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    • 8. 发明授权
    • Method of MRAM fabrication with zero electrical shorting
    • 零电气短路的MRAM制造方法
    • US07936027B2
    • 2011-05-03
    • US12006889
    • 2008-01-07
    • Rongfu XiaoChyu-Jiuh TorngTom ZhongWitold Kula
    • Rongfu XiaoChyu-Jiuh TorngTom ZhongWitold Kula
    • G11C11/02
    • H01L43/12H01L43/08
    • An MTJ cell without footings and free from electrical short-circuits across a tunneling barrier layer is formed by using a Ta hard mask layer and a combination of etches. A first etch patterns the Ta hard mask, while a second etch uses O2 applied in a single high power process at two successive different power levels. A first power level of between approximately 200 W and 500 W removes BARC, photoresist and Ta residue from the first etch, the second power level, between approximately 400 W and 600 W continues an etch of the stack layers and forms a protective oxide around the etched sides of the stack. Finally, an etch using a carbon, hydrogen and oxygen gas completes the etch while the oxide layer protects the cell from short-circuits across the lateral edges of the barrier layer.
    • 通过使用Ta硬掩模层和蚀刻的组合,形成没有底脚并且穿过隧道势垒层的电短路的MTJ电池。 第一蚀刻图案Ta硬掩模,而第二蚀刻使用在两个连续的不同功率水平下在单个高功率过程中施加的O2。 在大约200W至500W之间的第一功率电平从第一蚀刻去除BARC,光致抗蚀剂和Ta残留物,第二功率电平在大约400W至600W之间,继续蚀刻叠层,并在其周围形成保护氧化物 蚀刻边的堆叠。 最后,使用碳,氢和氧气的蚀刻完成了蚀刻,而氧化物层保护电池免受横跨阻挡层的侧边缘的短路。