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    • 2. 发明申请
    • THIN FILM-LIKE POLYMER STRUCTURE AND METHOD FOR PREPARING THE SAME
    • 薄膜状聚合物结构及其制备方法
    • US20140158287A1
    • 2014-06-12
    • US13904882
    • 2013-05-29
    • Shinji Takeoka
    • Shinji TAKEOKAYosuke OKAMURAToshinori FUJIESaori UTSUNOMIYATakahiro GOTO
    • B32B37/02B32B38/10
    • B32B37/02A61K9/0014A61K9/70A61K9/7007B32B38/10C08J5/18C08J7/12C12N5/0068C12N2535/10Y10T156/10Y10T428/31504
    • A thin film polymer structure having a functional substance on the face (A surface) and reverse face (B surface) of the film, obtained by the steps of: (a) causing polyfunctional molecules to adsorb to an area of an arbitrary shape in an interface between a substrate body and a liquid phase; (b) polymerizing and/or crosslinking the adsorbing polyfunctional molecules to form a polymer thin film; (c) bonding a functional substance to the A surface of the formed thin film and then (d) forming a soluble support film thereon; exfoliating the thin film and the soluble support film from the substrate body; (e) bonding to the B surface of the thin film a functional substance identical to or different from the abovementioned functional substance and then dissolving the soluble support film with a solvent. A method for preparing a thin film molecular structure having a functional substance on the face (A surface) and reverse face (B surface) of the film is offered through the above process.
    • 一种薄膜聚合物结构,其具有通过以下步骤获得的膜的表面(A表面)和反面(B面)上的官能物质:(a)使多官能分子吸附在任意形状的区域中 基体与液相之间的界面; (b)使吸附的多官能分子聚合和/或交联以形成聚合物薄膜; (c)将功能性物质结合到所形成的薄膜的A表面上,然后(d)在其上形成可溶性载体膜; 将薄膜和可溶性支撑膜从基体体层剥离; (e)将与所述功能物质相同或不同的功能性物质与所述薄膜的B面接合,然后用溶剂溶解所述可溶性载体膜。 通过上述方法提供了在膜的表面(A表面)和反面(B面)上制备具有功能性物质的薄膜分子结构的方法。
    • 6. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08247873B2
    • 2012-08-21
    • US12621965
    • 2009-11-19
    • Shinji Takeoka
    • Shinji Takeoka
    • H01L29/76
    • H01L21/823468H01L21/823864H01L29/6656H01L29/6659H01L29/7833
    • A semiconductor device includes a first MISFET and a second MISFET, wherein the first MISFET includes a semiconductor substrate 100, a first gate insulating film 101a and a first gate electrode 102a formed on the first region of the semiconductor substrate, and first side walls (103a, 120a) formed on the side surface of the first gate electrode 102a, and the second MISFET includes a second gate insulating film 101b and a second gate electrode 102b formed on the second region of the semiconductor substrate 100, and second side walls (103b, 120b) formed on the side surface of the second gate electrode 102b. The width of the first side wall is smaller than the width of the second side wall, and the second side wall includes the second spacer 103b containing a higher concentration of hydrogen than the first spacer 103a.
    • 半导体器件包括第一MISFET和第二MISFET,其中第一MISFET包括形成在半导体衬底的第一区域上的半导体衬底100,第一栅极绝缘膜101a和第一栅电极102a以及第一侧壁(103a ,120a),并且第二MISFET包括形成在半导体衬底100的第二区域上的第二栅极绝缘膜101b和第二栅极电极102b,以及第二侧壁(103b, 120b)形成在第二栅电极102b的侧表面上。 第一侧壁的宽度小于第二侧壁的宽度,并且第二侧壁包括含有比第一间隔件103a更高浓度的氢的第二间隔件103b。