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    • 3. 发明授权
    • Vapor deposition device, vapor deposition method, and organic EL display device
    • 气相沉积装置,气相沉积法和有机EL显示装置
    • US09240572B2
    • 2016-01-19
    • US13984799
    • 2012-03-02
    • Shinichi KawatoSatoshi InoueTohru SonodaSatoshi Hashimoto
    • Shinichi KawatoSatoshi InoueTohru SonodaSatoshi Hashimoto
    • H01L51/56C23C14/04C23C14/12C23C14/56C23C16/455H01L51/00
    • H01L51/56C23C14/044C23C14/12C23C14/562C23C16/45578H01L51/0011
    • A vapor deposition device includes a vapor deposition source (60) having a plurality of vapor deposition source openings (61) that discharge vapor deposition particles (91), a limiting unit (80) having a plurality of limiting openings (82), and a vapor deposition mask (70) in which a plurality of mask openings (71) are formed only in a plurality of vapor deposition regions (72) where the vapor deposition particles that have passed through a plurality of limiting openings reach. The plurality of vapor deposition regions are arranged along a second direction that is orthogonal to the normal line direction of the substrate (10) and the movement direction of the substrate, with non-vapor deposition regions (73) where the vapor deposition particles do not reach being sandwiched therebetween. Mask openings through which the vapor deposition particles pass are formed at different positions in the movement direction of the substrate from the positions of the non-vapor deposition regions located on a straight line parallel to the second direction, as viewed along the normal line direction of the substrate. Accordingly, it is possible to stably form a vapor deposition coating film in which edge blurring is suppressed at a desired position on a substrate.
    • 蒸镀装置包括:蒸镀源(60),具有排出气相沉积粒子(91)的多个气相沉积源开口(61),具有多个限制开口(82)的限制单元(80) 气相沉积掩模(70),其中多个掩模开口(71)仅形成在已经通过多个限制孔的气相沉积颗粒到达的多个气相沉积区(72)中。 多个气相沉积区域沿着与基板(10)的法线方向正交的第二方向和基板的移动方向排列,其中气相沉积微粒不具有非气相沉积区域(73) 夹在其间。 沿着平行于第二方向的直线上的非蒸镀区域的位置,沿着基板的移动方向的不同位置,沿蒸镀粒子的法线方向 底物。 因此,可以稳定地形成在基板上的期望位置抑制边缘模糊的气相沉积涂膜。
    • 7. 发明授权
    • Film forming method
    • 成膜方法
    • US08951816B2
    • 2015-02-10
    • US13635201
    • 2011-02-28
    • Rena TsuruokaHisao IkedaTakuya TsurumeTohru SonodaSatoshi Inoue
    • Rena TsuruokaHisao IkedaTakuya TsurumeTohru SonodaSatoshi Inoue
    • H01L21/00H01L51/00C23C14/04H01L51/56
    • H01L51/0013C23C14/04C23C14/048H01L51/56
    • One embodiment of the present invention is a film forming method comprising: arranging a surface of a film formation substrate 10 including an absorption layer 12 on a first substrate 11 and a material layer 13 containing a film formation material and a surface of a film-formation target substrate 20 including a first layer 23 over a second substrate 22, so as to face each other; forming a second layer 13a containing the film formation material over the first layer 23 by performing first heat treatment on the material layer 13; and forming a third layer 13b containing the film formation material over the second layer 13a by performing second heat treatment on the material layer 13. In the second heat treatment, energy with a density higher than that in the first heat treatment is applied to the material layer.
    • 本发明的一个实施方案是一种成膜方法,其包括:将包含吸收层12的成膜基板10的表面布置在第一基板11和包含成膜材料的材料层13和膜形成表面 目标基板20包括第二基板22上的第一层23,以便彼此面对; 通过对材料层13进行第一次热处理,在第一层23上形成含有成膜材料的第二层13a; 并在第二层13a上形成含有成膜材料的第三层13b,在材料层13上进行第二热处理。在第二热处理中,将密度高于第一热处理的能量施加到材料 层。
    • 9. 发明授权
    • Deposition apparatus, and deposition method
    • 沉积设备和沉积方法
    • US08691016B2
    • 2014-04-08
    • US13522007
    • 2010-10-29
    • Tohru SonodaNobuhiro HayashiShinichi Kawato
    • Tohru SonodaNobuhiro HayashiShinichi Kawato
    • B05C11/11C23C16/00H01L21/00H01L21/31H01L21/469
    • H01L51/001C23C14/042C23C14/12H01L27/3211H01L51/0011H01L51/56
    • A deposition mask 601 is used to form a thin film 3 in a prescribed pattern on a substrate 10 by deposition. Each of a plurality of improved openings 62A of the deposition mask 601 has a protruding opening portion 64, and is formed so that the opening amount at an end in a lateral direction is larger than that in a central portion in the lateral direction. In a deposition apparatus 50, the deposition mask 601 is held in a fixed relative positional relation with a deposition source 53 by a mask unit 55. In the case of forming the thin film 3 in a stripe pattern on the substrate 10 by the deposition apparatus 50, deposition particles are sequentially deposited on the substrate 10 while relatively moving the substrate 10 along a scanning direction with a gap H being provided between the substrate 10 and the deposition mask 601.
    • 沉积掩模601用于通过沉积在衬底10上以规定的图案形成薄膜3。 沉积掩模601的多个改进开口62A中的每一个具有突出的开口部分64,并且形成为使得横向端部的开口量大于在横向方向上的中心部分的开口量。 在沉积装置50中,沉积掩模601通过掩模单元55与沉积源53保持固定的相对位置关系。在通过沉积装置在基板10上形成条纹图案的薄膜3的情况下 如图50所示,在衬底10和衬底10之间设置有间隙H的同时使衬底10沿着扫描方向相对移动的同时,沉积粒子依次沉积在衬底10上。