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1. 发明授权

US09865946B2 Mounting structure of terminal on printed wiring board 有权
公开(公告)号：US09865946B2
公开(公告)日：2018-01-09
申请号：US14462770
申请日：2014-08-19
申请人： YAZAKI CORPORATION
发明人： Kazunori Miura
IPC分类号： H01R12/72 , H01R12/57 , H01R4/02 , H01R12/70 , H01R12/71 , H01R12/73 , H01R12/79
CPC分类号： H01R12/7005 , H01R4/028 , H01R12/57 , H01R12/716 , H01R12/727 , H01R12/73 , H01R12/79
摘要： A mounting structure includes a printed wiring board, a connector housing mounted on the printed wiring board, and a plurality of terminals retained by the connector housing. Tail surfaces of the plurality of terminals are respectively positioned opposite upper surfaces of a plurality of conductor patterns laid on the printed wiring board, and tails of the plurality of terminals are respectively soldered to the plurality of conductor patterns. The connector housing has a side surface provided with a plurality of grooves formed by partitions, and the tails of the plurality of terminals are respectively placed in the plurality of grooves, and a clearance is formed between a side surface of each tail of the plurality of terminals and a corresponding one of the partitions.

2. 发明授权

US09819129B2 Hard disk drive with feedthrough connector 有权
公开(公告)号：US09819129B2
公开(公告)日：2017-11-14
申请号：US14046424
申请日：2013-10-04
申请人： HGST Netherlands B.V.
发明人： Noritaka Otake , Hiroshi Matsuda , Katsumasa Nakatsukasa , Kouki Uefune
IPC分类号： H01R13/74 , G11B33/14 , H01R4/02 , H01R43/02 , G11B25/04 , H05K5/06 , B23K1/00
CPC分类号： H01R13/74 , B23K1/0016 , G11B25/043 , G11B33/1446 , G11B33/1466 , H01R4/028 , H01R43/0235 , H05K5/069
摘要： Described herein is an apparatus that includes a housing that defines an interior cavity. The housing also includes a feedthrough aperture. The apparatus also includes an electrical connector that is coupled to the housing over the feedthrough aperture. The electrical connector includes a base, a plurality of pins extending through the base, and a skirt positioned about a periphery of the base. The pins extend from a location external to the housing to a location within the interior cavity of the housing. Further, an inner surface of the base is co-planar with an outer end of the feedthrough aperture. The apparatus also includes solder positioned on the housing and against an entire periphery of the skirt to seal the electrical connector to the housing.

3. 发明申请

US20170149154A1 SOLDERED INTERCONNECT FOR A PRINTED CIRCUIT BOARD HAVING AN ANGULAR RADIAL FEATURE 审中-公开
公开(公告)号：US20170149154A1
公开(公告)日：2017-05-25
申请号：US15423269
申请日：2017-02-02
申请人： MERCURY SYSTEMS, INC.
发明人： Darryl J. MCKENNEY , Absu METHRATTA , Erica OUELLETTE
IPC分类号： H01R12/58 , H05K1/02 , H01R12/71
CPC分类号： H01R12/716 , H01R4/028 , H01R9/091 , H01R12/526 , H01R12/58 , H01R12/714 , H01R13/05 , H01R13/405 , H01R13/652 , H05K1/0213 , H05K1/0237 , H05K1/0298 , H05K1/11 , H05K1/111 , H05K1/115 , H05K1/181 , H05K1/184 , H05K3/308 , H05K3/34 , H05K3/421 , H05K2201/09545 , H05K2201/09827 , H05K2201/10098 , H05K2201/10189 , H05K2201/10295 , H05K2201/1078 , H05K2201/10803 , H05K2201/10878 , H05K2201/10901 , Y02P70/611
摘要： According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

4. 发明申请

US20170133775A1 PRESS FIT ELECTRICAL TERMINAL HAVING A SOLDER TAB SHORTER THAN PCB THICKNESS AND METHOD OF USING SAME 有权
公开(公告)号：US20170133775A1
公开(公告)日：2017-05-11
申请号：US15409689
申请日：2017-01-19
申请人： Lear Corporation
发明人： Bert W. Eakins , George E. Fox
IPC分类号： H01R12/70 , H01R4/02
CPC分类号： H01R12/707 , H01R4/02 , H01R4/028 , H01R12/585 , H01R43/205 , H05K3/3447 , H05K3/4015 , H05K2201/097 , H05K2201/10295 , H05K2201/10787 , H05K2201/10871 , H05K2201/2072 , H05K2203/047 , H05K2203/1572
摘要： A circuit board assembly may include a circuit board, a first electrical terminal, and a layer of solder paste. The circuit board may include a minimum thickness, a first side, and a second side opposite the first side. The first electrical terminal may include a solder tab. The layer of solder paste may be disposed on the first side of the circuit board. The solder tab of the first electrical terminal may extend into the first side of the circuit board but not beyond the second side of the circuit board.

5. 发明授权

US09350105B2 Surface-mount type electric connecting terminal, and electronic module unit and circuit board using the same 有权
标题翻译：表面贴装型电连接端子，电子模块单元及使用该电连接端子的电路板
公开(公告)号：US09350105B2
公开(公告)日：2016-05-24
申请号：US14803444
申请日：2015-07-20
申请人： JOINSET CO., LTD. , Sun-Ki Kim
发明人： Sun-Ki Kim , Tae-Man Kang , Eung-Won Kim
IPC分类号： H01R13/24 , H01R4/02 , B23K1/00 , B23K33/00 , H01R12/57 , H01R12/71 , H05K3/34
CPC分类号： H01R13/2464 , B23K1/0016 , B23K33/002 , H01R4/02 , H01R4/028 , H01R12/57 , H01R12/718 , H01R13/2421 , H01R13/2428 , H05K3/341 , H05K2201/1031 , Y02P70/611
摘要： Provided is a surface-mount type electric connecting terminal which is disposed between opposing conductive objects and is configured to electrically connecting the objects while easily adjusting pressing force and recovery force. The electric connecting terminal includes a cylindrical fixed member which is made from a metallic material; a cylindrical movable member which is slidably inserted in the fixed member and is made from a metallic material; and an electrical conductive spring which is accommodated in the fixed member and whose one end contacts with the bottom of the fixed member and the other end contacts with the bottom of the movable member for thereby allowing the movable member to elastically slide against the fixed member.
摘要翻译：提供了一种表面安装型电连接端子，其设置在相对的导电物体之间，并且被配置为电连接物体，同时容易地调节按压力和恢复力。电连接端子包括由金属材料制成的圆柱形固定构件; 可滑动地插入固定构件并由金属材料制成的圆柱形可动构件; 以及导电弹簧，其容纳在固定构件中，并且其一端与固定构件的底部接触，另一端与可动构件的底部接触，从而允许可动构件弹性滑动抵靠固定构件。

6. 发明授权

US09270065B2 Electrical connector with inter-molded terminals 有权
标题翻译：带连接模制端子的电气连接器
公开(公告)号：US09270065B2
公开(公告)日：2016-02-23
申请号：US14040524
申请日：2013-09-27
申请人： HON HAI PRECISION INDUSTRY CO., LTD.
发明人： Al-Hong Fang , I-Fan Yen , Huo-Xing Jin
IPC分类号： H01R9/22 , H01R24/60 , H01R12/71 , H01R43/24 , H01R4/02 , H01R12/57
CPC分类号： H01R24/60 , H01R4/028 , H01R12/57 , H01R12/716 , H01R43/24
摘要： An electrical connector includes an insulative housing and a plurality of conductive terminals fixed in the housing, the housing includes a pair of side walls, a pair of end walls and a plug-receiving cavity with an insertion direction surrounded by an inner surfaces of the said four walls, each terminal defines a plate portion embedded in the inner surface of the side walls, and a soldering portion extends out of the housing, each plate portion defines a contacting surface facing and exposing to the plug-receiving cavity and two corners opposite to the contacting surface, the side walls of the housing define a plurality of holes through an outer surface and the holes are located between every adjacent plate portions of the conductive terminals, seen from a cross-section of the electrical connector perpendicular to the insertion direction, said two corners of each plate portion are exposed to adjacent holes.
摘要翻译：电连接器包括绝缘壳体和固定在壳体中的多个导电端子，壳体包括一对侧壁，一对端壁和插头接收腔，插入方向由所述壳体的内表面包围每个端子限定嵌入在侧壁的内表面中的板部分，并且焊接部分延伸出外壳，每个板部分限定面向并暴露于插头接收腔的接触表面，所述接触表面，所述壳体的侧壁通过外表面限定多个孔，并且所述孔位于所述导电端子的每个相邻板部分之间，从所述电连接器的横截面垂直于所述插入方向观察，每个板部分的两个角部暴露于相邻的孔。

7. 发明申请

US20150288079A1 CABLE CONNECTOR WITH LOW IMPEDANCE 有权
标题翻译：具有低阻抗的电缆连接器
公开(公告)号：US20150288079A1
公开(公告)日：2015-10-08
申请号：US14677924
申请日：2015-04-02
申请人： FOXCONN INTERCONNECT TECHNOLOGY LIMITED
发明人： JERRY WU , JUN CHEN , XIAO FAN , ZHI-YONG ZHOU
IPC分类号： H01R4/02 , H01R24/62
CPC分类号： H01R4/023 , H01R4/027 , H01R4/028 , H01R13/4367
摘要： A cable connector for soldering to a cable defining some core wires includes an insulative body, a plurality of terminals, and a spacer. Each terminal includes a soldering portion extending rearwardly out of the insulative body soldering to the core wires. The spacer includes some stalls and a respective receiving slot formed between every two adjacent stalls for receiving the soldering portions. The receiving slot includes a first receiving slot proximal to the insulative body and a second receiving slot distal from the insulative body. The second receiving slot includes a lower receiving space and an upper receiving space with a smaller width. The soldering portion of the terminal includes a first portion received in the lower receiving space and a second portion received in the first receiving slot. The width of the first portion is larger than the width of the second portion to reduce the impedance.
摘要翻译：用于焊接到限定一些芯线的电缆的电缆连接器包括绝缘体，多个端子和间隔件。每个端子包括从焊接到芯线的绝缘体之后向后延伸的焊接部分。间隔件包括一些档位和形成在每两个相邻档位之间的相应的接收槽，用于接收焊接部分。接收槽包括靠近绝缘体的第一接收槽和远离绝缘体的第二接收槽。第二容纳槽包括下部容纳空间和较小宽度的上部容纳空间。端子的焊接部分包括接收在下接收空间中的第一部分和接收在第一接收槽中的第二部分。第一部分的宽度大于第二部分的宽度以减小阻抗。

8. 发明授权

US09106005B2 Surface mount device 有权
标题翻译：表面贴装装置
公开(公告)号：US09106005B2
公开(公告)日：2015-08-11
申请号：US13356791
申请日：2012-01-24
申请人： Takeshi Okuyama , Toshihiro Kusagaya , Tohru Yamakami
发明人： Takeshi Okuyama , Toshihiro Kusagaya , Tohru Yamakami
IPC分类号： H01L23/48 , H01R12/57 , H01R4/02 , H05K3/34 , H01R12/72 , H01R13/6587 , H05K1/02
CPC分类号： H05K3/3426 , H01R4/028 , H01R12/57 , H01R12/724 , H01R13/6587 , H05K1/025 , H05K3/3494 , H05K2201/10189 , H05K2201/10757 , H05K2201/10803 , H05K2201/10909 , H05K2201/2081 , H05K2203/04 , Y02P70/613
摘要： Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.
摘要翻译：公开了一种表面安装装置，其安装在基座构件上，包括多个引线单元，所述多个引线单元中的每一个包括：引线，其包括形成在引线端部的主体部分和脚部; 形成在引脚的脚部处的焊料部分朝向基部构件的方向突出以具有顶部部分，以及设置在引线上的防止扩散部分，用于防止焊料沿引线的主体部分扩散。

9. 发明申请

US20140353031A1 METHOD OF ASSEMBLING A TRANSDUCER ASSEMBLY 有权
标题翻译：组装传感器组件的方法
公开(公告)号：US20140353031A1
公开(公告)日：2014-12-04
申请号：US14284621
申请日：2014-05-22
申请人： Sonion Nederland BV
发明人： Jozef Johannes Gerardus Bosch
IPC分类号： H01R43/00 , H01R4/02
CPC分类号： H01R43/00 , H01R4/027 , H01R4/028 , H05K1/118 , H05K1/189 , H05K3/303 , H05K3/325 , H05K3/3436 , H05K2201/094 , H05K2201/0969 , H05K2201/09854 , H05K2201/10083 , H05K2203/167 , H05K2203/168 , Y02P70/613 , Y10T29/49005
摘要： A method of assembling a transducer assembly comprising a transducer and a conductor element, where one of the transducer and the conductor element includes holes and conducting parts, each conducting part being exposed in or at a hole and the other of the transducer and the conductor element includes elevated, electrically conducting elements. The method includes aligning the conductor element and the transducer so that each of the elevated elements extends into a separate hole of the holes and fixing the transducer to the conductor element by fixing each elevated element to the conducting parts of the pertaining hole.
摘要翻译：一种组装换能器组件的方法，所述换能器组件包括换能器和导体元件，其中所述换能器和所述导体元件中的一个包括孔和导电部件，每个导电部分暴露在孔中或孔中，并且所述换能器和导体元件中的另一个包括升高的导电元件。该方法包括使导体元件和换能器对准，使得每个升高的元件延伸到孔的单独的孔中，并通过将每个升高的元件固定到相关孔的导电部分来将换能器固定到导体元件。

10. 发明授权

US08816215B2 Disk with an electrical connection element 有权
标题翻译：带有电连接元件的磁盘
公开(公告)号：US08816215B2
公开(公告)日：2014-08-26
申请号：US13580741
申请日：2011-02-15
申请人： Bernhard Reul , Mitja Rateiczak , Stefan Ziegler , Andreas Schlarb
发明人： Bernhard Reul , Mitja Rateiczak , Stefan Ziegler , Andreas Schlarb
IPC分类号： H05K1/03 , H05K1/09 , B32B15/01 , H05B3/84 , B23K35/26 , C22C12/00 , C22C13/00 , C22C38/10 , C22C38/08 , H01R13/03 , H01R4/02
CPC分类号： H05B3/84 , B23K35/262 , B23K35/264 , B32B15/018 , C22C12/00 , C22C13/00 , C22C38/08 , C22C38/10 , H01R4/028 , H01R13/03 , H01R2201/02 , H01R2201/26 , H05B2203/016
摘要： The present invention relates to a disk with an electrical connection element, having a substrate with a first coefficient of thermal expansion, an electrically conductive structure on a region of the substrate, and a connection element with a second coefficient of thermal expansion.
摘要翻译：本发明涉及具有电连接元件的盘，具有第一热膨胀系数的衬底，在衬底的区域上的导电结构以及具有第二热膨胀系数的连接元件。

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