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1. 发明申请

US20230140390A1 Structure and Method of Manufacturing for a Hermetic Housing Enclosure for a Thermal Shock Proof, Zero Thermal Gradient Imaging or Sensing Core 有权
公开(公告)号：US20230140390A1
公开(公告)日：2023-05-04
申请号：US17918850
申请日：2021-04-12
申请人： T-Smart Systems LLC
发明人： Bryan Keith Patmon , Wei Kiong Tan
IPC分类号： G01J5/16 , G01J5/04 , G01J5/0806 , G01J5/22
摘要： There is disclosed a structure and the manufacturing method for packaging for thermopile or equivalent thermal sensing elements of single orientation, 1D arrays and 2D arrays used for thermal or equivalent media sensing. The sensing core has a primary use as a detection core, and accessory use for improved thermal stability through maximizing the flow of heat energy, through the various packaging constituents to achieve a zero thermal gradient effect. The core package comprises of a substrate, a heat spreader for the thermal sensor, an external housing material manufactured from a wafer fabrication process, and an optics of a silicon wafer and other optical components that is attached to the external housing enclosure using wafer level processing. The external housing enclosure can be scaled to a layered architecture into distinct layers that are stacked vertically on top of each other to make for a multi-lens package.

2. 发明申请

US20230133741A1 FAR INFRARED SENSOR APPARATUS HAVING MULTIPLE SENSING ELEMENT ARRAYS INSIDE SINGLE PACKAGE 有权
公开(公告)号：US20230133741A1
公开(公告)日：2023-05-04
申请号：US18090511
申请日：2022-12-29
申请人： PixArt Imaging Inc.
发明人： Chih-Ming Sun , Sen-Huang Huang
IPC分类号： G01J5/12 , G01J1/02 , G01J5/04 , G01J5/10 , G01J1/42 , G01J5/08 , G01J5/14
摘要： A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.

3. 发明授权

US11609121B2 Sensor and control systems for food preparation 有权
公开(公告)号：US11609121B2
公开(公告)日：2023-03-21
申请号：US16416124
申请日：2019-05-17
申请人： HATCO CORPORATION
发明人： Nick Bassill , John Scanlon , Fei Shang , Ishan Shah , Mark Gilpatric , Dave Rolston , Ronghua Yu
IPC分类号： G01J5/04 , A21B1/40 , F24C7/08 , A47J27/00 , A47J36/00
摘要： A temperature-regulating unit includes a base, a thermal element, a contactless sensing assembly, and a controller. The base is configured to support at least one of a pan or a food product. The thermal element is positioned to thermally regulate the at least one of the pan or the food product. The contactless sensing assembly is positioned to acquire sensor data regarding the at least one of the pan or the food product. The controller is configured to receive the sensor data from the contactless sensing assembly and adaptively control the thermal element based on the sensor data.

4. 发明申请

US20230040397A1 Optical Thermography System Using a Pumped Two-dye Fluorescence Technique 有权
公开(公告)号：US20230040397A1
公开(公告)日：2023-02-09
申请号：US17880751
申请日：2022-08-04
申请人： Drexel University
发明人： Matthew McCarthy , Deborah Kapilow
IPC分类号： G01J5/48 , G01J5/061 , G01J5/08 , G01J5/04
摘要： A backside thermography technique was developed based on the temperature sensitivity of laser-induced fluorescence in flowing two-dye solutions. The approach utilizes visible light and optically transparent packaging materials to obtain spatially resolved transient thermal measurements. This technique is compatible with optically transparent water-cooled packaging, which will allow for the characterization of processes where heat is added as well as removed. A setup was designed, constructed, and used to study the performance of seven two-dye Rhodamine B (RhB)-Rhodamine 110 (Rh110) fluorescent solutions. The effect of dye concentration ratio on sensitivity, maximum frame rate, and excitation area was characterized. The system was used to demonstrate in-situ temperature measurements showing the importance of two-dye light compensation, as well as backside thermography using a simple droplet contact method to investigate temporal response. Droplet contact experiments were conducted on actively heated and cooled surfaces to study local temperature and heat flux behavior during phase change.

5. 发明申请

US20230020236A1 OPTICAL COMPONENT PACKAGING STRUCTURE 有权
公开(公告)号：US20230020236A1
公开(公告)日：2023-01-19
申请号：US17955854
申请日：2022-09-29
申请人： PIXART IMAGING INC.
发明人： YI-CHANG CHANG , YEN-HSIN CHEN , CHI-CHIH SHEN
IPC分类号： H01L31/0203 , H01L27/146 , H01L31/0236 , G01J5/00 , G01J5/04 , G01J5/20
摘要： An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.

6. 发明申请

US20220299373A1 CALIBRATION PANEL 有权
公开(公告)号：US20220299373A1
公开(公告)日：2022-09-22
申请号：US17203295
申请日：2021-03-16
申请人： Charles Partee
发明人： Charles Partee
IPC分类号： G01J5/52 , G01J5/04 , G01J5/02 , G01V8/00 , H04N5/33
摘要： The disclosed MMW wave sensing camera calibration arrangement that generally includes a millimeter wave camera that uses an energy emission calibration panel as a calibration standard. The MMW camera is positioned opposite the calibration panel in the MMW camera's field-of-view. The calibration panel is held at a constant temperature to provide a standard emission of millimeter waves that is sensed by an MMW sensor to set or otherwise calibrate the MMW camera to a baseline emissivity value corresponding to the panel. The MMW camera is linked to a microprocessor and non-transient computer memory containing a calibration routine that is configured to reset the baseline only when nothing obstructs the calibration panel's field-of-view. A visual display is linked to the MMW camera and configured to display an MMW signature of a metal object that is disposed on a person's body when the person's body is in the field-of-view, the metal object concealed by clothing worn over the person's body.

7. 发明申请

US20220196480A1 METAMATERIALS-BASED FOCUSING LENSES FOR THERMAL IMAGING 有权
公开(公告)号：US20220196480A1
公开(公告)日：2022-06-23
申请号：US17612200
申请日：2020-05-28
申请人： Meridian Innovation Pte Ltd
发明人： Wan Chia Ang , Ilker Ender Ocak , Piotr KROPELNICKI
IPC分类号： G01J5/0806 , G02B1/00 , G01J5/04 , G01J5/02
摘要： A complementary metal oxide semiconductor (CMOS) device embedded with microelectromechanical system (MEMS) components in a MEMS region. The MEMS components, for example, are infrared (IR) thermosensors. The device is encapsulated with a CMOS compatible IR transparent cap to hermetically seal the device using wafer-level vacuum packaging techniques. The cap includes an integrated focusing system with a metalens module for focusing IR radiation onto the sensors.

8. 发明申请

US20220122785A1 Home Monitoring and Control System 有权
公开(公告)号：US20220122785A1
公开(公告)日：2022-04-21
申请号：US17563344
申请日：2021-12-28
申请人： Google LLC
发明人： Anthony M. Fadell , Matthew L. Rogers , Yoky Matsuoka , David Sloo , Maxime Veron , Isabel I. Guenette , Shigefumi Honjo
IPC分类号： H01H9/02 , G01J5/04 , G01J5/02 , H05B47/19 , H02J3/00 , H02J13/00 , G06V40/10 , G08B17/00 , H04L12/28 , G01J5/0806
摘要： This application is directed to a home monitoring and control system including a doorbell installed at a door of a home. The doorbell has a button configured to, upon being touched, depressed or activated, wirelessly initiate a first communication to indicate presence of a person at the door. The doorbell also has a camera configured to capture video data within a field of view, and a processor configured to cause a communication component to enable the first communication and wirelessly stream via a remote server the video data captured by the camera to a monitoring device associated with an occupant of the home. A rechargeable battery is coupled to a housing wire and configured to be charged via the housing wire, and the doorbell is configured to charge and discharge the rechargeable battery based on power usage of the doorbell.

9. 发明授权

US11285453B2 Moisture and hydrogen adsorption getter and method of fabricating the same 有权
公开(公告)号：US11285453B2
公开(公告)日：2022-03-29
申请号：US17073063
申请日：2020-10-16
申请人： INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS
发明人： Yongho Choa , Nusia Eom , Hyoryoung Lim
IPC分类号： H01L23/26 , B01J20/10 , B01J21/08 , B01J35/00 , H01J7/18 , B01J37/34 , B01J20/02 , B01J20/30 , B01J35/02 , B01J20/06 , B01J20/32 , B01J23/42 , B01J23/44 , B01J37/00 , B01J37/02 , G01J5/04 , B01J23/50 , G01J1/02
摘要： A moisture and hydrogen adsorption getter is provided. The moisture and hydrogen adsorption getter includes a silicon substrate including a concave portion and a convex portion, a silicon oxide layer conformally provided along a surface of the concave portion and a surface of the convex portion and configured to adsorb moisture, and a hydrogen adsorption pattern disposed on the silicon oxide layer. A portion of the silicon oxide layer is exposed between portions of the hydrogen adsorption pattern.

10. 发明申请

US20220074790A1 SYSTEM AND METHOD FOR DISPOSABLE IMAGING SYSTEM 有权
公开(公告)号：US20220074790A1
公开(公告)日：2022-03-10
申请号：US17530838
申请日：2021-11-19
申请人： General Electric Company
发明人： Guanghua Wang , Naveenan Thiagarajan , Todd Garrett Wetzel , Jason Edward Dees , Bernard Patrick Bewlay
IPC分类号： G01J1/02 , F02C7/12 , G01J5/04 , G01J5/06 , G01J5/00
摘要： An imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.

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