专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08446726B2 Semiconductor module having an insert and method for producing a semiconductor module having an insert 有权
标题翻译：具有插入件的半导体模块和用于制造具有插入件的半导体模块的方法
公开(公告)号：US08446726B2
公开(公告)日：2013-05-21
申请号：US12914171
申请日：2010-10-28
申请人： Ralf Schloerke , Thilo Stolze
发明人： Ralf Schloerke , Thilo Stolze
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/24 , H01L23/10 , H01L23/367 , H01L23/3735 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/291 , H01L2224/29139 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/33181 , H01L2224/48132 , H01L2224/48227 , H01L2224/4846 , H01L2224/48472 , H01L2224/73263 , H01L2224/73265 , H01L2224/8384 , H01L2224/8584 , H01L2924/00014 , H01L2924/01068 , H01L2924/1301 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , Y10T29/41 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the top side of the module housing for feeding through electric terminals of the power semiconductor module. On the bottom side of the module housing a sealing ring hermetically seals the bottom side of the module housing.
摘要翻译：功率半导体模块包括在其顶侧具有密封环的模块壳体。与模块壳体配合的密封环和连接到功率半导体模块的印刷电路板密封地密封模块壳体顶侧的馈通位置，以通过功率半导体模块的电端子供电。在密封环的模块的底侧上，密封环密封模块壳体的底侧。

2. 发明授权

US08338932B2 Power semiconductor module with interconnected package portions 有权
标题翻译：功率半导体模块，具有互连的封装部分
公开(公告)号：US08338932B2
公开(公告)日：2012-12-25
申请号：US12970342
申请日：2010-12-16
申请人： Georg Borghoff , Thilo Stolze
发明人： Georg Borghoff , Thilo Stolze
IPC分类号： H01L23/24
CPC分类号： H01L23/10 , H01L21/50 , H01L2924/0002 , H01L2924/00
摘要： A power semiconductor module includes a package having a first package portion and a second package portion. The side of the first package portion facing the second package portion has an anchoring element with a first recess. The second package portion includes a second recess with an indentation which receives the anchoring element. To produce a mechanically firm connection between the first package portion and the second package portion, a plug-in element is inserted in the first recess and the second recess. The plug-in element displaces the anchoring element transversely with respect to the plug-in direction, causing the anchoring element to engage the indentation so that a form-fit connection is produced between the first package portion and the second package portion. The plug-in element prevents the anchoring element from disengaging the indentation.
摘要翻译：功率半导体模块包括具有第一封装部分和第二封装部分的封装。面向第二包装部分的第一包装部分的侧面具有带有第一凹部的锚定元件。第二包装部分包括具有凹陷的第二凹部，其接纳锚定元件。为了在第一包装部分和第二包装部分之间产生机械牢固的连接，插入元件插入第一凹部和第二凹部中。插入元件相对于插入方向横向地移动锚定元件，使得锚定元件接合凹陷，使得在第一包装部分和第二包装部分之间产生形状配合连接。插件元件防止锚固元件脱离凹槽。

3. 发明授权

US08159822B2 Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module 有权
标题翻译：具有弹性支撑衬底的功率半导体模块和用于制造功率半导体模块的方法
公开(公告)号：US08159822B2
公开(公告)日：2012-04-17
申请号：US12789251
申请日：2010-05-27
申请人： Peter Kanschat , Olaf Hohlfeld , Thilo Stolze
发明人： Peter Kanschat , Olaf Hohlfeld , Thilo Stolze
IPC分类号： H05K7/20
CPC分类号： H01L23/24 , H01L23/3735 , H01L23/4006 , H01L24/48 , H01L25/072 , H01L2023/4062 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01068 , H01L2924/181 , H01L2924/19107 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： The invention relates to a power semiconductor module including a module housing and at least one substrate populated with at least one power semiconductor chip. The module housing has a bottom side and a top side spaced away from the bottom side in a positive vertical direction. In addition, the substrate has a bottom side facing away from an interior of the module housing. The substrate is arranged in an opening of the module housing configured in its bottom side and attached to the module housing by a resilient bonding agent for freedom of movement of the substrate parallel to the vertical direction in relation to the module housing. In the non-mounted condition of the power semiconductor module, the substrate assumes a resting position in relation to the module housing. To deflect the substrate from the resting position parallel to the vertical direction, a deflection force of 0.1 N to 100 N per mm is applied.
摘要翻译：本发明涉及一种功率半导体模块，其包括模块壳体和至少一个填充有至少一个功率半导体芯片的衬底。模块壳体具有在垂直方向上与底侧间隔开的底侧和顶侧。此外，衬底具有背向模块壳体内部的底侧。衬底布置在模块壳体的开口中，其构造在其底侧，并通过弹性粘合剂附接到模块壳体，用于相对于模块壳体平行于垂直方向的衬底的运动自由。在功率半导体模块的非安装状态下，基板相对于模块壳体呈现静止位置。为了使基板从平行于垂直方向的静止位置偏转，施加0.1N至100N / mm的偏转力。

4. 发明授权

US08134837B2 Twist-secured assembly of a power semiconductor module mountable on a heat sink 有权
标题翻译：可安装在散热器上的功率半导体模块的扭转固定组件
公开(公告)号：US08134837B2
公开(公告)日：2012-03-13
申请号：US12777656
申请日：2010-05-11
申请人： Olaf Hohlfeld , Peter Kanschat , Thilo Stolze
发明人： Olaf Hohlfeld , Peter Kanschat , Thilo Stolze
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L23/3107 , H01L25/072 , H01L2023/405 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A power semiconductor module system includes a power semiconductor module, a heat sink and at least one fastener. The power semiconductor module includes a bottom side with a first thermal contact surface and the heat sink includes a top side with a second thermal contact surface. The power semiconductor module is conjoined with the heat sink by means of the at least one fastener. The power semiconductor module includes a number N1≧1 of first positioning elements and the heat sink a number N2≧1 of second positioning elements. Each of the first positioning elements corresponds to one of the second positioning elements and forms a pair therewith. The power semiconductor module and the heat sink are alignable relative to one another so that the two positioning elements of each of the pairs are interfitted when the power semiconductor module is mounted on the heat sink.
摘要翻译：功率半导体模块系统包括功率半导体模块，散热器和至少一个紧固件。功率半导体模块包括具有第一热接触表面的底侧，散热器包括具有第二热接触表面的顶侧。功率半导体模块通过至少一个紧固件与散热器结合。功率半导体模块包括N1≥1的第一定位元件和散热器，第二定位元件的数量N2≥1。第一定位元件中的每一个对应于第二定位元件中的一个并且与其形成一对。功率半导体模块和散热器可相对于彼此对齐，使得当功率半导体模块安装在散热器上时，每对的两个定位元件互相配合。

5. 发明申请

US20100284153A1 Twist-Secured Assembly of a Power Semiconductor Module Mountable on a Heat Sink 有权
标题翻译：安装在散热器上的功率半导体模块的扭绞组件
公开(公告)号：US20100284153A1
公开(公告)日：2010-11-11
申请号：US12777656
申请日：2010-05-11
申请人： Olaf Hohlfeld , Peter Kanschat , Thilo Stolze
发明人： Olaf Hohlfeld , Peter Kanschat , Thilo Stolze
IPC分类号： H05K7/20 , H01L21/50
CPC分类号： H01L23/4006 , H01L23/3107 , H01L25/072 , H01L2023/405 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A power semiconductor module system includes a power semiconductor module, a heat sink and at least one fastener. The power semiconductor module includes a bottom side with a first thermal contact surface and the heat sink includes a top side with a second thermal contact surface. The power semiconductor module is conjoined with the heat sink by means of the at least one fastener. The power semiconductor module includes a number N1≧1 of first positioning elements and the heat sink a number N2≧1 of second positioning elements. Each of the first positioning elements corresponds to one of the second positioning elements and forms a pair therewith. The power semiconductor module and the heat sink are alignable relative to one another so that the two positioning elements of each of the pairs are interfitted when the power semiconductor module is mounted on the heat sink.
摘要翻译：功率半导体模块系统包括功率半导体模块，散热器和至少一个紧固件。功率半导体模块包括具有第一热接触表面的底侧，散热器包括具有第二热接触表面的顶侧。功率半导体模块通过至少一个紧固件与散热器结合。功率半导体模块包括N1≥1的第一定位元件和散热器，第二定位元件的数量N2≥1。第一定位元件中的每一个对应于第二定位元件中的一个并且与其形成一对。功率半导体模块和散热器可相对于彼此对准，使得当功率半导体模块安装在散热器上时，每对的两个定位元件互相配合。

6. 发明申请

US20090021916A1 SEMICONDUCTOR ASSEMBLY HAVING A HOUSING 有权
标题翻译：具有住房的半导体组件
公开(公告)号：US20090021916A1
公开(公告)日：2009-01-22
申请号：US11780790
申请日：2007-07-20
申请人： Thilo Stolze
发明人： Thilo Stolze
IPC分类号： H05K7/14
CPC分类号： H01L23/48 , H01L21/50 , H01L23/04 , H01L23/053 , H01L23/16 , H01L24/48 , H01L25/072 , H01L2224/32188 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01015 , H01L2924/01068 , H01L2924/16195 , H01L2924/181 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A semiconductor assembly, power semiconductor module, a housing and methods for assembling the power semiconductor housing is disclosed. One embodiment provides an electrically insulating substrate has an inner housing having a cover and a peripheral rim, and at least one pressure element arranged adjacent a side-face of the peripheral rim. The pressure element is resiliently coupled to the inner housing.
摘要翻译：公开了半导体组件，功率半导体模块，壳体和用于组装功率半导体壳体的方法。一个实施例提供了一种电绝缘基板，其具有内壳体，该内壳体具有盖和周边边缘，以及邻近周边边缘的侧面布置的至少一个压力元件。压力元件弹性地联接到内壳体。

7. 发明申请

US20070202721A1 Sub-Assembly 有权
标题翻译：小组
公开(公告)号：US20070202721A1
公开(公告)日：2007-08-30
申请号：US11682483
申请日：2007-03-06
申请人： Thilo Stolze , Richard Boettcher
发明人： Thilo Stolze , Richard Boettcher
IPC分类号： H01R13/648
CPC分类号： H01L23/32 , H01L23/4006 , H01L24/48 , H01L25/072 , H01L2023/405 , H01L2023/4081 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/181 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A power semiconductor module has a heat-dissipation contact surface (16) for a thermally conductive connection to a cooling element (17). The module can be simply, cost-effectively and reliably fixed to the cooling element for the conduction of heat to the latter by at least one pressure element (18, 19) which is permanently connected to the power semiconductor module. When mounted, the pressure element (18) presses the heat-dissipation contact surface (16) against the cooling element (17).
摘要翻译：功率半导体模块具有用于与冷却元件（17）的导热连接的散热接触面（16）。该模块可以简单，经济高效地可靠地固定到冷却元件，以通过永久连接到功率半导体模块的至少一个压力元件（18,19）将热量传导到后者。当安装时，压力元件（18）将散热接触表面（16）压靠在冷却元件（17）上。

8. 发明授权

US06431259B1 Spring clip for fixing semiconductor modules to a heat sink 有权
公开(公告)号：US06431259B1
公开(公告)日：2002-08-13
申请号：US09793352
申请日：2001-02-26
申请人： Horst Hellbrück , Ralf Jörke , Konstantin Kanelis , Manfred Loddenkötter , Thilo Stolze
发明人： Horst Hellbrück , Ralf Jörke , Konstantin Kanelis , Manfred Loddenkötter , Thilo Stolze
IPC分类号： F28F700
摘要： In order to fix a semiconductor module to a heat sink, the semiconductor module and the heat sink are clamped together by one or more clips made of spring material, i.e. spring clips. A mutually matched form of the spring clips optimizes the connection between the heat sink and the semiconductor modules. A respective connection of clip body and heat sink or semiconductor module is advantageously effective in such a way that the spring clip can be inserted into a respective spring clip receptacle and holds automatically on/in the heat sink or semiconductor module.

9. 发明授权

US09373563B2 Semiconductor assembly having a housing 有权
标题翻译：具有壳体的半导体组件
公开(公告)号：US09373563B2
公开(公告)日：2016-06-21
申请号：US11780790
申请日：2007-07-20
申请人： Thilo Stolze
发明人： Thilo Stolze
IPC分类号： H01L23/06 , H01L23/48 , H01L21/50 , H01L23/04 , H01L23/053 , H01L23/16 , H01L25/07 , H01L23/00
CPC分类号： H01L23/48 , H01L21/50 , H01L23/04 , H01L23/053 , H01L23/16 , H01L24/48 , H01L25/072 , H01L2224/32188 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01015 , H01L2924/01068 , H01L2924/16195 , H01L2924/181 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A semiconductor assembly, power semiconductor module, a housing and methods for assembling the power semiconductor housing is disclosed. One embodiment provides an electrically insulating substrate has an inner housing having a cover and a peripheral rim, and at least one pressure element arranged adjacent a side-face of the peripheral rim. The pressure element is resiliently coupled to the inner housing.
摘要翻译：公开了半导体组件，功率半导体模块，壳体和用于组装功率半导体壳体的方法。一个实施例提供了一种电绝缘基板，其具有内壳体，该内壳体具有盖和周边边缘，以及邻近周边边缘的侧面布置的至少一个压力元件。压力元件弹性地联接到内壳体。

10. 发明授权

US08563364B2 Method for producing a power semiconductor arrangement 有权
标题翻译：一种功率半导体装置的制造方法
公开(公告)号：US08563364B2
公开(公告)日：2013-10-22
申请号：US13248311
申请日：2011-09-29
申请人： Thilo Stolze , Guido Strotmann , Karsten Guth
发明人： Thilo Stolze , Guido Strotmann , Karsten Guth
IPC分类号： H01L21/60
CPC分类号： H01L21/4853 , H01L23/3121 , H01L23/3735 , H01L23/49811 , H01L23/49838 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/072 , H01L2224/29311 , H01L2224/29339 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/83101 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/8381 , H01L2224/8382 , H01L2224/8384 , H01L2224/92247 , H01L2924/00014 , H01L2924/01327 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a method for producing a power semiconductor arrangement, a dielectric insulation carrier with a top side and a top metallization layer arranged on the top side are provided. Also provided are a semiconductor chip and at least one electrically conductive contact pin, each pin having a first end and an opposite second end. The semiconductor chip is sintered or diffussion soldered to the top metallization layer. Between the first end and the top metallization layer an electrically conductive connection is formed, in which electrically conductive connection material of the contact pin is in direct physical contact with the material of the top metallization layer.
摘要翻译：在制造功率半导体装置的方法中，提供了具有设置在顶侧的顶侧和顶部金属化层的介电绝缘载体。还提供有半导体芯片和至少一个导电接触销，每个销具有第一端和相对的第二端。将半导体芯片烧结或扩散焊接到顶部金属化层。在第一端部和顶部金属化层之间形成导电连接，其中接触销的导电连接材料与顶部金属化层的材料直接物理接触。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式