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1. 发明授权

US10128584B2 Elastic electric contact terminal with improved environmental resistance and fabrication method therefor 有权
公开(公告)号：US10128584B2
公开(公告)日：2018-11-13
申请号：US15463509
申请日：2017-03-20
申请人： JOINSET CO., LTD. , Sun-Ki Kim
发明人： Sun-Ki Kim
IPC分类号： H01R4/58 , H01R4/62 , H01R12/57 , H01R43/00 , H05K1/11 , H05K3/34 , H01R11/01 , H01R13/6584 , H01R13/24
摘要： Disclosed is an elastic electric contact terminal comprising: an elastic core; a polymer film which is bonded while covering the core, with an adhesive layer being interposed therebetween; and a copper foil capable of being soldered, which is bonded while covering the polymer film. A metal plating layer is formed on every surface exposed outwardly from the copper foil.

2. 发明申请

US20180054049A1 INSERT DEVICE TO BE INSERTED INTO OR WITHDRAWN OUT OF HOLLOW ELECTRICAL-DEVICE FRAME BURIED IN WALL IN BUILDING CONSTRUCTION 审中-公开
公开(公告)号：US20180054049A1
公开(公告)日：2018-02-22
申请号：US15629784
申请日：2017-06-22
申请人： SUN KI KIM
发明人： KWANG SOO KIM
IPC分类号： H02G3/08 , H02G3/14 , H02G3/10
CPC分类号： H02G3/081 , H02G3/10 , H02G3/14
摘要： There is provided an insert device configured be inserted into or withdrawn out of a hollow electrical-device frame buried in a wall in a building construction, the device comprising: an inserted portion configured to be inserted into or withdrawn out of the hollow electrical-device frame buried in the wall; and a grip portion coupled to the inserted portion, wherein the grip portion is configured to be gripped by an user to allow the inserted portion to be withdrawn out of the frame, wherein the inserted portion has a size and a shape such that the inserted portion is in close contact with an entire inner surface of the hollow electrical-device frame.

3. 发明授权

US09306308B2 Surface-mount type electric connecting terminal, and electronic module unit and circuit board using the same 有权
公开(公告)号：US09306308B2
公开(公告)日：2016-04-05
申请号：US14315673
申请日：2014-06-26
申请人： JOINSET CO., LTD. , Sun-Ki Kim
发明人： Sun-Ki Kim , Tae-Man Kang
IPC分类号： H01R13/24 , H01R4/02 , H01R12/57 , H01R12/71 , H05K3/34
CPC分类号： H01R13/2428 , H01R4/028 , H01R12/57 , H01R12/718 , H01R13/2421 , H05K3/341 , H05K2201/1031 , Y02P70/611
摘要： Provided is a surface-mount type electric connecting terminal which is disposed between opposing conductive objects and is configured to electrically connecting the objects while easily adjusting pressing force and recovery force. The electric connecting terminal includes a cylindrical fixed member which is made from a metallic material; a cylindrical movable member which is slidably inserted in the fixed member and is made from a metallic material; and an electrical conductive spring which is accommodated in the fixed member and whose one end contacts with the bottom of the fixed member and the other end contacts with the bottom of the movable member for thereby allowing the movable member to elastically slide against the fixed member.

4. 发明授权

US08599539B2 Ceramic chip assembly 有权
标题翻译：陶瓷芯片组装
公开(公告)号：US08599539B2
公开(公告)日：2013-12-03
申请号：US13193836
申请日：2011-07-29
申请人： Sun-Ki Kim , Seong-Jin Lee , Ki-Han Park
发明人： Sun-Ki Kim , Seong-Jin Lee , Ki-Han Park
IPC分类号： H05K7/00 , H05K3/10
CPC分类号： G01K7/16 , G01K1/08 , H01C1/028 , H01C7/008 , H01G2/103 , H01G4/224 , H01G4/236 , H01L2924/0002 , H01L2924/00
摘要： Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant.
摘要翻译：提供了一种陶瓷芯片组件，其被配置为经济地且可靠地将金属引线的暴露部分与环境变化绝缘。陶瓷芯片组件包括具有电特性的陶瓷基体，分别设置在陶瓷基体的一对表面上的一对外部电极，陶瓷基体的彼此相对的表面，一对金属引线作为具有分别通过导电性粘接部件，绝缘密封剂密封陶瓷基体，外部电极以及金属引线的第一端部的绝缘密封材料而分别与外部电极电连接和机械连接的第一端的单芯金属引线的端部和连续地形成在绝缘密封剂和从绝缘密封剂露出的金属引线的部分上的绝缘聚合物涂层。

5. 发明申请

US20110299645A1 Breeding Nuclear Fuel Mixture Using Metallic Thorium 审中-公开
标题翻译：使用金属钍培育核燃料混合物
公开(公告)号：US20110299645A1
公开(公告)日：2011-12-08
申请号：US13152884
申请日：2011-06-03
申请人： Dae-Ho Kim , Je-Geon Bang , Yang-Hyun Koo , Ik-Sung Lim , Sun-Ki Kim , Yong-Sik Yang , Kun-Woo Song
发明人： Dae-Ho Kim , Je-Geon Bang , Yang-Hyun Koo , Ik-Sung Lim , Sun-Ki Kim , Yong-Sik Yang , Kun-Woo Song
IPC分类号： G21G1/06 , G21C3/32 , G21C3/36 , G21C3/02
CPC分类号： G21G1/02 , G21C3/32 , G21C3/36 , G21C3/64 , Y02E30/38
摘要： Disclosed is a breeding nuclear fuel mixture including metallic thorium useable in a nuclear power plant, prepared by mixing uranium dioxide (UO2) or plutonium dioxide (PuO2) having ceramic properties with metallic thorium (Th), in order to enable thorium breeding by neutrons released during nuclear fission of U or Pu and conversion of the bred thorium into a novel nuclear fissile material, i.e., U-233, thereby ensuring continuous nuclear fission. The foregoing nuclear fuel mixture may be burned at a reactor core of a nuclear power plant through thorium breeding over a long period of time. Therefore, when the inventive breeding nuclear fuel mixture is employed in a nuclear power plant, utilization of the nuclear power plant may be increased while maximizing conservation of limited uranium resources.
摘要翻译：公开了通过将具有陶瓷性质的二氧化铀（UO 2）或二氧化钚（PuO 2）与金属钍（Th）混合制备的核动力装置中可用的金属钍的育种核燃料混合物，以便能够释放中子进行钍培养在U或Pu的核裂变过程中，将养殖钍转化为新的核裂变材料，即U-233，从而确保连续的核裂变。上述核燃料混合物可以在核电厂的反应堆堆芯上长时间通过钍繁殖而燃烧。因此，当在核电站中使用本发明的育种核燃料混合物时，可以增加核电站的利用，同时最大限度地保护有限的铀资源。

6. 发明申请

US20110284271A1 HEAT SINK 有权
标题翻译：散热器
公开(公告)号：US20110284271A1
公开(公告)日：2011-11-24
申请号：US12782267
申请日：2010-05-18
申请人： Sun-Ki KIM
发明人： Sun-Ki KIM
IPC分类号： H05K1/00 , H01L23/36
CPC分类号： H01L23/427 , H01L23/36 , H01L23/3677 , H01L33/642 , H01L33/648 , H01L2924/0002 , H05K1/0203 , H05K1/0206 , H05K2201/066 , H01L2924/00
摘要： A heat sink capable of being surface-mounted, the heat sink having a 3D shape and comprising a body made of metal, having a rear side which is horizontal and a front side which is at least partially horizontal, such that the front side is partially surface-mounted on a conductive pattern of a printed circuit board (PCB) by pick-and-place and the rear side is attached to the conductive pattern by reflow-soldering.
摘要翻译：一种能够被表面安装的散热器，散热器具有3D形状并且包括由金属制成的主体，其具有水平的后侧和至少部分水平的前侧，使得前侧部分地通过拾取放置在表面安装在印刷电路板（PCB）的导电图案上，并且后侧通过回流焊接附接到导电图案。

7. 发明申请

US20110188226A1 SHIELD APPARATUS FOR EMI SHIELDING 审中-公开
标题翻译：用于EMI屏蔽的屏蔽装置
公开(公告)号：US20110188226A1
公开(公告)日：2011-08-04
申请号：US12957762
申请日：2010-12-01
申请人： Sun-Ki KIM
发明人： Sun-Ki KIM
IPC分类号： H05K9/00
CPC分类号： H05K9/00
摘要： A shield apparatus for EMI (ElectroMagnetic Interference) shielding is provided. The shield apparatus includes a case and a metal clip. The case is box-shaped with at least one open side, and has a recess defined from the open side into a sidewall. The metal clip is housed in the recess, and is resiliently inserted on the sidewall to retain a certain height.
摘要翻译：提供了一种用于EMI（电磁干扰）屏蔽的屏蔽装置。屏蔽装置包括壳体和金属夹子。壳体是具有至少一个敞开侧的箱形，并且具有从敞开侧限定为侧壁的凹部。金属夹被容纳在凹部中，并且弹性插入在侧壁上以保持一定的高度。

8. 发明授权

US07931475B2 Solderable elastic electric contact terminal 有权
标题翻译：可焊接弹性电接触端子
公开(公告)号：US07931475B2
公开(公告)日：2011-04-26
申请号：US12393948
申请日：2009-02-26
申请人： Sun-Ki Kim , Sung-Ho Cho , Han-Jin Cheon , Hwan-min Yeo
发明人： Sun-Ki Kim , Sung-Ho Cho , Han-Jin Cheon , Hwan-min Yeo
IPC分类号： H01R12/00
CPC分类号： H05K3/4015 , H01R12/57 , H01R12/714 , H01R13/24 , H05K3/222 , H05K3/325 , H05K3/341 , H05K2201/0133 , H05K2201/0154 , H05K2201/083
摘要： Provided is a solderable elastic electric contact terminal. The solderable elastic electric contact terminal includes a tube-shaped insulating elastic core, an insulating non-foam rubber coating layer adhered to the insulating elastic core to surround the insulating elastic core, and a heat-resistant polymer film having one surface adhered to the insulating non-foam rubber coating layer to surround the insulating non-foam rubber coating layer, and another surface integrally provided with a metal layer.
摘要翻译：提供了可焊接的弹性电接触端子。可焊接弹性电接触端子包括管状绝缘弹性芯，粘附到绝缘弹性芯以包围绝缘弹性芯的绝缘非泡沫橡胶涂层，以及耐热聚合物膜，其一个表面粘附到绝缘非泡沫橡胶涂层包围绝缘非泡沫橡胶涂层，以及一体地设置有金属层的另一表面。

9. 发明申请

US20090209121A1 Solderable Electric Contact Terminal 有权
标题翻译：可焊接电接点
公开(公告)号：US20090209121A1
公开(公告)日：2009-08-20
申请号：US12308243
申请日：2007-02-22
申请人： Sun-Ki Kim , Seung-Jin Lee
发明人： Sun-Ki Kim , Seung-Jin Lee
IPC分类号： H01R12/00
CPC分类号： H01R13/2414 , H05K3/341 , H05K3/4015 , H05K2201/0133 , H05K2201/056 , Y10S439/927
摘要： A solderable electric contact terminal includes; an insulating foam rubber having a predetermined volume; an insulating non-foam rubber coating layer adhered to the insulating foam rubber such that the insulating non-foam rubber encloses the insulating foam rubber; and a heat resistant polymer film having inner surface adhered to the insulating non-foam rubber coating layer such that the heat resistant polymer film encloses the insulating non-foam rubber coating layer, and outer surface on which a metal layer is integrally formed.
摘要翻译：可焊接电接触端子包括：具有预定体积的绝缘泡沫橡胶; 绝缘非泡沫橡胶涂层粘附到绝缘泡沫橡胶上，使得绝缘非泡沫橡胶包围绝缘泡沫橡胶; 以及耐热聚合物膜，其具有粘附到绝缘非泡沫橡胶涂层的内表面，使得耐热聚合物膜包围绝缘非泡沫橡胶涂层以及金属层整体形成的外表面。

10. 发明授权

US07368933B2 Method for testing standby current of semiconductor package 失效
标题翻译：半导体封装待机电流测试方法
公开(公告)号：US07368933B2
公开(公告)日：2008-05-06
申请号：US11335270
申请日：2006-01-18
申请人： Moon-Bo Sim , Joo-Seok Kwak , Seong-Su Kim , Yun-Bo Yang , Sun-Ki Kim
发明人： Moon-Bo Sim , Joo-Seok Kwak , Seong-Su Kim , Yun-Bo Yang , Sun-Ki Kim
IPC分类号： G01R31/01 , G01R31/28 , G01R31/26
CPC分类号： G01R31/3008
摘要： A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chips, and storing the measured values of standby current in a database, by using a wafer tester; recognizing a wafer run number of each of semiconductor packages to be tested; downloading measured values of standby current of semiconductor chips corresponding to the recognized wafer run number from the database to a semiconductor package tester; extracting a boundary value defining predetermined upper values of the downloaded measured values of standby current, by using the semiconductor package tester; setting the boundary value as a standby current limit of a program for testing the semiconductor packages by use of the semiconductor package tester; and testing the semiconductor packages based on the standby current limit.
摘要翻译：提供一种用于测试半导体封装的待机电流的系统和方法。该方法包括测试形成在具有预定晶圆行程号的晶片上的半导体芯片，收集半导体芯片的待机电流的测量值，并通过使用晶片测试器将待机电流的测量值存储在数据库中; 识别要测试的每个半导体封装的晶片运行次数; 将与识别的晶片运行数相对应的半导体芯片的待机电流的测量值从数据库下载到半导体封装测试器; 通过使用半导体封装测试器提取定义下载的待机电流测量值的预定上限值的边界值; 将边界值设置为通过使用半导体封装测试器来测试半导体封装的程序的备用电流极限; 并根据待机电流限制测试半导体封装。

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