专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120005883A1 METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ATTACHING TOOL 失效
标题翻译：连接电子元件和电子元器件连接工具的方法
公开(公告)号：US20120005883A1
公开(公告)日：2012-01-12
申请号：US13242647
申请日：2011-09-23
申请人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
发明人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
IPC分类号： B23P19/00
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
摘要翻译：准备适用于半导体器件外形的电子部件安装工具。电子部件安装工具具有将半导体器件的位置与IC插座对准的功能。电子部件安装工具安装在形成在IC插座上的标准表面上，基本上与半导体器件的外部形状无关。然后通过使用电子部件安装工具将半导体器件对准并附接到IC插座，并且将电子部件附接工具从IC插座移除。准备适用于另一半导体器件的外部形状的另一个电子部件附接工具，并且执行与上述相同的步骤以将该半导体器件对准并附接到相同类型的IC插座。

2. 发明申请

US20110212551A1 CONTACTOR, TEST DEVICE FOR SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS 有权
标题翻译：接触器，半导体装置的测试装置及制造半导体装置的方法
公开(公告)号：US20110212551A1
公开(公告)日：2011-09-01
申请号：US13033796
申请日：2011-02-24
申请人： Shigeyuki MARUYAMA , Yoshihiro Sekizawa , Tomohiro Suzuka
发明人： Shigeyuki MARUYAMA , Yoshihiro Sekizawa , Tomohiro Suzuka
IPC分类号： H01L21/66 , G01R31/20
CPC分类号： G01R1/06761
摘要： A contactor includes a contactor base material including a first material and a conductor film including a second material. The conductor film is formed only on a contact surface with an electrode of a semiconductor apparatus at a tip of the contactor film.
摘要翻译：接触器包括包括第一材料和包括第二材料的导体膜的接触器基材。导体膜仅在与接触器膜的尖端处的半导体装置的电极的接触表面上形成。

3. 发明申请

US20110049699A1 METHOD OF SEMICONDUCTOR DEVICE PROTECTION, PACKAGE OF SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件保护方法，半导体器件封装
公开(公告)号：US20110049699A1
公开(公告)日：2011-03-03
申请号：US12872131
申请日：2010-08-31
申请人： Kazuhiro Tashiro , Keisuke Fukuda , Naohito Kohashi , Shigeyuki Maruyama
发明人： Kazuhiro Tashiro , Keisuke Fukuda , Naohito Kohashi , Shigeyuki Maruyama
IPC分类号： H01L23/28 , H01L21/50
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译：公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。

4. 发明申请

US20080251788A1 Wafer-level package having test terminal 失效
标题翻译：晶圆级封装有测试端子
公开(公告)号：US20080251788A1
公开(公告)日：2008-10-16
申请号：US12155783
申请日：2008-06-10
申请人： Shigeyuki Maruyama
发明人： Shigeyuki Maruyama
IPC分类号： H01L23/482
CPC分类号： H01L22/32 , G01R31/2831 , G01R31/2884 , H01L24/19 , H01L24/20 , H01L24/94 , H01L24/96 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/24137 , H01L2224/24195 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14
摘要： A wafer-level package includes a semiconductor wafer having at least one semiconductor chip circuit forming region each including a semiconductor chip circuit each provided with test chip terminals and non test chip terminals, at least one external connection terminal, at least one redistribution trace provided on the semiconductor wafer, at least one testing member, and an insulating material. A first end of the redistribution trace is connected to one of the test chip terminals and a second end of said redistribution trace is extended out to a position offset from the chip terminals. The testing member is provided in an outer region of the semiconductor chip circuit forming region, and the second end of the redistribution trace is connected to the testing member.
摘要翻译：晶片级封装包括具有至少一个半导体芯片电路形成区域的半导体晶片，每个半导体芯片电路形成区域各自包括半导体芯片电路，每个半导体芯片电路分别具有测试芯片端子和非测试芯片端子，至少一个外部连接端子，至少一个再分布迹线半导体晶片，至少一个测试构件和绝缘材料。再分配迹线的第一端连接到测试芯片端子之一，并且所述再分布迹线的第二端延伸到与芯片端子偏移的位置。测试构件设置在半导体芯片电路形成区域的外部区域中，再分布迹线的第二端连接到测试构件。

5. 发明授权

US07309996B2 Contactor for electronic components and test method using the same 有权
标题翻译：电子元件接触器和使用相同的测试方法
公开(公告)号：US07309996B2
公开(公告)日：2007-12-18
申请号：US10854172
申请日：2004-05-27
申请人： Kazuhiro Tashiro , Shigeyuki Maruyama , Daisuke Koizumi , Takumi Kumatabara , Keisuke Fukuda
发明人： Kazuhiro Tashiro , Shigeyuki Maruyama , Daisuke Koizumi , Takumi Kumatabara , Keisuke Fukuda
IPC分类号： G01R31/02
CPC分类号： G01R1/0483 , G01R1/0441
摘要： A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.
摘要翻译：公开了一种被配置为电连接到电子部件的端子的接触器。连接器包括与电子部件的端子接触的多个接触电极和各自由导电性弹性体构成的多个弹性电极。弹性电极产生用于将接触电极压靠在电子部件的端子上的按压力。接触电极可与弹性电极分离。

6. 发明授权

US07276924B2 Electrical connecting method 有权
标题翻译：电气连接方式
公开(公告)号：US07276924B2
公开(公告)日：2007-10-02
申请号：US10937401
申请日：2004-09-10
申请人： Shigeyuki Maruyama , Toru Nishino
发明人： Shigeyuki Maruyama , Toru Nishino
IPC分类号： G01R1/073 , G01R31/02
CPC分类号： G01R31/2875 , G01R1/0735
摘要： An electrical connecting method has the step of bringing a contact member connected to an electric circuit into contact with a terminal of an electronic part. A desired processing is performed by feeding current to the terminal via the contact member. The contact member is then separated from the terminal. When the contact member is brought into contact with the terminal, energy is applied to the contact member or the terminal in order to locally soften a portion of the terminal contacting the contact member. Thereafter, the desired processing is performed, in the state that the contacting portion of the terminal with the contact member is softened so as to reduce the contact resistance and so as to increase the subsequent separatability of the contact member from the terminal.
摘要翻译：电连接方法具有使与电路连接的接触构件与电子部件的端子接触的步骤。通过经由接触构件将电流馈送到端子来执行所需的处理。然后将接触构件与端子分离。当接触构件与端子接触时，能量被施加到接触构件或端子，以便局部软化接触接触构件的端子的一部分。此后，在端子与接触构件的接触部分被软化以便降低接触电阻并且增加接触构件与端子的随后的分离性的状态下进行所需的处理。

7. 发明申请

US20070096761A1 Semiconductor apparatus testing arrangement and semiconductor apparatus testing method 有权
标题翻译：半导体装置测试装置和半导体装置测试方法
公开(公告)号：US20070096761A1
公开(公告)日：2007-05-03
申请号：US11339826
申请日：2006-01-26
申请人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
发明人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
IPC分类号： G01R31/26
CPC分类号： G01R1/0433
摘要： A semiconductor apparatus testing arrangement for testing a plurality of semiconductor devices produced on a semiconductor substrate, has a substrate on which a plurality of testing units are arranged, each unit comprising a probe needles corresponding to electrode terminals of the semiconductor device and electric conductor parts connected with the probe needles.
摘要翻译：一种用于测试在半导体衬底上制造的多个半导体器件的半导体器件测试装置，具有布置有多个测试单元的衬底，每个单元包括与半导体器件的电极端子相对应的探针和连接的导体部件用探针。

8. 发明申请

US20060245161A1 Temperature control method and temperature control device 有权
标题翻译：温度控制方法和温度控制装置
公开(公告)号：US20060245161A1
公开(公告)日：2006-11-02
申请号：US11350894
申请日：2006-02-10
申请人： Shigeyuki Maruyama , Hiroshi Misawa , Naohito Kohashi
发明人： Shigeyuki Maruyama , Hiroshi Misawa , Naohito Kohashi
IPC分类号： H05K7/20
CPC分类号： G01R31/2874 , H01L2924/0002 , H01L2924/00
摘要： In a temperature control method, a controlled part is arranged to contact a first principal surface of a heat conduction part. The heat conduction part has the first principal surface and a second principal surface opposite to the first principal surface. The first principal surface has a configuration corresponding to a configuration of the controlled part. The second principal surface has an area larger than an area of the first principal surface. At least one of a heating unit and a cooling unit is driven to set the controlled part at a predetermined temperature. The heating unit and the cooling unit are disposed on the second principal surface of the heat conduction part so that the heating unit and the cooling unit are arranged side by side.
摘要翻译：在温度控制方法中，受控部件布置成接触导热部分的第一主表面。导热部分具有第一主表面和与第一主表面相对的第二主表面。第一主表面具有对应于受控部件的构造的构造。第二主表面的面积大于第一主表面的面积。驱动加热单元和冷却单元中的至少一个以将受控部件设定在预定温度。加热单元和冷却单元设置在导热部分的第二主表面上，使得加热单元和冷却单元并排布置。

9. 发明授权

US07112889B1 Semiconductor device having an alignment mark formed by the same material with a metal post 有权
公开(公告)号：US07112889B1
公开(公告)日：2006-09-26
申请号：US09577932
申请日：2000-05-25
申请人： Shigeyuki Maruyama , Yasuyuki Itoh , Tetsurou Honda , Kazuhiro Tashiro , Makoto Haseyama , Kenichi Nagashige , Yoshiyuki Yoneda , Hirohisa Matsuki
发明人： Shigeyuki Maruyama , Yasuyuki Itoh , Tetsurou Honda , Kazuhiro Tashiro , Makoto Haseyama , Kenichi Nagashige , Yoshiyuki Yoneda , Hirohisa Matsuki
IPC分类号： H01L23/544
CPC分类号： H01L22/12 , G01R31/2891 , H01L21/67282 , H01L21/6838 , H01L22/32 , H01L23/544 , H01L24/97 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/5448 , H01L2223/54493 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , Y10T29/49998 , Y10T279/11 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

10. 发明授权

US07038477B2 Contactor having conductive particles in a hole as a contact electrode 失效
公开(公告)号：US07038477B2
公开(公告)日：2006-05-02
申请号：US11023530
申请日：2004-12-29
申请人： Shigeyuki Maruyama , Susumu Kida , Naoyuki Watanabe , Takafumi Hashitani , Ei Yano , Ichiro Midorikawa
发明人： Shigeyuki Maruyama , Susumu Kida , Naoyuki Watanabe , Takafumi Hashitani , Ei Yano , Ichiro Midorikawa
IPC分类号： G01R31/02
CPC分类号： G01R1/06733 , G01R1/0483 , G01R1/06711 , G01R1/06755 , G01R1/07314 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式