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1. 发明授权

US08710158B2 Epoxy composition for encapsulating an optical semiconductor element 有权
标题翻译：用于封装光学半导体元件的环氧组合物
公开(公告)号：US08710158B2
公开(公告)日：2014-04-29
申请号：US13080730
申请日：2011-04-06
申请人： Manabu Ueno , Miyuki Wakao , Tsutomu Kashiwagi
发明人： Manabu Ueno , Miyuki Wakao , Tsutomu Kashiwagi
IPC分类号： C08G59/20 , C08G59/42 , C08G59/62 , C08L63/00 , C08L83/08 , C08L83/10 , H01L21/56
CPC分类号： H01L33/56 , C08G59/306 , C08G59/3254 , C08G59/42
摘要： The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.
摘要翻译：本发明的目的是提供一种用于封装光学半导体元件的环氧组合物，该组合物提供具有低透气性的固化产物和薄膜形式的优异的固化性以及良好的透光性和抗裂纹性。本发明提供一种组合物，其包含（A）由式（1）表示的硅氧烷改性的环氧化合物，（B）固化剂和（C）多元醇。本发明还提供一种组合物，其包含通过（A）硅氧烷改性的环氧化合物，（B）固化剂和（C）多元醇和（D）固化催化剂及其固化产物反应制备的组合物。

2. 发明授权

US08373196B2 Composition encapsulating optical semiconductor and optical semiconductor device using same 有权
标题翻译：用于封装光学半导体的组合物和使用其的光学半导体器件
公开(公告)号：US08373196B2
公开(公告)日：2013-02-12
申请号：US12716823
申请日：2010-03-03
申请人： Tsutomu Kashiwagi , Masanobu Sato
发明人： Tsutomu Kashiwagi , Masanobu Sato
IPC分类号： H01L33/56 , C08L83/06
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , H01L24/45 , H01L24/48 , H01L33/486 , H01L33/56 , H01L2224/451 , H01L2224/48465 , H01L2224/48997 , H01L2224/83439 , H01L2224/85951 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/19107 , C08L83/00 , C08L2666/54 , H01L2924/00 , H01L2224/48455 , H01L2224/45099 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A composition for encapsulating optical semiconductors. The composition comprises (A) a mixture of a linear alkenyl group-containing organopolysiloxane and an alkenyl group-containing organopolysiloxane resin containing at least one SiO2 unit, (B) a mixture of a linear organohydrogenpolysiloxane containing two or more SiH groups and a branched organohydrogenpolysiloxane that is liquid at 25° C., (C) a platinum group metal catalyst, and (D) a linear or cyclic organopolysiloxane having at least two functional groups selected from the group consisting of alkenyl groups, alkoxysilyl groups and epoxy groups bonded to silicon atoms. A cured product of the composition exhibits dramatically reduced surface tack, and therefore using the composition for encapsulating optical semiconductor elements improves the optical semiconductor device yield.
摘要翻译：一种用于封装光学半导体的组合物。该组合物包含（A）含有直链烯基的有机聚硅氧烷和含有至少一个SiO 2单元的含烯基的有机聚硅氧烷树脂的混合物，（B）含有两个或多个SiH基的直链有机氢聚硅氧烷和支链有机氢聚硅氧烷在25℃下为液体，（C）铂族金属催化剂，和（D）具有至少两个选自烯基，烷氧基甲硅烷基和与硅结合的环氧基的官能团的直链或环状有机聚硅氧烷原子组合物的固化产物表现出显着降低的表面粘着性，因此使用用于封装光学半导体元件的组合物可提高光学半导体器件的产率。

3. 发明申请

US20120261068A1 CURABLE SILICONE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPAQUE SILICONE ADHESIVE SHEET FORMED FROM THE COMPOSITION 审中-公开
标题翻译：可固化的硅酮树脂组合物，固化的产品和由组合物形成的OPAQIC硅胶粘合片
公开(公告)号：US20120261068A1
公开(公告)日：2012-10-18
申请号：US13457605
申请日：2012-04-27
申请人： Tsutomu KASHIWAGI
发明人： Tsutomu KASHIWAGI
IPC分类号： B32B37/26
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08L83/00
摘要： Disclosed is a curable silicone resin composition that is solid at room temperature, the composition including: (A) an organopolysiloxane having a resin structure consisting of specific siloxane units, (B) an organohydrogenpolysiloxane having a resin structure consisting of specific siloxane units, (C) a platinum group metal-based catalyst, (D) either one or both of an opaque pigment and an opaque dye, and (E) a reaction retarder, in which a layer of thickness 100 μm formed from a cured product of the composition exhibits a light transmittance of not more than 5% across the entire visible light range. A cured product obtained by curing the composition can be used to protect a liquid crystal electrode and shield the electrode from light, thereby preventing malfunction of the driver IC, and also exhibits excellent mechanical properties and flexibility, and displays minimal surface tack.
摘要翻译：公开了一种在室温下为固体的可固化有机硅树脂组合物，该组合物包括：（A）具有由特定硅氧烷单元组成的树脂结构的有机聚硅氧烷，（B）具有由特定硅氧烷单元组成的树脂结构的有机氢聚硅氧烷，（C ）铂族金属类催化剂，（D）不透明颜料和不透明染料中的一种或两种，和（E）由组合物的固化产物形成的厚度为100μm的层的反应延迟剂整个可见光范围的透光率不超过5％。通过固化该组合物而得到的固化物可以用于保护液晶电极并遮蔽电极，防止驱动IC的故障，并且还表现出优异的机械性能和柔韧性，并显示出最小的表面粘性。

4. 发明申请

US20110251305A1 EPOXY COMPOSITION FOR ENCAPSULATING AN OPTICAL SEMICONDUCTOR ELEMENT 有权
标题翻译：用于封装光学半导体元件的环氧组合物
公开(公告)号：US20110251305A1
公开(公告)日：2011-10-13
申请号：US13080730
申请日：2011-04-06
申请人： Manabu Ueno , Miyuki Wakao , Tsutomu Kashiwagi
发明人： Manabu Ueno , Miyuki Wakao , Tsutomu Kashiwagi
IPC分类号： C08L63/00 , C08G77/26
CPC分类号： H01L33/56 , C08G59/306 , C08G59/3254 , C08G59/42
摘要： The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.
摘要翻译：本发明的目的是提供一种用于封装光学半导体元件的环氧组合物，该组合物提供具有低透气性的固化产物和薄膜形式的优异的固化性以及良好的透光性和抗裂纹性。本发明提供一种组合物，其包含（A）由式（1）表示的硅氧烷改性的环氧化合物，（B）固化剂和（C）多元醇。本发明还提供一种组合物，其包含通过（A）硅氧烷改性的环氧化合物，（B）固化剂和（C）多元醇和（D）固化催化剂及其固化产物反应制备的组合物。

5. 发明授权

US07737194B2 Silicone lens and silicone resin composition for molding lens 有权
标题翻译：硅胶透镜和用于成型镜片的硅树脂组合物
公开(公告)号：US07737194B2
公开(公告)日：2010-06-15
申请号：US11785791
申请日：2007-04-20
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/56 , C08L83/00
摘要： A colorless transparent silicone lens produced by thermally curing a silicone resin composition comprising (A) an organopolysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3aR4bSiO(4-a-b)/2 unit wherein R1, R2, and R3 are independently methyl group, ethyl group, propyl group, cyclohexyl group, or phenyl group, R4 is vinyl group or allyl group, a is 0, 1, or 2, b is 1 or 2, and a+b is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, (B) an organohydrogen polysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3cHdSiO(4-c-d)/2 unit wherein c is 0, 1, or 2, d is 1 or 2, and c+d is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, the component, and (C) a platinum group catalyst. A silicone lens having excellent flexibility, transparency, and moldability as well as reduced surface tackiness is provided.
摘要翻译：通过热固化硅氧烷树脂组合物制得的无色透明硅氧烷透镜，其包含（A）具有包含R1SiO1.5单元，R22SiO单元和R3aR4bSiO（4-ab）/ 2单元的树脂结构的有机聚硅氧烷，其中R1，R2和R3为乙基，丙基，环己基或苯基，R4为乙烯基或烯丙基，a为0,1或2，b为1或2，a + b为2或3，以及其中R22SiO单元的重复数为5〜300，（B）具有包含R1SiO1.5单元，R22SiO单元和R3cHdSiO（4-cd）/ 2单元的树脂结构的有机氢聚硅氧烷，其中c为0,1或 2，d为1或2，c + d为2或3，R22SiO单元的重复数为5〜300，该成分为（C）铂族催化剂。提供了具有优异的柔性，透明性和成型性以及降低的表面粘性的硅氧烷透镜。

6. 发明申请

US20100065880A1 SILICONE LAMINATED SUBSTRATE, METHOD OF PRODUCING SAME, SILICONE RESIN COMPOSITION FOR PRODUCING SILICONE LAMINATED SUBSTRATE, AND LED DEVICE 有权
标题翻译：硅氧烷层压基板，其制造方法，用于生产硅氧烷层压基板的硅树脂组合物和LED器件
公开(公告)号：US20100065880A1
公开(公告)日：2010-03-18
申请号：US12557209
申请日：2009-09-10
申请人： Tsutomu KASHIWAGI , Toshio SHIOBARA
发明人： Tsutomu KASHIWAGI , Toshio SHIOBARA
IPC分类号： B32B17/10 , B32B5/02 , B29C43/20 , B32B17/02 , C08L83/04 , H01L33/00
CPC分类号： C08K3/22 , B32B17/04 , B32B27/283 , C03C25/1095 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08L83/04 , C08L83/06 , C09D183/04 , H01L24/29 , H01L24/45 , H01L2224/29339 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , Y10T428/249921 , Y10T428/31612 , Y10T428/31663 , C08L83/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A silicone laminated substrate, including a glass cloth, and a cured product of a silicone resin composition with which the glass cloth is filled and a surface of the glass cloth is coated, in which the silicone resin composition includes: (A) an organopolysiloxane having a resin structure consisting of specific siloxane units, (B) an organohydrogenpolysiloxane having a resin structure consisting of specific siloxane units, (C) a platinum group metal-based catalyst, and (D) a filler. The silicone laminated substrate exhibits excellent mechanical properties, flexibility and workability, has minimal surface tack, and is easy to handle. The silicone laminated substrate is produced by impregnating a glass cloth with the silicone resin composition that is dissolved or dispersed in a solvent, subsequently removing the solvent from the glass cloth by evaporation, and subjecting the composition impregnated into the glass cloth to heat curing under compression molding conditions. From the silicone laminated substrate that is used for an LED device, an LED device can be obtained that includes the substrate and an LED chip mounted on top of the substrate.
摘要翻译：包含玻璃布的硅氧烷层压基板和填充有玻璃布的硅树脂组合物和玻璃布的表面的固化物被覆，其中有机硅树脂组合物包括：（A）有机聚硅氧烷，其具有由特定硅氧烷单元组成的树脂结构体，（B）具有由特定硅氧烷单元构成的树脂结构的有机氢聚硅氧烷，（C）铂族金属类催化剂和（D）填料。硅酮层压基材具有优异的机械性能，柔韧性和可加工性，具有最小的表面粘着性，易于处理。硅氧烷层压基板通过将溶解或分散在溶剂中的硅树脂组合物浸渍玻璃布，然后通过蒸发从玻璃布中除去溶剂，并将浸渍在玻璃布中的组合物在压缩下进行加热固化而制造成型条件。从用于LED器件的有机硅层压基板可以获得包括基板和安装在基板顶部上的LED芯片的LED器件。

7. 发明授权

US07588967B2 Curable silicone rubber composition and semiconductor device 有权
标题翻译：可固化硅橡胶组合物和半导体器件
公开(公告)号：US07588967B2
公开(公告)日：2009-09-15
申请号：US11419629
申请日：2006-05-22
申请人： Tsutomu Kashiwagi
发明人： Tsutomu Kashiwagi
IPC分类号： H01L21/56 , C08G77/20 , C08G77/04
CPC分类号： H01L23/293 , C08G77/045 , C08G77/12 , C08G77/14 , C08G77/20 , C08L83/04 , H01L23/24 , H01L23/3135 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , C08L83/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A curable silicone rubber composition comprising (A) a vinyl-containing organopolysiloxane, (B) an organohydrogenpolysiloxane, (C) an aluminum chelate catalyst, (D) a platinum catalyst, and (E) a tackifier establishes a sufficient bond strength to packaging materials including difficult-to-bond thermoplastic resins such as polyphthalamide resins and liquid crystal polymers and to electrodes of metals such as Ag, Au, Ni and Pd, and forms a transparent cured part. A semiconductor device encapsulated with the cured composition is reliable.
摘要翻译：一种可固化的硅橡胶组合物，其包含（A）含乙烯基的有机聚硅氧烷，（B）有机氢聚硅氧烷，（C）铝螯合催化剂，（D）铂催化剂和（E）增粘剂，使包装材料具有足够的粘合强度包括难溶键合热塑性树脂如聚邻苯二甲酰胺树脂和液晶聚合物，以及金属如Ag，Au，Ni和Pd的电极，并形成透明固化部分。用固化的组合物包封的半导体器件是可靠的。

8. 发明申请

US20090203822A1 DIGLYCIDYLISOCYANURYL-MODIFIED ORGANOPOLYSILOXANE AND COMPOSITION CONTAINING THE SAME 有权
标题翻译：二异氰酸酯改性的有机聚硅氧烷及其组合物
公开(公告)号：US20090203822A1
公开(公告)日：2009-08-13
申请号：US12360652
申请日：2009-01-27
申请人： Toshio SHIOBARA , Tsutomu KASHIWAGI , Miyuki WAKAO , Manabu UENO
发明人： Toshio SHIOBARA , Tsutomu KASHIWAGI , Miyuki WAKAO , Manabu UENO
IPC分类号： C08G77/04 , C07F7/18 , C08K5/54 , C08G77/06 , C08L63/00
CPC分类号： C08G77/388 , C08L83/08
摘要： An organopolysiloxane represented by formula (1) shown below and having (3,5-diglycidylisocyanuryl)alkyl groups represented by formula (2) at least at both terminals of the main chain: wherein, each R1 represents, independently, a substituted or unsubstituted monovalent hydrocarbon group of 1 to 20 carbon atoms, R2 is a group represented by formula (2) shown below, X is a group represented by formula (3) shown below, a represents an integer of 0 to 100 and b represents an integer of 0 to 30, provided that 1≦a+b, and c represents an integer of 0 to 10. wherein, R3 represents an alkylene group of 2 to 12 carbon atoms. wherein, R1 and R2 are as defined above, d represents an integer of 0 to 30, and e represents an integer of 0 to 30.
摘要翻译：由式（1）表示的由下述式（1）表示的有机聚硅氧烷和至少在主链的两个末端具有由式（2）表示的（3,5-二缩水甘油基异氰脲基）烷基：其中，每个R 1独立地表示取代或未取代的一价 1〜20个碳原子的烃基，R2为下述式（2）所示的基团，X为下述式（3）表示的基团，a表示0〜100的整数，b表示0以下的整数至30，条件是1 <= a + b，c表示0至10的整数。其中，R 3表示2至12个碳原子的亚烷基。其中，R1和R2如上所定义，d表示0〜30的整数，e表示0〜30的整数。

9. 发明申请

US20080308828A1 Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet 有权
标题翻译：含有荧光体的粘合性硅酮组合物，由该组合物形成的组合物片材，以及使用该片材的发光装置的制造方法
公开(公告)号：US20080308828A1
公开(公告)日：2008-12-18
申请号：US12078909
申请日：2008-04-08
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： H01L33/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , H01L33/56 , Y10T428/31663 , C08L83/00
摘要： An addition curable adhesive silicone composition containing a phosphor dispersed uniformly therein is provided. The dispersive state of the phosphor remains stable over time. The composition, in an uncured state at room temperature, is either a solid or a semisolid, and is therefore easy to handle, and is suited to an adhesive silicone composition sheet which is able to be formed easily on an LED chip using a conventional assembly apparatus.
摘要翻译：提供含有均匀分布的荧光体的可固化粘合性有机硅组合物。荧光体的分散状态随时间保持稳定。在室温未固化状态下的组合物是固体或半固体，因此易于处理，并且适用于能够使用常规组合容易地在LED芯片上形成的粘合性有机硅组合物片材仪器。

10. 发明申请

US20060270808A1 Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device 审中-公开
标题翻译：环氧硅酮类混合树脂组合物，其固化物，发光半导体装置
公开(公告)号：US20060270808A1
公开(公告)日：2006-11-30
申请号：US11438444
申请日：2006-05-23
申请人： Katsuyuki Imazawa , Tsutomu Kashiwagi , Tokue Kojima , Toshio Shiobara
发明人： Katsuyuki Imazawa , Tsutomu Kashiwagi , Tokue Kojima , Toshio Shiobara
IPC分类号： C08L83/05 , C08L63/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08L63/00 , C08L83/00 , C08L2666/14 , C08K5/56 , C08K5/0091
摘要： An epoxy-silicone mixed resin composition comprising (A) an organopolysiloxane having at least one vinyl or allyl group and at least one hydroxyl group, (B) an organic resin having at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, (E) an aluminum compound, and (F) 0.1-15% by weight of an organic mold release agent is molded and cured in a metal mold into a transparent product which can be smoothly removed from the mold. The cured product has a satisfactory bond strength to metal frames and maintains heat resistance. LED devices can be fabricated by continuous mechanical molding.
摘要翻译：一种环氧硅树脂混合树脂组合物，其包含（A）具有至少一个乙烯基或烯丙基和至少一个羟基的有机聚硅氧烷，（B）具有至少一个环氧基的有机树脂，（C）有机氢聚硅氧烷，（D）铂族金属类催化剂（E）铝化合物和（F）0.1-15％重量的有机脱模剂在金属模具中成型并固化成透明产品，其可以从模子。固化产品对金属框架具有令人满意的粘合强度，并保持耐热性。 LED器件可以通过连续机械成型制造。

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