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1. 发明授权

US07723845B2 System and method of a heat transfer system with an evaporator and a condenser 有权
标题翻译：具有蒸发器和冷凝器的传热系统的系统和方法
公开(公告)号：US07723845B2
公开(公告)日：2010-05-25
申请号：US11932911
申请日：2007-10-31
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： H01L23/12 , H01L31/028
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环形热管）和CPL（毛细管泵浦环），以实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（μLHP™）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。

2. 发明申请

US20070095507A1 SILICON MEMS BASED TWO-PHASE HEAT TRANSFER DEVICE 失效
标题翻译：硅基MEMS双相传热装置
公开(公告)号：US20070095507A1
公开(公告)日：2007-05-03
申请号：US11530107
申请日：2006-09-08
申请人： H. Henderson , Ahmed Shuja , Srinivas Parimi , Frank Gerner , Praveen Medis
发明人： H. Henderson , Ahmed Shuja , Srinivas Parimi , Frank Gerner , Praveen Medis
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60W/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor. In the cooling of a laptop computer processor the device could be attached to the processor during laptop assembly. Consistent with efforts to miniaturize electronics components, the current invention can be directly integrated with a unpackaged chip. For applications requiring larger cooling surface areas, the planar evaporators can be spread out in a matrix and integrally connected through properly sized manifold systems.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环形热管）和CPL（毛细管泵浦环），以实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（muLHP TM）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60W / cm 2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。在笔记本电脑处理器的冷却中，该设备可以在笔记本电脑组装期间连接至处理器。与电子元件小型化的努力一致，本发明可直接与未封装的芯片集成。对于需要较大冷却表面积的应用，平面蒸发器可以以矩阵形式展开并通过适当尺寸的歧管系统整体连接。

3. 发明授权

US07705342B2 Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes 失效
公开(公告)号：US07705342B2
公开(公告)日：2010-04-27
申请号：US11530107
申请日：2006-09-08
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： H01L47/00 , H01L23/06
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 W/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.In the cooling of a laptop computer processor the device could be attached to the processor during laptop assembly. Consistent with efforts to miniaturize electronics components, the current invention can be directly integrated with a unpackaged chip. For applications requiring larger cooling surface areas, the planar evaporators can be spread out in a matrix and integrally connected through properly sized manifold systems.

4. 发明申请

US20080115912A1 SEMICONDUCTOR-BASED POROUS STRUCTURE 有权
标题翻译：基于半导体的多孔结构
公开(公告)号：US20080115912A1
公开(公告)日：2008-05-22
申请号：US11932951
申请日：2007-10-31
申请人： H. Thurman HENDERSON , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman HENDERSON , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： F28D15/00
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.In the cooling of a laptop computer processor the device could be attached to the processor during laptop assembly. Consistent with efforts to miniaturize electronics components, the current invention can be directly integrated with a unpackaged chip. For applications requiring larger cooling surface areas, the planar evaporators can be spread out in a matrix and integrally connected through properly sized manifold systems.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环形热管）和CPL（毛细管泵浦环），以实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（muLHP TM）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm 2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。在笔记本电脑处理器的冷却中，该设备可以在笔记本电脑组装期间连接至处理器。与电子元件小型化的努力一致，本发明可直接与未封装的芯片集成。对于需要较大冷却表面积的应用，平面蒸发器可以以矩阵形式展开并通过适当尺寸的歧管系统整体连接。

5. 发明申请

US20080115913A1 METHOD OF FABRICATING SEMICONDUCTOR-BASED POROUS STRUCTURE 审中-公开
标题翻译：制备基于半导体的多孔结构的方法
公开(公告)号：US20080115913A1
公开(公告)日：2008-05-22
申请号：US11933000
申请日：2007-10-31
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： F28D15/00
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.In the cooling of a laptop computer processor the device could be attached to the processor during laptop assembly. Consistent with efforts to miniaturize electronics components, the current invention can be directly integrated with a unpackaged chip. For applications requiring larger cooling surface areas, the planar evaporators can be spread out in a matrix and integrally connected through properly sized manifold systems.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环形热管）和CPL（毛细管泵浦环），以实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（muLHP TM）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm 2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。在笔记本电脑处理器的冷却中，该设备可以在笔记本电脑组装期间连接至处理器。与电子元件小型化的努力一致，本发明可直接与未封装的芯片集成。对于需要较大冷却表面积的应用，平面蒸发器可以以矩阵形式展开并通过适当尺寸的歧管系统整体连接。

6. 发明申请

US20080110598A1 SYSTEM AND METHOD OF A HEAT TRANSFER SYSTEM AND A CONDENSOR 有权
标题翻译：传热系统和冷凝器的系统和方法
公开(公告)号：US20080110598A1
公开(公告)日：2008-05-15
申请号：US11932911
申请日：2007-10-31
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： F28D15/00
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.In the cooling of a laptop computer processor the device could be attached to the processor during laptop assembly. Consistent with efforts to miniaturize electronics components, the current invention can be directly integrated with a unpackaged chip. For applications requiring larger cooling surface areas, the planar evaporators can be spread out in a matrix and integrally connected through properly sized manifold systems.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环形热管）和CPL（毛细管泵浦环），以实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（muLHP TM）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm 2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。在笔记本电脑处理器的冷却中，该设备可以在笔记本电脑组装期间连接至处理器。与电子元件小型化的努力一致，本发明可直接与未封装的芯片集成。对于需要较大冷却表面积的应用，平面蒸发器可以以矩阵形式展开并通过适当尺寸的歧管系统整体连接。

7. 发明授权

US07692926B2 Integrated thermal systems 失效
标题翻译：集成热系统
公开(公告)号：US07692926B2
公开(公告)日：2010-04-06
申请号：US11932969
申请日：2007-10-31
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： H05K7/20
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环路热管）和CPL（毛细管泵浦环路）来实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（μLHP™）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。

8. 发明授权

US07723760B2 Semiconductor-based porous structure enabled by capillary force 有权
标题翻译：通过毛细管力实现基于半导体的多孔结构
公开(公告)号：US07723760B2
公开(公告)日：2010-05-25
申请号：US11932951
申请日：2007-10-31
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： H01L31/028
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环形热管）和CPL（毛细管泵浦环），以实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（μLHP™）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。

9. 发明申请

US20080128898A1 INTEGRATED THERMAL SYSTEMS 失效
标题翻译：集成热系统
公开(公告)号：US20080128898A1
公开(公告)日：2008-06-05
申请号：US11932969
申请日：2007-10-31
申请人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
发明人： H. Thurman Henderson , Ahmed Shuja , Srinivas Parimi , Frank M. Gerner , Praveen Medis
IPC分类号： H01L23/34 , F28D15/00
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/09701 , Y10S165/218 , Y10T29/49396 , H01L2924/00
摘要： The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.In the cooling of a laptop computer processor the device could be attached to the processor during laptop assembly. Consistent with efforts to miniaturize electronics components, the current invention can be directly integrated with a unpackaged chip. For applications requiring larger cooling surface areas, the planar evaporators can be spread out in a matrix and integrally connected through properly sized manifold systems.
摘要翻译：本发明是使用半导体级硅和微光刻/各向异性蚀刻技术的基于MEMS的两相LHP（环路热管）和CPL（毛细管泵浦环路）来实现平面配置。主要的工作材料是硅（和必要时兼容的硼硅酸盐玻璃），特别与电子和计算机芯片和封装冷却的冷却需求相兼容。微循环热管（muLHP TM）利用尖端微加工技术。该设备没有泵或运动部件，并且能够使用革命性的相干多孔硅（CPS）灯芯以高功率密度移动热量。 CPS灯芯将封装热失配应力最小化，并提高强度重量比。当连续孔的直径可以亚微米级控制时，也可以控制爆破压力。两相平面操作提供极低的比热阻（20-60w / cm 2）。该操作取决于独特的微电极CPS灯芯，其包含高达数百万个每平方厘米的半导体级硅中的堆叠的均匀微通毛细管，其用作毛细管“发动机”，与毛细管的随机分布相反典型的热管灯芯。与所有热管一样，由于通过工作流体相变的潜热进入蒸气而将热量提取出来，发生冷却。在笔记本电脑处理器的冷却中，该设备可以在笔记本电脑组装期间连接至处理器。与电子元件小型化的努力一致，本发明可直接与未封装的芯片集成。对于需要较大冷却表面积的应用，平面蒸发器可以以矩阵形式展开并通过适当尺寸的歧管系统整体连接。

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