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1. 发明申请

US20130164773A1 DISPOSABLE CARTRIDGE FOR FLUID ANALYSIS 有权
标题翻译：用于流体分析的可拆卸盒
公开(公告)号：US20130164773A1
公开(公告)日：2013-06-27
申请号：US13337889
申请日：2011-12-27
申请人： Ron Bardell , Tzu-Yu Wang , Mark Washa
发明人： Ron Bardell , Tzu-Yu Wang , Mark Washa
IPC分类号： C12Q1/02 , B01L3/00
CPC分类号： B01L3/502738 , B01L3/502723 , B01L3/502776 , B01L2200/0684 , B01L2300/0654 , B01L2300/0816 , B01L2300/0874 , B01L2300/0883 , B01L2300/0887 , B01L2400/0406 , B01L2400/049 , B01L2400/0655 , G01N15/1459 , G01N15/1484 , G01N21/05 , G01N21/532 , G01N2015/1006 , G01N2021/0321 , G01N2021/0346 , G01N2021/058 , G01N2035/00158
摘要： A disposable blood analysis cartridge for analyzing a blood sample including an optical light scattering measurement channel is described. In use, processed sample may be introduced into a sheath fluid channel at an angle, α, of approximately 90 degrees, relative to the direction of flow of the sheath fluid. In addition, delivering the sample from the side into the sheath fluid may facilitate better positioning of the core within the hydrodynamic focusing channel for measurement.
摘要翻译：描述了用于分析包含光学散射测量通道的血液样本的一次性血液分析盒。在使用中，加工样品可以相对于护套流体的流动方向以大约90度的角度α被引入护套流体通道。此外，将样品从侧面输送到护套流体可以有助于将芯更好地定位在用于测量的流体动力学聚焦通道内。

2. 发明申请

US20130092935A1 Probe Pad Design for 3DIC Package Yield Analysis 有权
标题翻译：探针垫设计用于3DIC封装产量分析
公开(公告)号：US20130092935A1
公开(公告)日：2013-04-18
申请号：US13272004
申请日：2011-10-12
申请人： Tzu-Yu Wang , Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Hsien-Pin Hu , Wei-Cheng Wu , Li-Han Hsu , Meng-Han Lee
发明人： Tzu-Yu Wang , Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Hsien-Pin Hu , Wei-Cheng Wu , Li-Han Hsu , Meng-Han Lee
IPC分类号： H01L23/58 , G01R31/26
CPC分类号： H01L22/32 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/5384 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/0655 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： An interposer includes a first surface on a first side of the interposer and a second surface on a second side of the interposer, wherein the first and the second sides are opposite sides. A first probe pad is disposed at the first surface. An electrical connector is disposed at the first surface, wherein the electrical connector is configured to be used for bonding. A through-via is disposed in the interposer. Front-side connections are disposed on the first side of the interposer, wherein the front-side connections electrically couple the through-via to the probe pad.
摘要翻译：插入器包括在插入件的第一侧上的第一表面和在插入件的第二侧上的第二表面，其中第一和第二侧是相对的两侧。第一探针垫设置在第一表面。电连接器设置在第一表面处，其中电连接器被配置为用于接合。通孔设置在插入器中。前侧连接设置在插入件的第一侧上，其中前侧连接将通孔电连接到探针垫。

3. 发明授权

US08294264B2 Radiate under-bump metallization structure for semiconductor devices 有权
标题翻译：用于半导体器件的辐射凸块下金属化结构
公开(公告)号：US08294264B2
公开(公告)日：2012-10-23
申请号：US12750221
申请日：2010-03-30
申请人： Tzu-Yu Wang , Chi-Chun Hsieh , An-Jhih Su , Hsien-Wei Chen , Shin-Puu Jeng , Liwei Lin
发明人： Tzu-Yu Wang , Chi-Chun Hsieh , An-Jhih Su , Hsien-Wei Chen , Shin-Puu Jeng , Liwei Lin
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L24/05 , H01L24/03 , H01L24/04 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/0347 , H01L2224/03828 , H01L2224/0401 , H01L2224/05551 , H01L2224/05552 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/1147 , H01L2224/13007 , H01L2224/13015 , H01L2224/13111 , H01L2224/13116 , H01L2224/16145 , H01L2224/16225 , H01L2224/97 , H01L2225/06513 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2224/81 , H01L2924/00 , H01L2924/00012
摘要： An under-bump metallization (UBM) structure for a semiconductor device is provided. The UBM structure has a center portion and extensions extending out from the center portion. The extensions may have any suitable shape, including a quadrangle, a triangle, a circle, a fan, a fan with extensions, or a modified quadrangle having a curved surface. Adjacent UBM structures may have the respective extensions aligned or rotated relative to each other. Flux may be applied to a portion of the extensions to allow an overlying conductive bump to adhere to a part of the extensions.
摘要翻译：提供了一种用于半导体器件的凸块下金属化（UBM）结构。 UBM结构具有从中心部分延伸出的中心部分和延伸部分。延伸部可以具有任何合适的形状，包括四边形，三角形，圆形，风扇，具有延伸部的风扇或具有弯曲表面的改进的四边形。相邻的UBM结构可以具有相对于彼此对准或旋转的相应延伸部。焊剂可以施加到延伸部分的一部分，以允许覆盖的导电凸块粘附到延伸部分的一部分上。

4. 发明申请

US20110241201A1 Radiate Under-Bump Metallization Structure for Semiconductor Devices 有权
标题翻译：辐射半导体器件的欠冲击金属化结构
公开(公告)号：US20110241201A1
公开(公告)日：2011-10-06
申请号：US12750221
申请日：2010-03-30
申请人： Tzu-Yu Wang , Chi-Chun Hsieh , An-Jhih Su , Hsien-Wei Chen , Shin-Puu Jeng , Liwei Lin
发明人： Tzu-Yu Wang , Chi-Chun Hsieh , An-Jhih Su , Hsien-Wei Chen , Shin-Puu Jeng , Liwei Lin
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L24/05 , H01L24/03 , H01L24/04 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/0347 , H01L2224/03828 , H01L2224/0401 , H01L2224/05551 , H01L2224/05552 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/1147 , H01L2224/13007 , H01L2224/13015 , H01L2224/13111 , H01L2224/13116 , H01L2224/16145 , H01L2224/16225 , H01L2224/97 , H01L2225/06513 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2224/81 , H01L2924/00 , H01L2924/00012
摘要： An under-bump metallization (UBM) structure for a semiconductor device is provided. The UBM structure has a center portion and extensions extending out from the center portion. The extensions may have any suitable shape, including a quadrangle, a triangle, a circle, a fan, a fan with extensions, or a modified quadrangle having a curved surface. Adjacent UBM structures may have the respective extensions aligned or rotated relative to each other. Flux may be applied to a portion of the extensions to allow an overlying conductive bump to adhere to a part of the extensions.
摘要翻译：提供了一种用于半导体器件的凸块下金属化（UBM）结构。 UBM结构具有从中心部分延伸出的中心部分和延伸部分。延伸部可以具有任何合适的形状，包括四边形，三角形，圆形，风扇，具有延伸部的风扇或具有弯曲表面的改进的四边形。相邻的UBM结构可以具有相对于彼此对准或旋转的相应延伸部。焊剂可以施加到延伸部分的一部分，以允许覆盖的导电凸块粘附到延伸部分的一部分上。

5. 发明授权

US08007704B2 Insert molded actuator components 有权
标题翻译：插入模制的执行元件
公开(公告)号：US08007704B2
公开(公告)日：2011-08-30
申请号：US11458718
申请日：2006-07-20
申请人： Timothy J. Smith , Tzu-Yu Wang , Adam Z. Eskridge
发明人： Timothy J. Smith , Tzu-Yu Wang , Adam Z. Eskridge
IPC分类号： B29C45/14
CPC分类号： B29C45/14811 , B29K2705/00 , B29L2031/749 , B29L2031/7506 , F16K31/02
摘要： The present invention relates to electrostatically actuated device components and methods of making the same. In an embodiment, the invention includes a method of making an electrostatically actuated device component including providing a multilayered structure comprising a first layer comprising a first polymer, a second layer comprising a conductive material, the second layer disposed over the first layer, a third layer comprising a dielectric material, the third layer disposed over the second layer, positioning the multilayered structure within an injection mold, and injecting a second polymer into the mold and bonding the first layer to the second polymer to produce an electrostatically actuated device component. In an embodiment, the invention includes a method of injection molding a stator component for an electrostatically actuated valve.
摘要翻译：本发明涉及静电致动装置部件及其制造方法。在一个实施例中，本发明包括一种制造静电致动装置部件的方法，该方法包括提供多层结构，该多层结构包括第一层，该第一层包括第一聚合物，第二层包括导电材料，第二层设置在第一层上，第三层包括介电材料，所述第三层设置在所述第二层之上，将所述多层结构定位在注射模具内，以及将第二聚合物注入到所述模具中并将所述第一层粘合到所述第二聚合物以产生静电致动装置部件。在一个实施例中，本发明包括注射成型用于静电致动阀的定子部件的方法。

6. 发明授权

US07168675B2 Media isolated electrostatically actuated valve 有权
标题翻译：介质隔离静电阀
公开(公告)号：US07168675B2
公开(公告)日：2007-01-30
申请号：US11018799
申请日：2004-12-21
申请人： Eugen I. Cabuz , Cleopatra Cabuz , Tzu-Yu Wang
发明人： Eugen I. Cabuz , Cleopatra Cabuz , Tzu-Yu Wang
IPC分类号： F16K7/04
CPC分类号： F16K31/02
摘要： A valve structure having a top part, a flexible media conveyance, such as a tube, a diaphragm and a bottom part with a support for the tube. The top surface of the diaphragm and the bottom surface of the top part may have electrodes attached. When there is no electric potential applied across the electrodes, the diaphragm may rest on and close the passageway in the flexible tube for effectively preventing a fluid flow. When an electrical potential is applied to the electrodes, the diaphragm may be pulled up off from the tube thereby opening or partially opening the passageway in the tube for a media flow or pressure transfer. Partial opening may be for modulation purposes. There may be a tension mechanism attached to the diaphragm. A controller may apply an electrical potential to the electrodes for at least partially opening or closing the valve.
摘要翻译：具有顶部部分的柔性介质输送器，诸如管子，隔膜和具有用于管的支撑件的底部的阀结构。隔膜的上表面和顶部的底表面可以具有连接的电极。当电极上没有施加电位时，隔膜可以搁置在柔性管中并关闭柔性管中的通道，以有效地防止流体流动。当向电极施加电势时，隔膜可以从管中拉出，从而打开或部分打开管中的通道用于介质流或压力传递。部分打开可以用于调制目的。可能存在连接到隔膜的张力机构。控制器可以向电极施加电势以至少部分地打开或关闭阀。

7. 发明授权

US07100453B2 Modified dual diaphragm pressure sensor 失效
标题翻译：改装双隔膜压力传感器
公开(公告)号：US07100453B2
公开(公告)日：2006-09-05
申请号：US10915870
申请日：2004-08-09
申请人： Tzu-Yu Wang , Eugen I Cabuz
发明人： Tzu-Yu Wang , Eugen I Cabuz
IPC分类号： G01L7/08
CPC分类号： F16K99/0001 , F04B43/025 , F04B43/028 , F04B43/04 , F04B43/043 , F04B45/045 , F04B45/047 , F15C5/00 , F16K31/02 , F16K99/0015 , F16K99/0034 , F16K99/0051 , F16K2099/0094 , G01L9/0072
摘要： A device for sensing pressure using two flexible diaphragms in which an additional element is added to promote rolling contact of the diaphragm. One embodiment aligns the flexible diaphragms in a non-parallel alignment such that deflection of one flexible diaphragm will roll with respect to the other to provide increased linear capacitive response. In another embodiment a non-conductive spacing element is positioned between the diaphragms to permit rolling contact upon displacement of a diaphragms. These devices are capacitive pressure gauges. One additional embodiment includes a cantilever hinge and rigid polymer disc to convert one diaphragm into a linearly deflecting diaphragm.
摘要翻译：使用两个柔性隔膜感测压力的装置，其中添加一个附加元件以促进膜片的滚动接触。一个实施例将柔性隔膜以不平行的对准方式对准，使得一个柔性隔膜的偏转相对于另一个可以滚动以提供增加的线性电容响应。在另一个实施例中，非导电间隔元件位于隔膜之间，以允许隔膜移位时的滚动接触。这些器件是电容式压力计。一个另外的实施例包括悬臂铰链和刚性聚合物盘，以将一个隔膜转换成线性偏转隔膜。

8. 发明申请

US20060137749A1 Electrostatically actuated gas valve 失效
标题翻译：静电致动气阀
公开(公告)号：US20060137749A1
公开(公告)日：2006-06-29
申请号：US11025758
申请日：2004-12-29
申请人： Ulrich Bonne , Cleopatra Cabuz , Eugen Cabuz , Stephen Kemp , John Adams , Tzu-Yu Wang , Sybrandus Munsterhuis , Gerrit Baarda
发明人： Ulrich Bonne , Cleopatra Cabuz , Eugen Cabuz , Stephen Kemp , John Adams , Tzu-Yu Wang , Sybrandus Munsterhuis , Gerrit Baarda
IPC分类号： G05D16/06
CPC分类号： F16K31/402 , F16K31/02 , F16K31/385 , F23N1/005 , F23N2035/18 , F23N2035/20 , F23N2035/24 , Y10T137/7761 , Y10T137/87917
摘要： A gas valve body with a first flow chamber and, a second flow chamber including and a main valve positioned in line and between the first flow chamber and the second flow chamber. The main valve can be opened by creating a pressure differential across the main valve. An electrostatically controlled pilot valve is provided for controlling the pressure differential across the main valve for “on-ff” operation. The electrostatically controlled pilot valve may also be operated to “modulate” the pressure differential across the main valve along a range of pressure differential values.
摘要翻译：一种具有第一流动室的气体阀体，以及包括第一流动室和第二流动室的第二流动室和第二流动室。可以通过在主阀上形成压差来打开主阀。提供静电控制的先导阀，用于控制主阀上的压差用于“on-ff”操作。静电控制先导阀还可以被操作以沿着一定范围的压力差来“调制”主阀上的压力差。

9. 发明申请

US20060131529A1 Media isolated electrostatically actuated valve 有权
标题翻译：介质隔离静电阀
公开(公告)号：US20060131529A1
公开(公告)日：2006-06-22
申请号：US11018799
申请日：2004-12-21
申请人： Eugen Cabuz , Cleopatra Cabuz , Tzu-Yu Wang
发明人： Eugen Cabuz , Cleopatra Cabuz , Tzu-Yu Wang
IPC分类号： F16K31/02
CPC分类号： F16K31/02
摘要： A valve structure having a top part, a flexible media conveyance, such as a tube, a diaphragm and a bottom part with a support for the tube. The top surface of the diaphragm and the bottom surface of the top part may have electrodes attached. When there is no electric potential applied across the electrodes, the diaphragm may rest on and close the passageway in the flexible tube for effectively preventing a fluid flow. When an electrical potential is applied to the electrodes, the diaphragm may be pulled up off from the tube thereby opening or partially opening the passageway in the tube for a media flow or pressure transfer. Partial opening may be for modulation purposes. There may be a tension mechanism attached to the diaphragm. A controller may apply an electrical potential to the electrodes for at least partially opening or closing the valve.
摘要翻译：具有顶部部分的柔性介质输送器，诸如管子，隔膜和具有用于管的支撑件的底部的阀结构。隔膜的上表面和顶部的底表面可以具有连接的电极。当电极上没有施加电位时，隔膜可以搁置在柔性管中并关闭柔性管中的通道，以有效地防止流体流动。当向电极施加电势时，隔膜可以从管中拉出，从而打开或部分打开管中的通道用于介质流或压力传递。部分打开可以用于调制目的。可能存在连接到隔膜的张力机构。控制器可以向电极施加电势以至少部分地打开或关闭阀。

10. 发明申请

US20050092710A1 Long wavelength VCSEL device processing 失效
标题翻译：长波长VCSEL器件处理
公开(公告)号：US20050092710A1
公开(公告)日：2005-05-05
申请号：US10697660
申请日：2003-10-29
申请人： James Biard , Klein Johnson , Ralph Johnson , Gyoungwon Park , Tzu-Yu Wang
发明人： James Biard , Klein Johnson , Ralph Johnson , Gyoungwon Park , Tzu-Yu Wang
IPC分类号： H01S5/042 , H01S5/183 , H01B13/00
CPC分类号： H01S5/18308 , H01S5/0425 , H01S5/18311 , H01S5/18341 , H01S5/18363 , H01S5/18366 , H01S2301/176 , H01S2304/00
摘要： A process for making a laser structure. The process is for the fabrication of a laser device such a vertical cavity surface emitting laser (VCSEL). The structures made involve dielectric and spin-on material planarization over wide and narrow trenches, coplanar contacts, non-coplanar contacts, thick and thin pad dielectric, air bridges and wafer thinning.
摘要翻译：制造激光结构的方法。该方法用于制造诸如垂直腔表面发射激光器（VCSEL）的激光器件。所制造的结构涉及宽和窄沟槽，共面触点，非共面触点，厚和薄的电介质，空气桥和晶片变薄的介电和旋涂材料平面化。

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