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    • 5. 发明授权
    • Method of forming contacts for a semiconductor device
    • 形成半导体器件的触点的方法
    • US08222136B2
    • 2012-07-17
    • US12906868
    • 2010-10-18
    • Yuan-Tien TuTsai-Chun LiHuan-Just LinShih-Chang Chen
    • Yuan-Tien TuTsai-Chun LiHuan-Just LinShih-Chang Chen
    • H01L21/4763
    • H01L21/76814H01L21/02063H01L21/76816
    • The present disclosure provides a method of fabricating a semiconductor device. The method includes forming a layer over a substrate. The method includes forming a first opening in the layer that exposes a first region of the substrate. The method includes removing a first oxidation layer formed over the first region through a first sputtering process. The method includes filling the first opening with a conductive material. The method includes forming a second opening in the layer that exposes a second region of the substrate, the second region being different from the first region. The method includes removing a second oxidation layer formed over the second region through a second sputtering process. One of the first and second sputtering processes is more powerful than the other.
    • 本公开提供了制造半导体器件的方法。 该方法包括在衬底上形成层。 所述方法包括在所述层中形成暴露所述衬底的第一区域的第一开口。 该方法包括通过第一溅射工艺去除在第一区域上形成的第一氧化层。 该方法包括用导电材料填充第一开口。 所述方法包括在所述层中形成暴露所述衬底的第二区域的第二开口,所述第二区域不同于所述第一区域。 该方法包括通过第二溅射工艺除去在第二区域上形成的第二氧化层。 第一和第二溅射工艺之一比另一个更强大。