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1. 发明授权

US08701621B2 Four-cycle engine, bush cutter and engine-driven tool having same 有权
标题翻译：四冲程发动机，铣刀和具有相同功能的发动机驱动工具
公开(公告)号：US08701621B2
公开(公告)日：2014-04-22
申请号：US13388377
申请日：2010-09-22
申请人： Takeshi Takeda , Takamoto Horiuchi , Hiroshi Ohira , Takahiro Hirai , Katsumi Kurihara
发明人： Takeshi Takeda , Takamoto Horiuchi , Hiroshi Ohira , Takahiro Hirai , Katsumi Kurihara
IPC分类号： F16N7/00 , F02F7/00 , F01M1/02
CPC分类号： F01M11/0004 , F01M11/065 , F01M2011/0033 , F01M2011/005
摘要： There is provided a four-cycle engine which can appropriately circulate oil in an engine regardless of a tilted condition with a simple structure. A crankcase (4) of a four-cycle engine (1) has a crank room (41) which rotatably supports a crankshaft (10) and an oil room (42) which is provided adjacent to the exterior of the crank room (41). The crankcase (4) also has partition walls (43) and (44) which partition the interior of the crankcase (4) into the crank room (41) and the oil room (42), respectively, and a communication path (45) which communicates the crank room (41) with the oil room (42). The partition walls (43) and (44) each has a cross section formed in a substantially V shape, and the communication path (45) is formed at an apex between the partition walls (43) and (44).
摘要翻译：提供一种四冲程发动机，其可以以简单的结构适当地在发动机中循环油，而不管倾斜状况如何。四冲程发动机（1）的曲轴箱（4）具有可旋转地支撑曲轴（10）的曲柄室（41）和与曲柄室（41）的外部相邻设置的油室（42）。曲轴箱（4）还具有分别将曲轴箱（4）的内部分隔成曲柄室（41）和油室（42）的分隔壁（43）和（44）和连通路径（45）其将曲柄室（41）与油室（42）连通。分隔壁（43）和（44）各自具有形成为大致V形的横截面，并且连通路径（45）形成在分隔壁（43）和（44）之间的顶点处。

2. 发明申请

US20120319509A1 ELECTRIC TOOL 有权
标题翻译：电动工具
公开(公告)号：US20120319509A1
公开(公告)日：2012-12-20
申请号：US13525025
申请日：2012-06-15
申请人： Yuji KISHIMA , Takeshi TAKEDA
发明人： Yuji KISHIMA , Takeshi TAKEDA
IPC分类号： H02K7/14
CPC分类号： B23B45/02 , B23B2260/024 , B25B21/00 , B25B23/18 , B25F5/001 , B25F5/008 , B25F5/02
摘要： An electric tool including: a motor; a housing including, a motor housing accommodating the motor, and a handle housing having one end connected to the motor housing and another other end configured to be provided with a detachable battery pack; an output part partially accommodated in the motor housing and configured to be driven by the motor; and a control board accommodated in the motor housing and configured to control the motor.
摘要翻译：一种电动工具，包括：电动机; 壳体，其包括容纳所述马达的马达壳体和具有连接到所述马达壳体的一端的手柄壳体，以及构造成设置有可拆卸电池组的另一端; 输出部分部分地容纳在电动机壳体中并构造成由电动机驱动; 以及容纳在马达壳体中并被配置为控制马达的控制板。

3. 发明授权

US08293585B2 Solid-state imaging device and method for making the same 失效
标题翻译：固态成像装置及其制作方法
公开(公告)号：US08293585B2
公开(公告)日：2012-10-23
申请号：US12769265
申请日：2010-04-28
申请人： Takeshi Takeda
发明人： Takeshi Takeda
IPC分类号： H01L21/00
CPC分类号： H01L27/14636 , H01L27/14683
摘要： A solid-state imaging device includes a semiconductor substrate, one or more wiring interlayer films disposed on or above the semiconductor substrate, and one or more metal wires embedded in the wiring interlayer films. The one or more wiring interlayer films are composed of a diffusion preventing material that prevents the diffusion of the metal wire.
摘要翻译：固态成像装置包括半导体基板，设置在半导体基板上或上方的一个或多个布线中间膜，以及嵌入布线中间膜中的一个或多个金属线。一个或多个布线中间膜由阻止金属线扩散的防扩散材料构成。

4. 发明授权

US08057723B2 Method of manufacturing insert-molded article and apparatus therefor 有权
标题翻译：嵌入成型品的制造方法及其装置
公开(公告)号：US08057723B2
公开(公告)日：2011-11-15
申请号：US11704359
申请日：2007-02-09
申请人： Takeshi Takeda , Makoto Kitamura , Nihei Kaishita
发明人： Takeshi Takeda , Makoto Kitamura , Nihei Kaishita
IPC分类号： B29C45/14
CPC分类号： B29C45/14221 , B29C45/14655
摘要： Provides is a method of manufacturing an insert-molded article enabling to perform resin molding and tie bar cutting in one step and so as not to expose the cut planes of the tie bars to the external surface of the resin. A lead frame 1 provided with easily breakable notches 3a at positions closer to the metal component than the interfaces of tie bars 3 to be resin molded is prepared and positioned by means of pilot pins 11 provided to a lower mold 10. A metal component 4 is sandwiched between support protrusions 13 and component fixing pins 24 by lowering an upper mold 20 with the lead frame being positioned. Tie bar cutting punches 23 provided to the upper mold 20 are pressed against the tie bars, the tie bars 3 are separated from the metal component 4 by breaking the notches 3a, and the surroundings of the metal component 4 are filled with resin while the molds are closed. By this, the cut surfaces between the metal component 4 and the tie bars 3 are buried in the molded resin 7.
摘要翻译：提供一种制造插入成型制品的方法，其能够在一个步骤中进行树脂模制和拉杆切割，并且不将连杆的切割面暴露于树脂的外表面。通过设置在下模具10上的引导销11准备并定位引线框架1，该引线框架1在比待连接条3的树脂模制接口更靠近金属部件的位置处设置容易断裂的切口3a。金属部件4 通过在引线框架定位的同时降低上模20而夹在支撑突起13和部件固定销24之间。设置在上模具20上的连杆切割冲头23被压靠在拉杆上，通过断开切口3a将连接杆3与金属部件4分离，金属部件4的周围用树脂填充，而模具关闭。由此，将金属部件4和连接条3之间的切割面埋设在模制树脂7中。

5. 发明申请

US20110129950A1 METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE, SOLID STATE IMAGING DEVICE, AND CAMERA USING SOLID STATE IMAGING DEVICE 失效
标题翻译：制造固态成像装置的方法，固态成像装置和使用固态成像装置的相机
公开(公告)号：US20110129950A1
公开(公告)日：2011-06-02
申请号：US13017876
申请日：2011-01-31
申请人： Takeshi TAKEDA , Tadayuki DOFUKU , Kenji TAKEO
发明人： Takeshi TAKEDA , Tadayuki DOFUKU , Kenji TAKEO
IPC分类号： H01L33/00
CPC分类号： C23F1/02 , H01L27/14623 , H01L27/14685 , H01L27/14812
摘要： A method of manufacturing a solid state imaging device having a photo-electric conversion portion array and a transfer electrode array, these arrays being provided in parallel to each other, upper surfaces and side wall surfaces of the transfer electrode array being covered with a light-shielding layer, and a transparent layer showing an oxidizing property at the time of film formation, the transparent layer being formed on the photo-electric conversion parts and the light-shielding layer.
摘要翻译：一种制造具有光电转换部分阵列和转印电极阵列的固态成像装置的方法，这些阵列彼此平行地设置，转印电极阵列的上表面和侧壁表面被发光元件覆盖，屏蔽层，以及在成膜时显示氧化性的透明层，透明层形成在光电转换部分和遮光层上。

6. 发明授权

US07935988B2 Method of manufacturing solid state imaging device, solid state imaging device, and camera using solid state imaging device 有权
公开(公告)号：US07935988B2
公开(公告)日：2011-05-03
申请号：US12468593
申请日：2009-05-19
申请人： Takeshi Takeda , Tadayuki Dofuku , Kenji Takeo
发明人： Takeshi Takeda , Tadayuki Dofuku , Kenji Takeo
IPC分类号： H01L27/148
CPC分类号： C23F1/02 , H01L27/14623 , H01L27/14685 , H01L27/14812
摘要： A method of manufacturing a solid state imaging device having a photo-electric conversion portion array and a transfer electrode array, these arrays being provided in parallel to each other, upper surfaces and side wall surfaces of the transfer electrode array being covered with a light-shielding layer, and a transparent layer showing an oxidizing property at the time of film formation, the transparent layer being formed on the photo-electric conversion parts and the light-shielding layer.

7. 发明申请

US20100203671A1 SOLID-STATE IMAGING DEVICE AND METHOD FOR MAKING THE SAME 失效
标题翻译：固态成像装置及其制造方法
公开(公告)号：US20100203671A1
公开(公告)日：2010-08-12
申请号：US12769265
申请日：2010-04-28
申请人： Takeshi TAKEDA
发明人： Takeshi TAKEDA
IPC分类号： H01L31/18
CPC分类号： H01L27/14636 , H01L27/14683
摘要： A solid-state imaging device includes a semiconductor substrate, one or more wiring interlayer films disposed on or above the semiconductor substrate, and one or more metal wires embedded in the wiring interlayer films. The one or more wiring interlayer films are composed of a diffusion preventing material that prevents the diffusion of the metal wire.
摘要翻译：固态成像装置包括半导体基板，设置在半导体基板上或上方的一个或多个布线中间膜，以及嵌入布线中间膜中的一个或多个金属线。一个或多个布线中间膜由阻止金属线扩散的防扩散材料构成。

8. 发明授权

US07763855B2 Infrared sensor and method for manufacturing infrared sensor 有权
标题翻译：红外传感器和红外传感器制造方法
公开(公告)号：US07763855B2
公开(公告)日：2010-07-27
申请号：US12233901
申请日：2008-09-19
申请人： Koji Hayashi , Hitoshi Taga , Takeshi Takeda
发明人： Koji Hayashi , Hitoshi Taga , Takeshi Takeda
IPC分类号： G01J5/04 , G02B7/02
CPC分类号： H01L31/0203 , H01L31/02162 , H01L31/09 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： An economical and highly reliable infrared sensor with a wide field of view and a method for economically manufacturing a highly reliable infrared sensor with a wide field of view includes a package having supporting portions that support an optical filter at a location below the upper surfaces of sidewalls of the package and recessed portions that communicate with gaps between side surfaces of the optical filter supported by the supporting portions and the sidewalls of the package. An adhesive is supplied to the recessed portions while the optical filter is supported by the supporting portions such that the adhesive flows into the gaps between the optical filter and the sidewalls of the package by capillary action and such that the optical filter is fixed to an opening of the package via the adhesive. The optical filter is fixed to the package via the adhesive by applying the adhesive such that the adhesive spreads over substantially the entire circumference of the optical filter.
摘要翻译：具有宽视野的经济且高度可靠的红外传感器和用于经济地制造具有宽视野的高度可靠的红外传感器的方法包括具有支撑部分的封装，所述支撑部分在侧壁的上表面下方的位置处支撑滤光器以及与由支撑部分支撑的滤光器的侧表面与封装的侧壁之间的间隙连通的凹部。粘合剂被供给到凹部，同时滤光器被支撑部支撑，使得粘合剂通过毛细管作用流入滤光器和封装的侧壁之间的间隙中，并且使得滤光器固定到开口的包装。通过施加粘合剂将滤光器通过粘合剂固定到包装上，使得粘合剂在光学滤光器的基本上整个圆周上扩展。

9. 发明申请

US20090263929A1 Methods for producing solid-state imaging device and electronic device 失效
标题翻译：固态成像装置和电子装置的制造方法
公开(公告)号：US20090263929A1
公开(公告)日：2009-10-22
申请号：US12382713
申请日：2009-03-23
申请人： Takeshi Takeda , Yukihiro Ando , Masaki Okamoto , Masayuki Okada , Kaori Takimoto , Katsuhisa Kugimiya , Tadayuki Kimura
发明人： Takeshi Takeda , Yukihiro Ando , Masaki Okamoto , Masayuki Okada , Kaori Takimoto , Katsuhisa Kugimiya , Tadayuki Kimura
IPC分类号： H01L31/00
CPC分类号： H01L27/14812 , H01L27/14831
摘要： A method for producing a solid-state imaging device includes steps of: forming transfer electrodes on a substrate having a plurality of light-sensing portions through a gate insulating layer so that the light-sensing portions are exposed; forming a planarized insulating layer on the substrate to cover the transfer electrodes formed on the substrate; forming openings in the planarized insulating layer so that each of the transfer electrodes is partly exposed out of the planarized insulating layer at a predetermined position; forming a wiring material layer so that the openings are filled with the wiring material layer; forming a resist layer on the wiring material layer; exposing and developing the resist layer so that only the resist layer in a predetermined area covering the openings is left; and patterning the wiring material layer using the exposed and developed resist layer to form connection wirings connected to the transfer electrodes by the openings.
摘要翻译：一种制造固态成像装置的方法，包括以下步骤：通过栅极绝缘层，在具有多个光检测部分的基板上形成转印电极，使得光敏部分露出; 在所述基板上形成平坦化的绝缘层，以覆盖形成在所述基板上的转移电极; 在平坦化绝缘层中形成开口，使得每个传输电极在预定位置部分地暴露在平坦化绝缘层之外; 形成布线材料层，使得开口被布线材料层填充; 在所述布线材料层上形成抗蚀剂层; 曝光和显影抗蚀剂层，使得仅保留覆盖开口的预定区域中的抗蚀剂层; 并使用曝光和显影的抗蚀剂层图案化布线材料层，以形成通过开口连接到转印电极的连接布线。

10. 发明授权

US07210222B2 Power supply control method 有权
标题翻译：电源控制方式
公开(公告)号：US07210222B2
公开(公告)日：2007-05-01
申请号：US10758094
申请日：2004-01-16
申请人： Keizo Izumida , Takeshi Takeda , Kazuyuki Nakano
发明人： Keizo Izumida , Takeshi Takeda , Kazuyuki Nakano
IPC分类号： H05K3/30
CPC分类号： H05K13/08 , Y10T29/49124 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/53178 , Y10T29/53191 , Y10T29/53261
摘要： The present invention provides a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately connected and shut-off in accordance with a command from a control device to each of component feed drive parts for driving component feed devices, a component transfer drive device for driving a component transfer device, and a circuit board positioning drive device for driving a circuit board positioning device. The control device detects an individual occurrence of a halt condition of each of constituent parts of an electronic component mounting apparatus and shuts off a drive power source to the drive device in the halt condition. Thus, wasteful power consumption is eliminated and production is continued with a necessary minimum power.
摘要翻译：本发明提供一种由电子部件安装装置执行的电源控制方法。驱动电源和控制电源根据从控制装置到用于驱动部件供给装置的各个部件供给驱动部的命令分开连接和切断，用于驱动部件传送装置的部件传送驱动装置，以及用于驱动电路板定位装置的电路板定位驱动装置。控制装置检测电子部件安装装置的各构成部件的停止状态的个别发生，并且在停止状态下将驱动电源切断到驱动装置。因此，消除浪费的功率消耗，并以必要的最小功率继续生产。

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