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    • 1. 发明申请
    • Passive cooling for fiber to the premise (FTTP) electronics
    • 被动冷却为光纤到前提(FTTP)电子
    • US20070115635A1
    • 2007-05-24
    • US11282941
    • 2005-11-18
    • Andrew LowThyagarajan Ramachandran
    • Andrew LowThyagarajan Ramachandran
    • H05K7/20
    • H05K7/20
    • A phase change material, including multiple phase change materials of different formulations, is placed in heat transfer association with an electronics enclosure (e.g., a sealed enclosure) deployed in an environment that causes the electronics and the phase change material to experience periods of heating and periods of cooling. During the periods of heating, the phase change material absorbs heat and changes at least partially from a first state to a second state to maintain the temperature of the electronics at a desirable level. During the periods of cooling, the phase change material reverts at least partially back to the first state for future heat absorption. The phase change material is cooled by a thermally cooler body such as the night sky. The electronics enclosure and phase change material may be placed in a second enclosure covered with a paint having a paint additive that reflects solar radiation.
    • 相变材料,包括不同配方的多相变材料,与部署在使电子器件和相变材料经历加热周期的环境中的电子外壳(例如,密封外壳)热传递相关联, 冷却期。 在加热期间,相变材料吸收热量并且至少部分地从第一状态改变到第二状态,以将电子器件的温度保持在期望的水平。 在冷却期间,相变材料至少部分地回复到第一状态以供将来吸热。 相变材料由诸如夜空的热的冷却器体来冷却。 电子外壳和相变材料可以放置在覆盖有涂料的第二外壳中,该涂料具有反射太阳辐射的涂料添加剂。