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    • 3. 发明授权
    • Integrated lateral short circuit for a beneficial modification of current distribution structure for xMR magnetoresistive sensors
    • 用于xMR磁阻传感器的电流分布结构的有益修改的集成横向短路
    • US08193897B2
    • 2012-06-05
    • US13004769
    • 2011-01-11
    • Juergen ZimmerThomas Bever
    • Juergen ZimmerThomas Bever
    • H01C10/00
    • G01R33/09B82Y25/00G01R33/093G01R33/096H01L43/08H01L43/12Y10T29/49082Y10T29/49124Y10T29/49165Y10T428/31663
    • The invention relates to a magnetoresistive device formed to sense an externally applied magnetic field, and a related method. The magnetoresistive device includes a magnetoresistive stripe formed over an underlying, metallic layer that is patterned to produce electrically isolated conductive regions over a substrate, such as a silicon substrate. An insulating layer separates the patterned metallic layer from the magnetoresistive stripe. A plurality of conductive vias is formed to couple the isolated regions of the metallic layer to the magnetoresistive stripe. The conductive vias form local short circuits between the magnetoresistive stripe and the isolated regions of the metallic layer to alter the uniformity of a current flow therein, thereby improving the position and angular sensing accuracy of the magnetoresistive device. In an advantageous embodiment, the metallic layer is formed as electrically conductive stripes oriented at approximately a 45° angle with respect to an axis of the magnetoresistive device.
    • 本发明涉及一种用于感测外部施加的磁场的磁阻器件及其相关方法。 磁阻器件包括形成在下面的金属层上的磁阻条,其被图案化以在诸如硅衬底的衬底上产生电隔离的导电区域。 绝缘层将图案化金属层与磁阻条纹分开。 形成多个导电通孔以将金属层的隔离区域耦合到磁阻条纹。 导电通孔在磁阻条和金属层的隔离区之间形成局部短路,以改变其中的电流的均匀性,从而改善磁阻器件的位置和角度感测精度。 在有利的实施例中,金属层形成为相对于磁阻器件的轴线以大约45°角定向的导电条纹。
    • 7. 发明授权
    • Integrated lateral short circuit for a beneficial modification of current distribution structure for xMR magnetoresistive sensors
    • 用于xMR磁阻传感器的电流分布结构的有益修改的集成横向短路
    • US08373536B2
    • 2013-02-12
    • US13481183
    • 2012-05-25
    • Juergen ZimmerThomas Bever
    • Juergen ZimmerThomas Bever
    • H01C10/00
    • G01R33/09B82Y25/00G01R33/093G01R33/096H01L43/08H01L43/12Y10T29/49082Y10T29/49124Y10T29/49165Y10T428/31663
    • The invention relates to a magnetoresistive device formed to sense an externally applied magnetic field, and a related method. The magnetoresistive device includes a magnetoresistive stripe formed over an underlying, metallic layer that is patterned to produce electrically isolated conductive regions over a substrate, such as a silicon substrate. An insulating layer separates the patterned metallic layer from the magnetoresistive stripe. A plurality of conductive vias is formed to couple the isolated regions of the metallic layer to the magnetoresistive stripe. The conductive vias form local short circuits between the magnetoresistive stripe and the isolated regions of the metallic layer to alter the uniformity of a current flow therein, thereby improving the position and angular sensing accuracy of the magnetoresistive device. In an advantageous embodiment, the metallic layer is formed as electrically conductive stripes oriented at approximately a 45° angle with respect to an axis of the magnetoresistive device.
    • 本发明涉及一种用于感测外部施加的磁场的磁阻器件及其相关方法。 磁阻器件包括形成在下面的金属层上的磁阻条,其被图案化以在诸如硅衬底的衬底上产生电隔离的导电区域。 绝缘层将图案化金属层与磁阻条纹分开。 形成多个导电通孔以将金属层的隔离区域耦合到磁阻条纹。 导电通孔在磁阻条和金属层的隔离区之间形成局部短路,以改变其中的电流的均匀性,从而改善磁阻器件的位置和角度感测精度。 在有利的实施例中,金属层形成为相对于磁阻器件的轴线以大约45°角定向的导电条纹。
    • 9. 发明授权
    • Integrated lateral short circuit for a beneficial modification of current distribution structure for xMR magnetoresistive sensors
    • 用于xMR磁阻传感器的电流分布结构的有益修改的集成横向短路
    • US07872564B2
    • 2011-01-18
    • US11941853
    • 2007-11-16
    • Juergen ZimmerThomas Bever
    • Juergen ZimmerThomas Bever
    • H01C10/32
    • G01R33/09B82Y25/00G01R33/093G01R33/096H01L43/08H01L43/12Y10T29/49082Y10T29/49124Y10T29/49165Y10T428/31663
    • The invention relates to a magnetoresistive device formed to sense an externally applied magnetic field, and a related method. The magnetoresistive device includes a magnetoresistive stripe formed over an underlying, metallic layer that is patterned to produce electrically isolated conductive regions over a substrate, such as a silicon substrate. An insulating layer separates the patterned metallic layer from the magnetoresistive stripe. A plurality of conductive vias is formed to couple the isolated regions of the metallic layer to the magnetoresistive stripe. The conductive vias form local short circuits between the magnetoresistive stripe and the isolated regions of the metallic layer to alter the uniformity of a current flow therein, thereby improving the position and angular sensing accuracy of the magnetoresistive device. In an advantageous embodiment, the metallic layer is formed as electrically conductive stripes oriented at approximately a 45° angle with respect to an axis of the magnetoresistive device.
    • 本发明涉及一种用于感测外部施加的磁场的磁阻器件及其相关方法。 磁阻器件包括形成在下面的金属层上的磁阻条,其被图案化以在诸如硅衬底的衬底上产生电隔离的导电区域。 绝缘层将图案化金属层与磁阻条纹分开。 形成多个导电通孔以将金属层的隔离区域耦合到磁阻条纹。 导电通孔在磁阻条和金属层的隔离区之间形成局部短路,以改变其中的电流的均匀性,从而改善磁阻器件的位置和角度感测精度。 在有利的实施例中,金属层形成为相对于磁阻器件的轴线以大约45°角定向的导电条纹。
    • 10. 发明授权
    • Micromechanical sensor and method for its production
    • 微机械传感器及其生产方法
    • US06389902B2
    • 2002-05-21
    • US09781798
    • 2001-02-12
    • Robert AignerHans-Jörg TimmeThomas Bever
    • Robert AignerHans-Jörg TimmeThomas Bever
    • G01L900
    • B81C1/00801B81B2201/0257B81B2201/0264B81B2203/0127B81B2207/015B81C2201/0136H04R19/005H04R19/04H04R31/00
    • The invention relates to a micromechanical sensor and to a corresponding production method that includes the following steps: a) preparing a doped semiconductor wafer; b) applying an epitaxial layer that is doped in such a way that a jump in the charge carrier density in the interface between the semiconductor wafer and the epitaxial layer occurs; c) optionally etching ventilation holes traversing the epitaxial layer and optionally filling the ventilation holes with a sacrificial material; d) depositing at least one sacrificial layer, at least one spacing layer, a membrane and optionally a semiconductor circuit on the top side of the epitaxial layer using a technology known per se, wherein the semiconductor circuit may be applied after the membrane is formed or while depositing the layers required to form the membrane; e) etching a hole on the back part of the sensor, wherein the etching method is selected in such a way that etching advances in the direction of the top side and ceases in the interference between the wafer and the epitaxial layer by changing charge carrier concentration. The invention also relates to the utilization of the micromechanical sensor in pressure sensors or microphones.
    • 本发明涉及一种微机械传感器及相应的生产方法,包括以下步骤:a)制备掺杂半导体晶片; b)施加掺杂的外延层,使得发生半导体晶片和外延层之间的界面中的电荷载流子密度的跳跃; c)可选地蚀刻穿过外延层的通气孔并且可选地用牺牲材料填充通风孔; d)使用本身已知的技术在外延层的顶侧上沉积至少一个牺牲层,至少一个间隔层,膜和任选的半导体电路,其中半导体电路可以在膜被形成之后施加 同时沉积形成膜所需的层; e)蚀刻传感器后部的孔,其中蚀刻方法被选择为使得蚀刻沿着顶侧的方向前进并且通过改变电荷载流子浓度而在晶片和外延层之间的干涉中停止 。 本发明还涉及在压力传感器或麦克风中利用微机械传感器。