会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • Non-Volatile Memory Cells Having Carbon Impurities and Related Manufacturing Methods
    • 具有碳杂质和相关制造方法的非挥发性记忆体
    • US20140209995A1
    • 2014-07-31
    • US13753047
    • 2013-01-29
    • Cheong Min HongSung-Taeg Kang
    • Cheong Min HongSung-Taeg Kang
    • H01L29/792H01L29/66
    • H01L29/42328H01L29/42332H01L29/66825H01L29/7881
    • Non-volatile memory (NVM) cells having carbon impurities are disclosed along with related manufacturing methods. The carbon impurities can be introduced using a variety of techniques, including through epitaxial growth of silicon-carbon (SiC) layers and/or carbon implants. Further, the carbon impurities can be introduced into one or more structures within NVM cells, including source regions, drain regions, gate regions, and/or charge storage layers. For discrete charge storage layers that utilize nanocrystal structures, carbon impurities can be introduced into the nanocrystal charge storage layers. The disclosed embodiments are useful for a variety of NVM cell types including split-gate NVM cells, floating gate NVM cells, discrete charge storage NVM cells, and/or other desired NVM cells. Advantageously, the carbon impurities introduce tensile stress into the cell structures, and this tensile stress helps maintain NVM system performance and data retention even as device geometries are reduced.
    • 公开了具有碳杂质的非易失性存储器(NVM)单元以及相关的制造方法。 可以使用各种技术引入碳杂质,包括通过硅 - 碳(SiC)层和/或碳植入物的外延生长。 此外,可以将碳杂质引入NVM单元内的一个或多个结构,包括源极区,漏极区,栅极区和/或电荷存储层。 对于利用纳米晶体结构的离散电荷存储层,可将碳杂质引入纳米晶电荷存储层。 所公开的实施例对于包括分裂门NVM单元,浮动栅极NVM单元,分立电荷存储NVM单元和/或其它期望的NVM单元的各种NVM单元类型是有用的。 有利地,碳杂质将细胞结构中的拉伸应力引入,并且即使在减小器件几何形状的情况下,该拉伸应力有助于维持NVM系统性能和数据保持。
    • 5. 发明授权
    • Methods and systems for gate dimension control in multi-gate structures for semiconductor devices
    • 用于半导体器件的多栅极结构中栅极尺寸控制的方法和系统
    • US08778742B1
    • 2014-07-15
    • US13871411
    • 2013-04-26
    • Sung-Taeg KangShanShan Du
    • Sung-Taeg KangShanShan Du
    • H01L21/82
    • H01L27/11563H01L21/823437H01L27/11521H01L29/42328H01L29/42332H01L29/66825H01L29/7881
    • Methods and systems are disclosed for gate dimension control in multi-gate structures for integrated circuit devices. Processing steps for formation of one or more subsequent gate structures are adjusted based upon dimensions determined for one or more previously formed gate structures. In this way, one or more features of the resulting multi-gate structures can be controlled with greater accuracy, and variations between a plurality of multi-gate structures can be reduced. Example multi-gate features and/or dimensions that can be controlled include overall gate length, overlap of gate structures, and/or any other desired features and/or dimensions of the multi-gate structures. Example multi-gate structures include multi-gate NVM (non-volatile memory) cells for NVM systems, such as for example, split-gate NVM cells having select gates (SGs) and control gates (CGs).
    • 公开了用于集成电路器件的多栅极结构中的栅极尺寸控制的方法和系统。 基于为一个或多个先前形成的栅极结构确定的尺寸来调整用于形成一个或多个后续栅极结构的处理步骤。 以这种方式,可以以更高的精度控制所得到的多栅极结构的一个或多个特征,并且可以减少多个多栅极结构之间的变化。 可以控制的示例性多栅极特征和/或尺寸包括整个栅极长度,栅极结构的重叠和/或多栅极结构的任何其它期望特征和/或尺寸。 示例性多栅极结构包括用于NVM系统的多栅极NVM(非易失性存储器)单元,例如具有选择栅极(SG)和控制栅极(CG)的分离栅极NVM单元。
    • 6. 发明申请
    • SPLIT GATE PROGRAMMING
    • 分割门编程
    • US20140003155A1
    • 2014-01-02
    • US13536307
    • 2012-06-28
    • CHEONG MIN HONGSung-Taeg Kang
    • CHEONG MIN HONGSung-Taeg Kang
    • G11C16/10
    • G11C16/0466G11C16/10G11C16/3459
    • A method for programming a split gate memory cell includes performing a first programming of the split gate memory cell in a first programming cycle of the split gate memory cell; and, subsequent to the performing the first programming of the split gate memory cell, performing a second programming of the split gate memory cell in the first programming cycle, wherein the first programming is characterized as one of source-side injection (SSI) programming and channel-initiated secondary electron (CHISEL) programming, and the second programming is characterized as the other of SSI programming and CHISEL programming.
    • 用于对分割门存储器单元进行编程的方法包括在分离栅极存储单元的第一编程周期中执行分离栅极存储单元的第一编程; 并且在执行所述分离栅极存储器单元的第一编程之后,在所述第一编程周期中执行所述分离栅极存储单元的第二编程,其中所述第一编程被表征为源侧注入(SSI)编程之一, 通道启动的二次电子(CHISEL)编程,第二个编程被表征为SSI编程和CHISEL编程中的另一个。
    • 7. 发明申请
    • INTEGRATED NON-VOLATILE MEMORY (NVM) AND METHOD THEREFOR
    • 集成的非易失性存储器(NVM)及其方法
    • US20120126309A1
    • 2012-05-24
    • US12951862
    • 2010-11-22
    • JANE A. YATERSung-Taeg KangMehul D. Shroff
    • JANE A. YATERSung-Taeg KangMehul D. Shroff
    • H01L29/68H01L21/28
    • H01L27/105H01L27/11531H01L27/11548H01L27/11573H01L27/11575H01L29/42328H01L29/42332H01L29/42344H01L29/42348H01L29/788H01L29/792
    • A feature is formed in the NVM isolation region during the patterning and etching of an NVM device and a logic device such that the feature is of substantially equal height to the logic device and is well-defined so that it does not cause defect signals. A first conductive layer is formed over a substrate. The first conductive layer is patterned to expose at least a portion of the substrate in an NVM region and at least a portion of an isolation region. An NVM dielectric stack is formed over the first conductive layer, the exposed substrate, and the exposed isolation region, and a second conductive layer is formed over the NVM dielectric stack. The first and second conductive layers and the NVM dielectric stack are patterned to form a first gate and a second gate of an NVM cell in the NVM region and a feature over the isolation region. The feature comprises a portion of the first conductive layer, a portion of the NVM dielectric stack adjacent a first sidewall of the portion of the first conductive layer, and a portion of the second conductive layer adjacent the portion of the NVM dielectric stack.
    • 在NVM器件和逻辑器件的图案化和蚀刻期间,在NVM隔离区域中形成特征,使得该特征与逻辑器件的高度基本相等,并且被明确地限定,使得其不会引起缺陷信号。 第一导电层形成在衬底上。 图案化第一导电层以在NVM区域和隔离区域的至少一部分中露出衬底的至少一部分。 在第一导电层,暴露的衬底和暴露的隔离区上方形成NVM电介质堆叠,并且在NVM电介质叠层上形成第二导电层。 图案化第一和第二导电层和NVM电介质叠层以形成NVM区域中的NVM单元的第一栅极和第二栅极以及隔离区域上的特征。 该特征包括第一导电层的一部分,与第一导电层的该部分的第一侧壁相邻的NVM电介质堆叠的一部分以及邻近NVM电介质叠层部分的第二导电层的一部分。
    • 8. 发明授权
    • Nanocrystal memory with differential energy bands and method of formation
    • 具有差分能带的纳米晶体记忆和形成方法
    • US08163609B2
    • 2012-04-24
    • US12964727
    • 2010-12-09
    • Cheong Min HongSung-Taeg Kang
    • Cheong Min HongSung-Taeg Kang
    • H01L21/336H01L29/76
    • H01L21/28273B82Y10/00H01L21/02488H01L21/02532H01L21/02576H01L21/02579H01L21/02601H01L29/42328H01L29/42332H01L29/7881
    • A method of making a semiconductor device using a semiconductor substrate includes forming a first insulating layer having a first band energy over the semiconductor substrate. A first semiconductor layer having a second band energy is formed on the first insulating layer. The first semiconductor layer is annealed to form a plurality of first charge retainer globules from the first semiconductor layer. A first protective film is formed over each charge retainer globule of the plurality of first charge retainer globules. A second semiconductor layer is formed having a third band energy over the plurality of first charge retainer globules. The second semiconductor layer is annealed to form a plurality of storage globules from the second semiconductor layer over the plurality of first charge retainer globules. A magnitude of the second band energy is between a magnitude of the first band energy and a magnitude of the third band energy.
    • 使用半导体衬底制造半导体器件的方法包括在半导体衬底上形成具有第一带能的第一绝缘层。 具有第二带能的第一半导体层形成在第一绝缘层上。 第一半导体层被退火以从第一半导体层形成多个第一电荷保持器球。 在多个第一电荷保持器球的每个电荷保持器球上形成第一保护膜。 在多个第一电荷保持器球上形成具有第三带能的第二半导体层。 第二半导体层被退火以在多个第一电荷保持器球上从第二半导体层形成多个存储小球。 第二带能量的大小在第一带能量的大小和第三带能量的大小之间。