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1. 发明授权

US08684540B2 Optical projection apparatus 有权
标题翻译：光投影装置
公开(公告)号：US08684540B2
公开(公告)日：2014-04-01
申请号：US13378308
申请日：2010-06-15
申请人： Stefan Grötsch , Simon Kocur , Matthias Sabathil
发明人： Stefan Grötsch , Simon Kocur , Matthias Sabathil
IPC分类号： G03B21/20 , G03B21/26 , F21V9/00 , F21V9/16 , F21V23/02
CPC分类号： H04N9/3111 , G03B21/2013 , G03B21/204 , G03B33/08 , H01L25/0756 , H01L27/15 , H01L33/22 , H01L33/382 , H01L2924/0002 , H04N9/3164 , H01L2924/00
摘要： An optical projection apparatus includes a first light source, a second light source, and an imaging element, which is illuminated by the first light source and the second light source during operation. The light source includes a light-emitting diode chip that emits red light during operation. The second light source includes a first light-emitting diode chip, which emits green light during operation. A second light-emitting diode chip emits blue light during operation. The second light-emitting diode chip is arranged on the first light-emitting diode chip at a radiation exit surface of the first light-emitting diode chip. Electromagnetic radiation generated in the first light-emitting diode chip during operation passes through the second light-emitting diode chip.
摘要翻译：光学投影设备包括第一光源，第二光源和成像元件，其在操作期间由第一光源和第二光源照射。光源包括在操作期间发出红光的发光二极管芯片。第二光源包括在操作期间发出绿光的第一发光二极管芯片。第二个发光二极管芯片在运行期间发出蓝光。第二发光二极管芯片被布置在第一发光二极管芯片的第一发光二极管芯片的辐射出射表面处。在操作中在第一发光二极管芯片中产生的电磁辐射通过第二发光二极管芯片。

2. 发明授权

US08154031B2 Module comprising radiation-emitting semiconductor bodies 有权
标题翻译：模块包括辐射发射半导体体
公开(公告)号：US08154031B2
公开(公告)日：2012-04-10
申请号：US11885204
申请日：2006-02-10
申请人： Stefan Grötsch , Berthold Hahn , Stefan Illek , Wolfgang Schnabel
发明人： Stefan Grötsch , Berthold Hahn , Stefan Illek , Wolfgang Schnabel
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/20 , H01L33/62 , H01L2224/48137 , H01L2924/0102 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041
摘要： A module comprising a regular arrangement of individual radiation-emitting semiconductor bodies (1) which are applied on a mounting area (6) of a carrier (2), wherein a wire connection is fitted between two adjacent radiation-emitting semiconductor bodies (1) on a top side, opposite to the mounting area (6), of the two radiation-emitting semiconductor bodies (1).
摘要翻译：一种模块，包括施加在载体（2）的安装区域（6）上的各个辐射发射半导体体（1）的规则排列，其中，线连接装配在两个相邻的发射辐射半导体体（1）之间，在两个辐射发射半导体本体（1）的顶侧上与安装区域（6）相对。

3. 发明申请

US20100295073A1 Optoelectronic Semiconductor Chip 有权
标题翻译：光电半导体芯片
公开(公告)号：US20100295073A1
公开(公告)日：2010-11-25
申请号：US12666557
申请日：2008-06-23
申请人： Stefan Grötsch , Norbert Linder
发明人： Stefan Grötsch , Norbert Linder
IPC分类号： H01L33/46
CPC分类号： H01L33/46 , H01L33/405 , H01L33/44 , H01L2224/48091 , H01L2224/48464 , H01L2924/00014
摘要： An optoelectronic semiconductor chip (1) comprises a radiation passage area (3), a contact metallization (2a) applied to the radiation passage area (3), and a first reflective layer sequence (2b) applied to that surface of the contact metallization (2a) which is remote from the radiation passage area (3). An optoelectronic component comprising such a chip is also specified.
摘要翻译：光电子半导体芯片（1）包括辐射通道区域（3），施加到辐射通道区域（3）的接触金属化（2a）和应用于接触金属化表面的第一反射层序列（2b） 2a），其远离辐射通道区域（3）。还规定了包括这种芯片的光电子部件。

4. 发明申请

US20100230697A1 OPTO-ELECTRONIC SEMICONDUCTOR MODULE AND METHOD FOR THE PRODUCTION THEREOF 有权
标题翻译： OPTO-ELECTRONIC SEMICONDUCTOR MODULLE AND METHOD FOR PRODUCTION THEREOF
公开(公告)号：US20100230697A1
公开(公告)日：2010-09-16
申请号：US12673800
申请日：2008-08-11
申请人： Steffen Köhler , Moritz Engl , Frank Singer , Stefan Grötsch , Thomas Zeiler , Mathias Weiss
发明人： Steffen Köhler , Moritz Engl , Frank Singer , Stefan Grötsch , Thomas Zeiler , Mathias Weiss
IPC分类号： H01L33/48 , H01L33/60 , H01L21/50
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0058 , H01L2924/00
摘要： An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.
摘要翻译：光电子半导体模块包括芯片载体，安装在芯片载体上的发光半导体芯片和具有至少部分透光的盖板的覆盖元件，该盖元件布置在半导体芯片背离芯片载体的一侧，并且具有框架部分，其中横向包围半导体芯片的框架部分以接合层的方式接合到盖板并且在远离盖板的一侧与芯片载体相连接。

5. 发明授权

US07510890B2 Method for producing a luminescence diode chip 有权
标题翻译：发光二极管芯片的制造方法
公开(公告)号：US07510890B2
公开(公告)日：2009-03-31
申请号：US10979359
申请日：2004-11-01
申请人： Hubert Ott , Stefan Grötsch , Herbert Brunner
发明人： Hubert Ott , Stefan Grötsch , Herbert Brunner
IPC分类号： H01L21/00
CPC分类号： H01L33/58 , H01L33/507 , H01L2224/48091 , H01L2924/00014
摘要： A method for producing a luminescence diode chip, in which provision is made of a semiconductor body is provided having an epitaxially grown semiconductor layer sequence having an active zone and a radiation coupling-out area, the active zone emitting an electromagnetic radiation during operation of the luminescence diode, a large part of said electromagnetic radiation being coupled out via the radiation coupling-out area. A luminescence conversion material is arranged downstream of the radiation coupling-out area in an emission direction of the semiconductor body. A radiation-transmissive covering body having a first main area, a second main area opposite to the first main area, and also side areas connecting the first and second main areas. The covering body is applied to the radiation coupling-out area of the semiconductor layer sequence in such a way that the first main area faces the radiation coupling-out area. The application of the covering body is preceded by the application of a first conversion layer, having a luminescence conversion material, to the first main area of the covering body.
摘要翻译：提供一种制造发光二极管芯片的方法，其中提供具有半导体本体的外延生长的半导体层序列，其具有活性区和辐射耦合区域，所述有源区域在操作期间发射电磁辐射发光二极管，所述电磁辐射的大部分经由辐射耦合输出区被耦合输出。发光转换材料被布置在半导体本体的发射方向上的辐射耦合输出区域的下游。具有第一主区域，与第一主区域相对的第二主区域以及连接第一主区域和第二主区域的侧面区域的辐射透射覆盖体。将覆盖体施加到半导体层序列的辐射耦合出区域，使得第一主区域面向辐射耦合输出区域。覆盖体的应用之前是将具有发光转换材料的第一转换层应用于覆盖体的第一主区域。

6. 发明授权

US07501660B2 Housing for an electronic component 有权
标题翻译：电子部件的外壳
公开(公告)号：US07501660B2
公开(公告)日：2009-03-10
申请号：US11169861
申请日：2005-06-29
申请人： Josef Schmid , Stefan Grötsch , Michael Hiegler , Moritz Engl , Georg Bogner , Karlheinz Arndt , Markus Schneider
发明人： Josef Schmid , Stefan Grötsch , Michael Hiegler , Moritz Engl , Georg Bogner , Karlheinz Arndt , Markus Schneider
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L31/0203 , H01L23/60 , H01L25/167 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01068 , H01L2924/12041 , H01L2924/00014
摘要： A housing is specified for an electronic component having at least two connecting parts (4a, 4b), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (2), which is connected in parallel with an electronic component (1), and provides ESD protection for the component (1).
摘要翻译：为具有至少两个与壳体接触的连接部分（4a，4b）的电子部件规定了外壳。壳体的至少子区域的电导率被设定为限定的方式，并且通过壳体的电流通路形成在连接部件之间。因此，壳体具有与电子部件（1）并联连接的限定电阻（2），并为部件（1）提供ESD保护。

7. 发明授权

US07414269B2 Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component 有权
标题翻译：用于辐射发射部件的壳体，其制造方法和辐射发射部件
公开(公告)号：US07414269B2
公开(公告)日：2008-08-19
申请号：US10558461
申请日：2004-05-28
申请人： Stefan Grötsch , Patrick Kromotis
发明人： Stefan Grötsch , Patrick Kromotis
IPC分类号： H01L27/15 , H01L21/00
CPC分类号： F21K99/00 , F21Y2115/10 , H01L25/0753 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： The invention proposes a housing for at least two radiation-emitting components, particularly LEDs, comprising a system carrier (1) and a reflector arrangement (2) disposed on said system carrier (1), the reflector arrangement comprising a number of reflectors each of which serves to receive at least one radiation-emitting component and which are fastened to one another by means of a holding device (4).
摘要翻译：本发明提出了一种用于至少两个辐射发射部件（特别是LED）的壳体，其包括设置在所述系统载体（1）上的系统载体（1）和反射器装置（2），所述反射器装置包括多个反射器其用于接收至少一个辐射发射部件，并且通过保持装置（4）彼此紧固。

8. 发明授权

US06835603B2 Method for producing semiconductor laser components 有权
标题翻译：半导体激光器部件的制造方法
公开(公告)号：US06835603B2
公开(公告)日：2004-12-28
申请号：US09932878
申请日：2001-08-20
申请人： Bruno Acklin , Stefan Grötsch
发明人： Bruno Acklin , Stefan Grötsch
IPC分类号： H01L2150
CPC分类号： H01S5/02476 , H01L21/4875 , H01L2224/48463 , H01S5/02272 , H01S5/4025
摘要： A method for producing semiconductor laser components in which, a number of chip mounting areas are formed on a cooling element having an electrically insulating carrier that is in the form of a plate. A number of semiconductor laser chips are then fit to the cooling element, with one semiconductor laser chip being arranged on each chip mounting area. Finally, the cooling element, with the semiconductor bodies fit on it, is subdivided into a number of semiconductor laser components.
摘要翻译：一种制造半导体激光器部件的方法，其中在具有板状形式的电绝缘载体的冷却元件上形成有多个芯片安装区域。然后将多个半导体激光芯片装配到冷却元件，在每个芯片安装区域上设置一个半导体激光器芯片。最后，将半导体本体安装在其上的冷却元件被细分成多个半导体激光器部件。

9. 发明授权

US09666756B2 Optoelectronic semiconductor module and display having a plurality of such modules 有权
公开(公告)号：US09666756B2
公开(公告)日：2017-05-30
申请号：US14115697
申请日：2012-03-16
申请人： Norwin von Malm , Georg Bogner , Joachim Reill , Stefan Grötsch
发明人： Norwin von Malm , Georg Bogner , Joachim Reill , Stefan Grötsch
IPC分类号： H01L33/00 , H01L33/08 , F21K9/00 , F21S8/10 , H01L25/16 , H01L25/075 , H01L33/20 , F21Y105/12 , F21Y115/10 , F21Y105/14
CPC分类号： H01L33/08 , F21K9/00 , F21S41/141 , F21S41/143 , F21S41/18 , F21S41/663 , F21Y2105/12 , F21Y2105/14 , F21Y2115/10 , H01L25/0753 , H01L25/167 , H01L33/20 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic semiconductor module includes a plurality of light-emitting areas, which emit light when in operation. At least two abutting lateral edges of at least one light-emitting area are arranged at an angle of more than 0 degrees and less than 90 degrees to each other. Further embodiments relate to a display having a plurality of such modules.

10. 发明授权

US08373186B2 Radiation-emitting component 有权
公开(公告)号：US08373186B2
公开(公告)日：2013-02-12
申请号：US12677320
申请日：2008-08-28
申请人： Stefan Grötsch , Jan Marfeld , Jörg Erich Sorg , Moritz Engl , Steffen Köhler
发明人： Stefan Grötsch , Jan Marfeld , Jörg Erich Sorg , Moritz Engl , Steffen Köhler
IPC分类号： H01L33/58
CPC分类号： H01L33/60 , H01L33/44 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.

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