小于或等于十五度。在一个实施例中，负斜边缘终止导致半导体器件的阻挡电压为至少10千伏（kV）或至少12kV。半导体器件优选但不一定是晶闸管，例如功率晶闸管，双极结晶体管（BJT），绝缘栅双极晶体管（IGBT），U沟道金属氧化物半导体场效应晶体管（UMOSFET）或PIN二极管。

3. 发明授权

US08809904B2 Electronic device structure with a semiconductor ledge layer for surface passivation 有权
标题翻译：具有用于表面钝化的半导体凸缘层的电子器件结构
公开(公告)号：US08809904B2
公开(公告)日：2014-08-19
申请号：US12843113
申请日：2010-07-26
申请人： Qingchun Zhang , Anant Agarwal
发明人： Qingchun Zhang , Anant Agarwal
IPC分类号： H01L29/36
CPC分类号： H01L29/66378 , H01L29/0619 , H01L29/1608 , H01L29/66068 , H01L29/66234 , H01L29/66363 , H01L29/744
摘要： Electronic device structures including semiconductor ledge layers for surface passivation and methods of manufacturing the same are disclosed. In one embodiment, the electronic device includes a number of semiconductor layers of a desired semiconductor material having alternating doping types. The semiconductor layers include a base layer of a first doping type that includes a highly doped well forming a first contact region of the electronic device and one or more contact layers of a second doping type on the base layer that have been etched to form a second contact region of the electronic device. The etching of the one or more contact layers causes substantial crystalline damage, and thus interface charge, on the surface of the base layer. In order to passivate the surface of the base layer, a semiconductor ledge layer of the semiconductor material is epitaxially grown on at least the surface of the base layer.
摘要翻译：公开了包括用于表面钝化的半导体凸缘层的电子器件结构及其制造方法。在一个实施例中，电子器件包括具有交替掺杂类型的期望半导体材料的多个半导体层。半导体层包括第一掺杂类型的基极层，其包括形成电子器件的第一接触区域的高度掺杂的阱和在基底层上的第二掺杂类型的一个或多个接触层，其被蚀刻以形成第二掺杂阱电子设备的接触区域。一个或多个接触层的蚀刻在基层的表面上引起显着的晶体损伤，并因此导致界面电荷。为了钝化基底层的表面，半导体材料的半导体凸缘层至少在基底层的表面上外延生长。

4. 发明授权

US08637386B2 Diffused junction termination structures for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same 有权
标题翻译：用于碳化硅器件的扩散连接端接结构以及包含其的制造碳化硅器件的方法
公开(公告)号：US08637386B2
公开(公告)日：2014-01-28
申请号：US12719497
申请日：2010-03-08
申请人： Qingchun Zhang , Anant K. Agarwal , Tangali S. Sudarshan , Alexander Bolotnikov
发明人： Qingchun Zhang , Anant K. Agarwal , Tangali S. Sudarshan , Alexander Bolotnikov
IPC分类号： H01L21/22 , H01L21/38
CPC分类号： H01L29/1608 , H01L21/0465 , H01L21/223 , H01L29/0615 , H01L29/0657 , H01L29/0661 , H01L29/36 , H01L29/8613 , H01L29/872
摘要： An electronic device includes a silicon carbide layer having a first conductivity type and a main junction adjacent a surface of the silicon carbide layer, and a junction termination region at the surface of the silicon carbide layer adjacent the main junction. Charge in the junction termination region decreases with lateral distance from the main junction, and a maximum charge in the junction termination region may be less than about 2×1014 cm−2.
摘要翻译：电子器件包括具有第一导电类型的碳化硅层和邻近碳化硅层的表面的主结，以及邻近主结的碳化硅层表面处的结终端区。连接终端区域中的电荷随着与主结的横向距离而减小，并且接合终端区域中的最大电荷可能小于约2×1014cm-2。

5. 发明申请

US20130207123A1 HIGH CURRENT DENSITY POWER MODULE 有权
标题翻译：高电流密度功率模块
公开(公告)号：US20130207123A1
公开(公告)日：2013-08-15
申请号：US13588329
申请日：2012-08-17
申请人： Jason Patrick Henning , Qingchun Zhang , Sei-Hyung Ryu , Anant Kumar Agarwal , John Williams Palmour , Scott Allen
发明人： Jason Patrick Henning , Qingchun Zhang , Sei-Hyung Ryu , Anant Kumar Agarwal , John Williams Palmour , Scott Allen
IPC分类号： H01L29/16 , H01L27/06
CPC分类号： H01L29/7805 , H01L21/046 , H01L21/049 , H01L25/18 , H01L27/0629 , H01L29/045 , H01L29/0696 , H01L29/1608 , H01L29/66068 , H01L29/7395 , H01L29/7802 , H01L29/7806 , H01L2924/0002 , H01L2924/13091 , H02M7/003 , H02P7/04 , H01L2924/00
摘要： A power module is disclosed that includes a housing with an interior chamber wherein multiple switch modules are mounted within the interior chamber. The switch modules comprise multiple transistors and diodes that are interconnected to facilitate switching power to a load. In one embodiment, at least one of the switch modules supports a current density of at least 10 amperes per cm2.
摘要翻译：公开了一种功率模块，其包括具有内部室的壳体，其中多个开关模块安装在内部室内。开关模块包括多个晶体管和二极管，这些晶体管和二极管互连以便于将功率切换到负载。在一个实施例中，至少一个开关模块支持每平方厘米至少10安培的电流密度。

6. 发明授权

US08460977B2 Mesa termination structures for power semiconductor devices and methods of forming power semiconductor devices with mesa termination structures 有权
标题翻译：用于功率半导体器件的Mesa端接结构和用台面端接结构形成功率半导体器件的方法
公开(公告)号：US08460977B2
公开(公告)日：2013-06-11
申请号：US13338620
申请日：2011-12-28
申请人： Qingchun Zhang , Anant K. Agarwal
发明人： Qingchun Zhang , Anant K. Agarwal
IPC分类号： H01L21/335
CPC分类号： H01L29/7813 , H01L29/0615 , H01L29/0661 , H01L29/1095 , H01L29/1608 , H01L29/732 , H01L29/7397 , H01L29/744 , H01L29/7811 , H01L29/861 , H01L29/8613
摘要： A method of forming an electronic device, including forming a preliminary buffer layer on a drift layer, forming a first layer on the preliminary buffer layer, selectively etching the first layer to form a first mesa that exposes a portion of the preliminary buffer layer, and selectively etching the exposed portion of the preliminary buffer layer to form a second mesa that covers a first portion of the drift layer, that exposes a second portion of the drift layer, and that includes a mesa step that protrudes from the first mesa. Dopants are selectively implanted into the drift layer adjacent the second mesa to form a junction termination region in the drift layer. Dopants are selectively implanted through a horizontal surface of the mesa step into a portion of the drift layer beneath the mesa step to form a buried junction extension in the drift layer.
摘要翻译：一种形成电子器件的方法，包括在漂移层上形成初步缓冲层，在预备缓冲层上形成第一层，选择性地蚀刻第一层以形成露出一部分初步缓冲层的第一台面;以及选择性地蚀刻初步缓冲层的暴露部分以形成覆盖漂移层的第一部分的第二台面，其暴露漂移层的第二部分，并且包括从第一台面突出的台面台阶。将掺杂剂选择性地注入到与第二台面相邻的漂移层中以在漂移层中形成结终止区域。选择性地将掺杂剂通过台面台阶的水平表面植入台阶下面的漂移层的一部分，以在漂移层中形成掩埋结延伸。

7. 发明授权

US08330244B2 Semiconductor devices including Schottky diodes having doped regions arranged as islands and methods of fabricating same 有权
标题翻译：包括具有排列成岛的掺杂区域的肖特基二极管的半导体器件及其制造方法
公开(公告)号：US08330244B2
公开(公告)日：2012-12-11
申请号：US12492670
申请日：2009-06-26
申请人： Qingchun Zhang , Sei-Hyung Ryu , Anant Agarwal
发明人： Qingchun Zhang , Sei-Hyung Ryu , Anant Agarwal
IPC分类号： H01L27/095 , H01L29/47 , H01L29/812 , H01L31/07
CPC分类号： H01L29/0619 , H01L21/046 , H01L29/0615 , H01L29/1608 , H01L29/6606 , H01L29/872
摘要： A semiconductor device according to some embodiments includes a semiconductor layer having a first conductivity type and a surface in which an active region of the semiconductor device is defined. A plurality of spaced apart first doped regions are arranged within the active region. The plurality of first doped regions have a second conductivity type that is opposite the first conductivity type, have a first dopant concentration, and define a plurality of exposed portions of the semiconductor layer within the active region. The plurality of first doped regions are arranged as islands in the semiconductor layer. A second doped region in the semiconductor layer has the second conductivity type and has a second dopant concentration that is greater than the first dopant concentration.
摘要翻译：根据一些实施例的半导体器件包括具有第一导电类型的半导体层和限定半导体器件的有源区的表面。多个间隔开的第一掺杂区域被布置在有源区域内。多个第一掺杂区域具有与第一导电类型相反的第二导电类型，具有第一掺杂剂浓度，并且在有源区内限定半导体层的多个暴露部分。多个第一掺杂区域在半导体层中被布置为岛状。半导体层中的第二掺杂区域具有第二导电类型并且具有大于第一掺杂剂浓度的第二掺杂剂浓度。

8. 发明申请

US20120273802A1 JUNCTION BARRIER SCHOTTKY DIODES WITH CURRENT SURGE CAPABILITY 有权
标题翻译：具有电流冲击能力的接线棒肖特基二极管
公开(公告)号：US20120273802A1
公开(公告)日：2012-11-01
申请号：US13547014
申请日：2012-07-11
申请人： Qingchun Zhang , Sei-Hyung Ryu
发明人： Qingchun Zhang , Sei-Hyung Ryu
IPC分类号： H01L29/24
CPC分类号： H01L29/872 , H01L29/0615 , H01L29/1608 , H01L29/47 , H01L29/861
摘要： An electronic device includes a silicon carbide drift region having a first conductivity type, a Schottky contact on the drift region, and a plurality of junction barrier Schottky (JBS) regions at a surface of the drift region adjacent the Schottky contact. The JBS regions have a second conductivity type opposite the first conductivity type and have a first spacing between adjacent ones of the JBS regions. The device further includes a plurality of surge protection subregions having the second conductivity type. Each of the surge protection subregions has a second spacing between adjacent ones of the surge protection subregions that is less than the first spacing.
摘要翻译：电子器件包括具有第一导电类型的碳化硅漂移区，漂移区上的肖特基接触以及与肖特基接触相邻的漂移区的表面处的多个接合势垒肖特基（JBS）区。 JBS区域具有与第一导电类型相反的第二导电类型，并且在相邻的JBS区域之间具有第一间隔。该装置还包括具有第二导电类型的多个浪涌保护子区域。浪涌保护子区域中的每一个在相邻的浪涌保护子区域之间具有小于第一间隔的第二间隔。

9. 发明授权

US08294507B2 Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits 有权
标题翻译：具有非负温度系数和相关控制电路的宽带隙双极截止晶闸管
公开(公告)号：US08294507B2
公开(公告)日：2012-10-23
申请号：US12437929
申请日：2009-05-08
申请人： Qingchun Zhang , James Theodore Richmond , Robert J. Callanan
发明人： Qingchun Zhang , James Theodore Richmond , Robert J. Callanan
IPC分类号： H03K17/72
CPC分类号： H01L29/744 , H01L25/18 , H01L29/1608 , H01L29/7404 , H01L2924/0002 , H03K17/567 , H01L2924/00
摘要： An electronic device includes a wide bandgap thyristor having an anode, a cathode, and a gate terminal, and a wide bandgap bipolar transistor having a base, a collector, and an emitter terminal. The emitter terminal of the bipolar transistor is directly coupled to the anode terminal of the thyristor such that the bipolar transistor and the thyristor are connected in series. The bipolar transistor and the thyristor define a wide bandgap bipolar power switching device that is configured to switch between a nonconducting state and a conducting state that allows current flow between a first main terminal corresponding to the collector terminal of the bipolar transistor and a second main terminal corresponding to the cathode terminal of the thyristor responsive to application of a first control signal to the base terminal of the bipolar transistor and responsive to application of a second control signal to the gate terminal of the thyristor. Related control circuits are also discussed.
摘要翻译：电子器件包括具有阳极，阴极和栅极端子的宽带隙晶闸管和具有基极，集电极和发射极端子的宽带隙双极晶体管。双极晶体管的发射极端子直接耦合到晶闸管的阳极端子，使得双极晶体管和晶闸管串联连接。双极晶体管和晶闸管限定宽带隙双极性功率开关器件，其被配置为在非导通状态和导通状态之间切换，该导通状态允许电流在对应于双极晶体管的集电极端子的第一主端子与第二主端子对应于晶闸管的阴极端子，响应于向双极晶体管的基极端施加第一控制信号，并且响应于向晶闸管的栅极端施加第二控制信号。还讨论了相关控制电路。

10. 发明申请

US20110049561A1 Solid-State Pinch Off Thyristor Circuits 有权
标题翻译：固态闭合晶闸管电路
公开(公告)号：US20110049561A1
公开(公告)日：2011-03-03
申请号：US12550574
申请日：2009-08-31
申请人： Robert J. Callanan , Sei-Hyung Ryu , Qingchun Zhang
发明人： Robert J. Callanan , Sei-Hyung Ryu , Qingchun Zhang
IPC分类号： H01L29/74 , H01L29/744
CPC分类号： H01L29/745 , H01L29/1602 , H01L29/1608 , H01L29/2003 , H01L29/7455
摘要： Provided is a semiconductor bistable switching device that includes a thyristor portion including an anode layer, a drift layer, a gate layer and a cathode layer, the gate layer operable to receive a gate trigger current that, when the anode layer is positively biased relative to the cathode layer, causes the thyristor portion to latch into a conducting mode between the anode and the cathode. The device also includes a transistor portion formed on the thyristor portion, the transistor portion including a source, a drain and a transistor gate, the drain coupled to the cathode of the thyristor portion.
摘要翻译：提供了一种半导体双稳态开关器件，其包括包括阳极层，漂移层，栅极层和阴极层的晶闸管部分，栅极层可操作以接收栅极触发电流，当阳极层相对于阴极层使晶闸管部分锁定在阳极和阴极之间的导电模式。器件还包括形成在晶闸管部分上的晶体管部分，晶体管部分包括源极，漏极和晶体管栅极，漏极耦合到晶闸管部分的阴极。

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