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1. 发明申请

US20190189532A1 INTEGRATED CIRCUIT PACKAGE AND FASTENER 审中-公开
公开(公告)号：US20190189532A1
公开(公告)日：2019-06-20
申请号：US16209347
申请日：2018-12-04
申请人： Nokia Technologies Oy
发明人： Jari HUTTUNEN , Matti AVIST
IPC分类号： H01L23/367 , H01L23/40 , H01L23/498 , H01L23/50
CPC分类号： H01L23/3677 , H01L23/4006 , H01L23/49811 , H01L23/49838 , H01L23/50 , H01L2023/4037 , H01L2023/405 , H01L2023/4087 , H05K1/0209 , H05K2201/066 , H05K2201/10409 , H05K2201/10734
摘要： An apparatus is disclosed comprising an integrated circuit package, wherein the integrated circuit package comprises a case containing at least one integrated circuit and a fastener configured to fasten the case to a heat sink. A system comprising the apparatus and a heat sink, and a method comprising providing the apparatus and fastening a heat sink to the case of the apparatus are also disclosed.

2. 发明申请

US20180342406A1 METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20180342406A1
公开(公告)日：2018-11-29
申请号：US15757832
申请日：2016-12-26
申请人： SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
发明人： Hideki KAMADA
IPC分类号： H01L21/56 , B29C39/10 , H01L23/40 , H01L23/31 , H01L23/29 , H01L23/544
CPC分类号： H01L21/565 , B29C39/10 , B29K2705/00 , B29L2031/3406 , H01L21/56 , H01L23/16 , H01L23/293 , H01L23/3121 , H01L23/367 , H01L23/4006 , H01L23/544 , H01L25/0655 , H01L2023/4025 , H01L2023/405 , H01L2023/4087
摘要： Manufacturing method for an electronic device comprises a step of placing a substrate 10, which has a metal plate 11 on a back-surface side, on a back-surface-side mold 110 having a mold recessed part 111, a step of placing a front-surface-side mold 120 on the back-surface-side mold so as to cover the substrate 10; and a step of pouring resin between the front-surface mold 100 and the back-surface-side mold 110, when the substrate 10 is pressed against the back-surface-side mold 110. Circumferential part of the metal plate 11 is in contact with an edge of the mold recessed part 111 when the substrate 10 is pressed against the back-surface-side mold 110 in the step of pouring resin.

3. 发明授权

US09735083B1 Adjustable heat sink fin spacing 有权
公开(公告)号：US09735083B1
公开(公告)日：2017-08-15
申请号：US15131134
申请日：2016-04-18
申请人： International Business Machines Corporation
发明人： Paul F. Bodenweber , Kamal K. Sikka
IPC分类号： H01L23/00 , H01L23/367 , F28F3/02 , H01L21/48 , H01L23/40
CPC分类号： F28F3/083 , F28F3/06 , F28F2215/14 , F28F2240/00 , H01L23/34 , H01L23/36 , H01L23/3672 , H01L23/4006 , H01L2023/405 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H05K7/20418 , H01L2924/00
摘要： A heat sink includes a heat sink base, a first fin, and a second fin. The spacing between the base and the first fin and the second fin, restively, may be adjusted by rotating a threaded rod. The threaded rod includes a first threaded knurl that is engaged with the first fin and a second threaded knurl that is engaged with the second fin. The thread pitch of the first threaded knurl and the second threaded knurl may differ. For example, the pitch of the first threaded knurl may be smaller than the pitch of the second threaded knurl if the first fin is located nearest the heat sink base relative to the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

4. 发明授权

US09497876B2 Fastening systems for power modules 有权
标题翻译：电源模块紧固系统
公开(公告)号：US09497876B2
公开(公告)日：2016-11-15
申请号：US14676858
申请日：2015-04-02
申请人： BRUSA Elektronik AG
发明人： Martin Berkmann , Katja Stengert
IPC分类号： H05K7/00 , H05K7/02 , H01L23/40 , H01L23/31 , H01L25/11 , H01L23/00
CPC分类号： H05K7/02 , H01L23/3121 , H01L23/4006 , H01L24/48 , H01L25/115 , H01L2023/4043 , H01L2023/405 , H01L2023/4087 , H01L2224/48247 , H01L2924/00014 , H01L2924/1815 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Fastening systems for power modules including molded body (2) with flat surface (2a) bearing on supporting structure, and a plurality of protruding contact pins (3). A pressing element (5) presses a power module (1) on a side opposite the supporting structure. A connecting element (11) fastens the pressing element (5) on the supporting structure and imparts a force pressing towards the supporting structure. Sections (9, 10) formed on the pressing element (5) have outer edge regions (10) acting elastically on edge regions of the power module (1) in the fastened position. These edge regions are loaded with a pressing force towards the supporting structure. Such power modules (1) are useable with such fastening systems, as are the pressing elements (5).
摘要翻译：包括具有支撑结构的平坦表面（2a）的成型体（2）和多个突出接触销（3）的功率模块的紧固系统。按压元件（5）在与支撑结构相对的一侧上按压功率模块（1）。连接元件（11）将按压元件（5）紧固在支撑结构上，并向支撑结构施加压力。形成在按压元件（5）上的部分（9,10）具有在紧固位置上弹性地作用于功率模块（1）的边缘区域的外缘区域（10）。这些边缘区域被加载到支撑结构上的按压力。这样的功率模块（1）可以与这种紧固系统一样使用，按压元件（5）也是如此。

5. 发明授权

US09354003B2 Heat sink fastening device and thermal module assembly using same 有权
标题翻译：散热片固定装置和散热组件使用相同
公开(公告)号：US09354003B2
公开(公告)日：2016-05-31
申请号：US14250371
申请日：2014-04-10
申请人： ASIA VITAL COMPONENTS CO., LTD.
发明人： Sheng-Huang Lin
IPC分类号： H01L23/34 , F28D15/02 , F28F99/00 , H01L23/40
CPC分类号： F28F99/00 , F28D15/0275 , F28F2275/08 , H01L23/34 , H01L23/4006 , H01L2023/405 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heat sink fastening device includes an operating member and a retaining member axially extended through the operating member and associated with the latter via a pivot shaft. The operating member includes a cylindrical cam portion, which has an elastic element received therein to provide the cam portion with an elastic force. The cam portion has an upper end formed into a pair of cam surfaces, on which the pivot shaft is rested. The operating member can be horizontally rotated about an axis thereof. When the operating member is rotated, the cam surfaces rotate and cause the pivot shaft to move from a higher to a lower position on the cam surfaces or vice versa, so that the retaining member associated with the operating member via the pivot shaft is brought by the pivot shaft to axially move downward to a released position or upward to a fastened position.
摘要翻译：散热器紧固装置包括操作构件和保持构件，所述操作构件和保持构件通过操作构件轴向延伸并且经由枢轴与后者相关联。操作构件包括圆柱形凸轮部分，其具有容纳在其中以提供凸轮部分的弹性力的弹性元件。凸轮部分具有形成为一对凸轮表面的上端，枢轴在其上搁置。操作构件可以围绕其轴线水平旋转。当操作构件旋转时，凸轮表面旋转并且使得枢轴在凸轮表面上从较高位置移动到较低位置，反之亦然，使得通过枢转轴与操作构件相关联的保持构件由枢转轴向下轴向移动到释放位置或向上移动到紧固位置。

6. 发明授权

US09312192B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US09312192B2
公开(公告)日：2016-04-12
申请号：US14455098
申请日：2014-08-08
申请人： FUJI ELECTRIC CO., LTD.
发明人： Masafumi Horio , Hideyo Nakamura
IPC分类号： H01L23/04 , H02M7/00 , H05K7/20 , H01L25/07 , H01L23/00 , H01L23/043 , H01L23/051 , H01L23/40 , H01L23/544 , H01L25/065 , H01L25/18 , H01L23/538 , H01L23/373 , H01L23/433
CPC分类号： H01L23/041 , H01L23/043 , H01L23/051 , H01L23/3735 , H01L23/4006 , H01L23/4334 , H01L23/5385 , H01L23/544 , H01L24/18 , H01L25/0655 , H01L25/072 , H01L25/18 , H01L2023/405 , H01L2924/01322 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H02M7/003 , H05K7/209 , H01L2924/00
摘要： A semiconductor device includes: a plurality of semiconductor modules, each of which includes a semiconductor circuit having a circuit board on which at least one or more semiconductor chips are mounted; and a module storage case that accommodates the plurality of semiconductor modules which are arranged in parallel. In the module storage case, a plurality of pairs of positioning guide members, which position and guide the semiconductor modules, are formed on opposite surfaces forming a module storage region for accommodating the semiconductor modules so as to protrude inward and to face each other, so that a distance between the plurality of semiconductor modules in a longitudinal direction can be selected. A pair of fitting concave portions, which are fitted to the pair of positioning guide members, are formed at both ends of each semiconductor module in the longitudinal direction.
摘要翻译：半导体器件包括：多个半导体模块，每个半导体模块包括具有电路板的半导体电路，在该电路板上安装有至少一个或多个半导体芯片; 以及容纳并行布置的多个半导体模块的模块存储盒。在模块收纳箱中，形成定位和引导半导体模块的多对定位引导构件形成在形成用于容纳半导体模块的模块存储区域的相对表面上，从而向内突出并且彼此面对，因此可以选择多个半导体模块之间的纵向方向上的距离。在各半导体模块的长度方向的两端形成有一对嵌合于一对定位导向构件的嵌合凹部。

7. 发明授权

US09215793B2 System and method for connecting LED devices 有权
标题翻译：用于连接LED设备的系统和方法
公开(公告)号：US09215793B2
公开(公告)日：2015-12-15
申请号：US14075748
申请日：2013-11-08
申请人： ABL IP Holding LLC
发明人： Daniel Vincent Sekowski
IPC分类号： H01L29/205 , H01L33/00 , H05K1/00 , H01L23/40
CPC分类号： H05K1/00 , F21K9/00 , F21V19/0015 , F21V29/70 , F21V31/005 , F21Y2115/10 , H01L2023/405 , H05K1/0209 , H05K2201/066 , H05K2201/10106
摘要： To connect multiple LED devices, each LED device is placed in a holder. A first wire is connected to a first wire connection point on the holder and a second wire is connected to a second wire connection point on the holder. The first wire is also connected to a first wire connection point on a circuit board The second wire is also connected to a second wire connection point on the circuit board. A connector may be used to connect the wires to the wire connection points on the circuit board. The circuit board includes traces to connect the LED devices to each other or to other components.
摘要翻译：要连接多个LED设备，每个LED设备都放置在一个固定器中。第一线连接到保持器上的第一线连接点，第二线连接到支架上的第二线连接点。第一线还连接到电路板上的第一线连接点。第二线也连接到电路板上的第二线连接点。可以使用连接器将电线连接到电路板上的电线连接点。电路板包括用于将LED器件彼此连接或连接到其他部件的迹线。

8. 发明授权

US09196561B2 Semiconductor device to be attached to heat radiation member 有权
标题翻译：要连接到散热构件的半导体装置
公开(公告)号：US09196561B2
公开(公告)日：2015-11-24
申请号：US14339653
申请日：2014-07-24
申请人： DENSO CORPORATION
发明人： Toshihiro Fujita
IPC分类号： H01L23/367 , H01L23/40 , H01L23/00 , H01L23/433 , H01L25/07
CPC分类号： H01L23/367 , H01L23/4006 , H01L23/4334 , H01L24/34 , H01L24/37 , H01L24/40 , H01L25/072 , H01L2023/4031 , H01L2023/405 , H01L2224/37147 , H01L2224/40137 , H01L2224/40139 , H01L2224/40245 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/84
摘要： A semiconductor device includes a semiconductor module and a pressing member pressing the semiconductor module to a heat radiation member. The semiconductor module includes heat generation elements generating heat by energization, three or more conductive members each of which mounted with at least one of the heat generation elements, and a molding part integrally molding the heat generation elements and the conductive members. The semiconductor module has a heat radiation possible region in which a forcing pressure by the pressing member is equal to or greater than a predetermined pressure. The conductive member mounted with the heat generation element disposed outside the heat radiation possible region has such a shape that at least a part of the conductive member is included in the heat radiation possible region.
摘要翻译：半导体器件包括半导体模块和将半导体模块按压到散热构件的按压构件。半导体模块包括通过通电而产生热量的发热元件，三个或更多个导电构件，每个导电构件安装有至少一个发热元件，以及模制部件一体地模制发热元件和导电构件。半导体模块具有其中加压构件的强制压力等于或大于预定压力的散热可能区域。安装有设置在散热可能区域外部的发热元件的导电构件具有这样的形状，使得至少一部分导电构件被包括在可辐射可能区域中。

9. 发明申请

US20150214133A1 Electronic Device and Method for Fabricating an Electronic Device 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US20150214133A1
公开(公告)日：2015-07-30
申请号：US14165754
申请日：2014-01-28
申请人： Infineon Technologies AG
发明人： Ralf Otremba , Josef Hoeglauer , Juergen Schredl , Teck Sim Lee , Xaver Schloegel , Klaus Schiess
IPC分类号： H01L23/40 , H01L23/00 , H01L21/3105 , H01L23/31 , H01L21/56
CPC分类号： H01L23/4006 , H01L21/31053 , H01L21/56 , H01L23/3107 , H01L23/367 , H01L23/4093 , H01L23/4334 , H01L23/49548 , H01L23/49562 , H01L23/49568 , H01L24/37 , H01L24/40 , H01L24/83 , H01L2023/4031 , H01L2023/405 , H01L2023/4087 , H01L2224/37147 , H01L2224/3754 , H01L2224/84801 , H01L2224/8485 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate element. The electronic device further includes an encapsulant configured to leave the contact element at least partially exposed such that a heatsink may be connected to the contact element.
摘要翻译：电子设备包括半导体芯片，其包括电极，基板元件和将电极连接到基板元件的接触元件。电子设备还包括密封剂，其被配置为使接触元件至少部分地暴露，使得散热器可以连接到接触元件。

10. 发明申请

US20150124410A1 POWER DOUBLER AMPLIFIER MODULE WITH IMPROVED SOLDER COVERAGE BETWEEN A HEAT SINK AND A THERMAL PAD OF A CIRCUIT PACKAGE 有权
标题翻译：电源双极放大器模块，具有改进的散热片与散热片与热电偶套管之间的焊接覆盖
公开(公告)号：US20150124410A1
公开(公告)日：2015-05-07
申请号：US14074057
申请日：2013-11-07
申请人： Cisco Technology, Inc.
发明人： Yongguo Chen , Hujiao Wang , David A. Holtzclaw , Wei Qi , Benjamin Lee Davis , John MacKay
IPC分类号： H05K7/20
CPC分类号： H01L23/3675 , H01L23/13 , H01L23/4006 , H01L23/42 , H01L2023/405 , H01L2023/4068 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface that contacts and thermally couples with the thermal pad. The wall includes at least one aperture there-through. Solder paste is provided between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste.
摘要翻译：在一个实施例中，装置包括印刷电路板和安装到印刷电路板的电路封装。电路封装有一个散热垫。模块的第一散热器结构与印刷电路板相关联并且具有限定与热垫接触并热耦合的接触表面的壁。墙壁至少包括一个孔。在接触表面和热垫之间提供焊膏以将接触表面粘合到热垫上，其中至少一个孔被构造和布置成有助于使焊膏脱气。

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