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1. 发明申请

US20120108061A1 SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 有权
标题翻译：基板加工装置及制造半导体装置的方法
公开(公告)号：US20120108061A1
公开(公告)日：2012-05-03
申请号：US13242690
申请日：2011-09-23
申请人： Tokunobu AKAO , Unryu OGAWA , Masahisa OKUNO , Shinji YASHIMA , Atsushi UMEKAWA , Kaichiro MINAMI
发明人： Tokunobu AKAO , Unryu OGAWA , Masahisa OKUNO , Shinji YASHIMA , Atsushi UMEKAWA , Kaichiro MINAMI
IPC分类号： H01L21/285 , C23C16/511
CPC分类号： H01L21/28194 , H01L21/67109 , H01L21/67115
摘要： A substrate processing apparatus includes a processing chamber configured to process a substrate having a front surface including a dielectric, a substrate support member provided within the processing chamber to support the substrate, a microwave supplying unit configured to supply a microwave to a front surface side of the substrate supported on the substrate support member; and a conductive substrate cooling unit which is provided at a rear surface side of the substrate supported on the substrate support member and has an opposing surface facing the rear surface of the substrate. A distance between the top of the substrate support member and the opposing surface of the substrate cooling unit corresponds to an odd multiple of ¼ wavelength of the microwave supplied when the substrate is processed.
摘要翻译：一种基板处理装置，包括：处理室，被配置为处理具有包括电介质的前表面的基板，设置在所述处理室内的基板支撑构件以支撑所述基板;微波供给单元，被配置为将微波提供给所述基板支撑在所述基板支撑构件上; 以及导电基板冷却单元，其设置在所述基板的背面侧，所述基板支撑在所述基板支撑构件上，并具有面向所述基板的背面的相对面。衬底支撑构件的顶部和衬底冷却单元的相对表面之间的距离对应于当衬底被处理时提供的微波的1/4倍数的奇数倍。

2. 发明授权

US06742977B1 Substrate processing device, substrate conveying device, and substrate processing method 失效
标题翻译：基板处理装置，基板输送装置及基板处理方法
公开(公告)号：US06742977B1
公开(公告)日：2004-06-01
申请号：US09503916
申请日：2000-02-15
申请人： Satohiro Okayama , Motoichi Kanazawa , Takeshige Ishida , Tomohiko Takeda , Yukio Akita , Satoru Ichimura , Kazunori Suzuki , Teruo Yoshino , Tokunobu Akao , Yasunobu Nakayama
发明人： Satohiro Okayama , Motoichi Kanazawa , Takeshige Ishida , Tomohiko Takeda , Yukio Akita , Satoru Ichimura , Kazunori Suzuki , Teruo Yoshino , Tokunobu Akao , Yasunobu Nakayama
IPC分类号： H01L2168
CPC分类号： H01L21/67742 , H01L21/67745 , H01L21/67748 , Y10S414/135 , Y10S414/14
摘要： An unprocessed substrate is conveyed to a film-processing chamber at the same time a processed substrate is conveyed to a substrate preparation chamber, reducing the substrate processing cycle, thereby increasing the yield per unit time. The substrate preparation chamber has a two-tiered structure for receiving processed substrates and unprocessed substrates. A two-tiered transfer robot allows the substrates to be removed or placed into the preparation and process chambers at the same time, thus decreasing the cycle time for processing a substrate.
摘要翻译：将未处理的基板输送到膜处理室，同时将处理后的基板输送到基板准备室，减少基板处理循环，从而提高单位时间的产量。衬底制备室具有用于接收经处理的衬底和未处理衬底的双层结构。双层传送机器人可以将基板同时移除或放置在准备和处理室中，从而减少加工基板的循环时间。

3. 发明授权

US08795433B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US08795433B2
公开(公告)日：2014-08-05
申请号：US12382222
申请日：2009-03-11
申请人： Tokunobu Akao , Kazuyoshi Yamamoto
发明人： Tokunobu Akao , Kazuyoshi Yamamoto
IPC分类号： C23C16/00 , C23F1/00 , H01L21/306 , G06F19/00 , G05B19/418 , H01L21/67
CPC分类号： G05B19/4183 , G05B2219/31291 , G05B2219/31304 , H01L21/67276 , Y02P90/10 , Y02P90/18
摘要： There is provided a substrate processing apparatus that can easily grasp the relationship of a defect substrate between plural batches.A substrate processing apparatus 10 includes: a display unit 16; a storage unit that accumulates and stores production information of the substrate for each batch, the production information being produced when the substrate is processed; a selection receiving unit that receives the selection of plural batches stored in the storage unit; and a display control unit that controls such that substrate information is displayed on the display part, the substrate information being information relating to a state in which the substrates are held the substrate holding part in the plural batches received by the selection receiving unit.
摘要翻译：提供了能够容易地掌握多个批次之间的缺陷基板的关系的基板处理装置。基板处理装置10包括：显示单元16; 存储单元，其累积并存储每批的所述基板的生产信息，所述生产信息在所述基板被处理时产生; 选择接收单元，其接收存储在所述存储单元中的多个批次的选择; 以及显示控制单元，其控制使得在显示部分上显示基板信息，所述基板信息是与由所述选择接收单元接收的多个批次中所述基板被保持的所述基板保持部分的状态有关的信息。

4. 发明授权

US5957651A Substrate carrying apparatus 失效
标题翻译：基板输送装置
公开(公告)号：US5957651A
公开(公告)日：1999-09-28
申请号：US776653
申请日：1997-07-21
申请人： Yuji Takebayashi , Tokunobu Akao , Yoshikazu Konno
发明人： Yuji Takebayashi , Tokunobu Akao , Yoshikazu Konno
IPC分类号： B65G49/07 , H01L21/677 , H01L21/68 , H01L21/687
CPC分类号： H01L21/67748 , H01L21/68 , H01L21/687 , H01L21/68707 , Y10S414/136 , Y10S414/14 , Y10S414/141
摘要： A rotary shaft is supported by a frame so as to be rotatable and movable vertically relative to the frame. A carrying arm is pivoted to the rotary shaft and a substrate receiver is attached to an end of the carrying arm and receives a substrate. A guide base is mounted on the rotary shaft on the lower side of the substrate receiver in such a manner that the guide base is approximately parallel to the substrate receiver, and a substrate alignment mechanism is attached to the rotary shaft via the guide base. The substrate alignment mechanism includes a pair of location correcting members which are coupled to air cylinders. The location correcting members are displaced by air cylinders to correct the location of substrate.
摘要翻译： PCT No.PCT / JP96 / 01531 Sec。 371日期1997年7月21日 102（e）1997年7月21日PCT PCT 1996年6月6日PCT公布。 WO96 / 42108 PCT公开号日期1996年12月27日旋转轴由框架支撑，以便相对于框架可旋转并且可垂直移动。承载臂枢转到旋转轴，并且衬底接收器附接到承载臂的端部并且接收衬底。引导基座以这样的方式安装在基板接收器的下侧的旋转轴上，使得引导基座大致平行于基板接收器，并且基板对准机构经由引导基座附接到旋转轴。基板对准机构包括耦合到气缸的一对位置校正构件。位置校正构件被气缸移位以校正衬底的位置。

5. 发明申请

US20120129358A1 SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：基板加工装置及制造半导体装置的方法
公开(公告)号：US20120129358A1
公开(公告)日：2012-05-24
申请号：US13240545
申请日：2011-09-22
申请人： Unryu OGAWA , Masahisa OKUNO , Tokunobu AKAO , Shinji YASHIMA , Atsushi UMEKAWA , Kaichiro MINAMI
发明人： Unryu OGAWA , Masahisa OKUNO , Tokunobu AKAO , Shinji YASHIMA , Atsushi UMEKAWA , Kaichiro MINAMI
IPC分类号： H01L21/26 , H05B6/80
CPC分类号： H01L21/67109 , H01L21/67115 , H01L21/6875 , H05B6/806
摘要： Provided are a substrate processing apparatus and a method of manufacturing a semiconductor device that are capable of uniformly heating a substrate while reducing an increase in substrate temperature to reduce a thermal budget. The substrate processing apparatus includes a process chamber configured to process a substrate; a substrate support unit installed in the process chamber to support the substrate; a microwave supply unit configured to supply a microwave toward a process surface of the substrate supported by the substrate support unit, the microwave supply unit including a microwave radiating unit radiating the microwave supplied from a microwave source to the process chamber while rotating; a partition installed between the microwave supply unit and the substrate support unit; a cooling unit installed at the substrate support unit; and a control unit configured to control at least the substrate support unit, the microwave supply unit and the cooling unit.
摘要翻译：提供了一种能够均匀加热衬底同时减少衬底温度增加以降低热量预算的衬底处理设备和半导体器件的制造方法。基板处理装置包括：处理室，被配置为处理基板; 安装在所述处理室中以支撑所述基板的基板支撑单元; 微波供给单元，被配置为向由所述基板支撑单元支撑的所述基板的处理表面供给微波，所述微波供给单元包括微波辐射单元，所述微波辐射单元在旋转的同时将从微波源供应的微波辐射到所述处理室; 安装在所述微波供给单元和所述基板支撑单元之间的隔板; 安装在所述基板支撑单元处的冷却单元; 以及控制单元，被配置为至少控制所述基板支撑单元，所述微波提供单元和所述冷却单元。

6. 发明授权

US5850071A Substrate heating equipment for use in a semiconductor fabricating apparatus 失效
标题翻译：用于半导体制造装置的基板加热设备
公开(公告)号：US5850071A
公开(公告)日：1998-12-15
申请号：US694875
申请日：1996-08-09
申请人： Issei Makiguchi , Katsuyoshi Hamano , Tokunobu Akao
发明人： Issei Makiguchi , Katsuyoshi Hamano , Tokunobu Akao
IPC分类号： H01L21/00 , C23C16/00 , F27B5/14 , H01L21/324
CPC分类号： H01L21/67109
摘要： A substrate heating equipment for use in a semiconductor fabricating apparatus includes a heater support frame disposed within a vacuum vessel, opposed panel heaters disposed in a pluri-shelved fashion within the heater support frame, and support means for supporting a substrate to be treated between an adjacent pair of the opposed panel heaters, whereby simultaneous heating of plural substrates to be treated is enabled. By controlling the individual temperature of the panel heaters, it also becomes possible to significantly reduce a tact time and to effect uniform heating of the substrates while the equipment is rendered compact.
摘要翻译：在半导体制造装置中使用的基板加热装置包括设置在真空容器内的加热器支撑框架，在加热器支撑框架内以三轴搁置的方式设置的相对的面板式加热器，以及支撑装置，用于将待处理的基板相邻的一对相对面板加热器，从而能够同时加热待处理的多个基板。通过控制面板式加热器的单独温度，在设备紧凑化的同时，也可以显着地减少节拍时间并实现基板的均匀加热。

7. 发明授权

US08987645B2 Substrate processing apparatus having rotatable slot-type antenna and method of manufacturing semiconductor device using the same 有权
标题翻译：具有可旋转槽型天线的基板处理装置及使用该天线的半导体装置的制造方法
公开(公告)号：US08987645B2
公开(公告)日：2015-03-24
申请号：US13240545
申请日：2011-09-22
申请人： Unryu Ogawa , Masahisa Okuno , Tokunobu Akao , Shinji Yashima , Atsushi Umekawa , Kaichiro Minami
发明人： Unryu Ogawa , Masahisa Okuno , Tokunobu Akao , Shinji Yashima , Atsushi Umekawa , Kaichiro Minami
IPC分类号： H05B6/68 , H05B6/64 , H01L21/67 , H01L21/687 , H05B6/80
CPC分类号： H01L21/67109 , H01L21/67115 , H01L21/6875 , H05B6/806
摘要： Provided are a substrate processing apparatus and a method of manufacturing a semiconductor device that are capable of uniformly heating a substrate while reducing an increase in substrate temperature to reduce a thermal budget. The substrate processing apparatus includes a process chamber configured to process a substrate; a substrate support unit installed in the process chamber to support the substrate; a microwave supply unit configured to supply a microwave toward a process surface of the substrate supported by the substrate support unit, the microwave supply unit including a microwave radiating unit radiating the microwave supplied from a microwave source to the process chamber while rotating; a partition installed between the microwave supply unit and the substrate support unit; a cooling unit installed at the substrate support unit; and a control unit configured to control at least the substrate support unit, the microwave supply unit and the cooling unit.
摘要翻译：提供了一种能够均匀加热衬底同时减少衬底温度增加以降低热量预算的衬底处理设备和半导体器件的制造方法。基板处理装置包括：处理室，被配置为处理基板; 安装在所述处理室中以支撑所述基板的基板支撑单元; 微波供给单元，被配置为向由所述基板支撑单元支撑的所述基板的处理表面供给微波，所述微波供给单元包括微波辐射单元，所述微波辐射单元在旋转的同时将从微波源供应的微波辐射到所述处理室; 安装在微波提供单元和基板支撑单元之间的隔板; 安装在所述基板支撑单元处的冷却单元; 以及控制单元，被配置为至少控制所述基板支撑单元，所述微波提供单元和所述冷却单元。

8. 发明授权

US08557720B2 Substrate processing apparatus and method of manufacturing a semiconductor device 有权
标题翻译：基板处理装置及半导体装置的制造方法
公开(公告)号：US08557720B2
公开(公告)日：2013-10-15
申请号：US13242690
申请日：2011-09-23
申请人： Tokunobu Akao , Unryu Ogawa , Masahisa Okuno , Shinji Yashima , Atsushi Umekawa , Kaichiro Minami
发明人： Tokunobu Akao , Unryu Ogawa , Masahisa Okuno , Shinji Yashima , Atsushi Umekawa , Kaichiro Minami
IPC分类号： H01L21/324 , H01L21/42 , H01L21/44
CPC分类号： H01L21/28194 , H01L21/67109 , H01L21/67115
摘要： A substrate processing apparatus includes a processing chamber configured to process a substrate having a front surface including a dielectric, a substrate support member provided within the processing chamber to support the substrate, a microwave supplying unit configured to supply a microwave to a front surface side of the substrate supported on the substrate support member; and a conductive substrate cooling unit which is provided at a rear surface side of the substrate supported on the substrate support member and has an opposing surface facing the rear surface of the substrate. A distance between the top of the substrate support member and the opposing surface of the substrate cooling unit corresponds to an odd multiple of ¼ wavelength of the microwave supplied when the substrate is processed.
摘要翻译：一种基板处理装置，包括：处理室，被配置为处理具有包括电介质的前表面的基板，设置在所述处理室内的基板支撑构件以支撑所述基板;微波供给单元，被配置为将微波提供给所述基板支撑在所述基板支撑构件上; 以及导电基板冷却单元，其设置在所述基板的背面侧，所述基板支撑在所述基板支撑构件上，并具有面向所述基板的背面的相对面。衬底支撑构件的顶部和衬底冷却单元的相对表面之间的距离对应于当衬底被处理时提供的微波的1/4倍数的奇数倍。

9. 发明申请

US20090229518A1 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US20090229518A1
公开(公告)日：2009-09-17
申请号：US12382222
申请日：2009-03-11
申请人： Tokunobu Akao , Kazuyoshi Yamamoto
发明人： Tokunobu Akao , Kazuyoshi Yamamoto
IPC分类号： B05C11/00
CPC分类号： G05B19/4183 , G05B2219/31291 , G05B2219/31304 , H01L21/67276 , Y02P90/10 , Y02P90/18
摘要： There is provided a substrate processing apparatus that can easily grasp the relationship of a defect substrate between plural batches.A substrate processing apparatus 10 includes: a display unit 16; a storage unit that accumulates and stores production information of the substrate for each batch, the production information being produced when the substrate is processed; a selection receiving unit that receives the selection of plural batches stored in the storage unit; and a display control unit that controls such that substrate information is displayed on the display part, the substrate information being information relating to a state in which the substrates are held the substrate holding part in the plural batches received by the selection receiving unit.
摘要翻译：提供了能够容易地掌握多个批次之间的缺陷基板的关系的基板处理装置。基板处理装置10包括：显示单元16; 存储单元，其累积并存储每批的所述基板的生产信息，所述生产信息在所述基板被处理时产生; 选择接收单元，其接收存储在所述存储单元中的多个批次的选择; 以及显示控制单元，其控制使得在显示部分上显示基板信息，所述基板信息是与由所述选择接收单元接收的多个批次中所述基板被保持的所述基板保持部分的状态有关的信息。

10. 发明申请

US20080288217A1 Data Logging Method 审中-公开
标题翻译：数据记录方法
公开(公告)号：US20080288217A1
公开(公告)日：2008-11-20
申请号：US11990849
申请日：2006-09-21
申请人： Tokunobu Akao
发明人： Tokunobu Akao
IPC分类号： G06F17/40
CPC分类号： G01D9/005
摘要： The invention relates to the acquisition of log data in an apparatus such as a substrate processing apparatus. The invention permits detailed data related to a premonitory phenomenon preceding the occurrence of an alarm condition to be acquired without increasing the amount of data. A data logging method of the invention has a constitution wherein a difference between the maximum value and the minimum value of the acquired data is determined, wherein a first segment of the acquired data is stored if the difference is not less than a preset value, and if the difference is less than the preset value, a second portion included in the first segment of the acquired data is stored.
摘要翻译：本发明涉及在诸如基板处理装置的装置中采集对数数据。本发明允许在不增加数据量的情况下获取与发生报警条件之前的预兆现象相关的详细数据。本发明的数据记录方法具有以下结构，其中确定所获取的数据的最大值和最小值之间的差异，其中如果差值不小于预设值，则存储所获取的数据的第一段，以及如果差小于预设值，则存储所获取数据的第一段中包括的第二部分。

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