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1. 发明授权

US08508509B2 Optical touch display device 失效
标题翻译：光触摸显示设备
公开(公告)号：US08508509B2
公开(公告)日：2013-08-13
申请号：US12916835
申请日：2010-11-01
申请人： Chih-Hung Lu , Wei-Chung Wang , Hui-Hsuan Chen
发明人： Chih-Hung Lu , Wei-Chung Wang , Hui-Hsuan Chen
IPC分类号： G06F3/042
CPC分类号： G06F3/0421
摘要： An optical touch device includes a display panel and at least a light emitting and receiving unit. The display panel includes a transparent substrate having a touch surface and a plurality of side surfaces adjacent to the touch surface. At least one of the side surfaces is a first light incidence surface and at least one of the side surfaces is a first light emitting surface. Each light emitting and receiving unit includes a linear light source and a light sensing component. The linear light source is disposed beside the first light incidence surface and is configured for providing optical signals into the transparent substrate. The light sensing component is disposed beside the first light emitting surface. The light sensing component is configured for receiving the optical signals from the linear light source. The optical touch display device has advantages of low cost.
摘要翻译：光学触摸装置包括显示面板和至少一个发光和接收单元。显示面板包括具有触摸表面和与触摸表面相邻的多个侧表面的透明基板。侧表面中的至少一个是第一光入射表面，并且至少一个侧表面是第一发光表面。每个发光和接收单元包括线性光源和光感测部件。线性光源设置在第一光入射面旁边，并且被配置为将光信号提供到透明基板中。光感测部件设置在第一光发射表面旁边。光感测部件被配置为从线性光源接收光信号。光触摸显示装置具有成本低的优点。

2. 发明申请

US20130044380A1 LENS MODULE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：镜头模块及其制造方法
公开(公告)号：US20130044380A1
公开(公告)日：2013-02-21
申请号：US13314302
申请日：2011-12-08
申请人： Chi-Chih SHEN , Hui-Hsuan CHEN , Wei-Chung WANG
发明人： Chi-Chih SHEN , Hui-Hsuan CHEN , Wei-Chung WANG
IPC分类号： G02B7/02 , B32B37/12 , B32B38/10 , B32B37/14
CPC分类号： H01L27/14618 , G02B3/0006 , G02B7/025 , G02B13/0085 , H01L27/14625 , H01L27/14685 , H01L2924/0002 , Y10T156/1052 , H01L2924/00
摘要： A lens module is suitable for a wafer level process and works in collaboration with an image sensor. The lens module includes a substrate, a lens and a spacer. The lens is disposed on a surface of the substrate for concentrating a light. The spacer is disposed on the substrate and surrounds the lens to block the light from penetrating the substrate through a circumference of the lens. The substrate and the lens are made of a light transmissive material and the spacer is made of an opaque material for shielding a stray light coming from outside, thereby improving a sensing performance of the image sensor.
摘要翻译：透镜模块适用于晶片级处理，并与图像传感器协同工作。透镜模块包括基板，透镜和间隔件。透镜设置在基板的表面上用于聚光。间隔件设置在基板上并且围绕透镜以阻挡光透过透镜的圆周穿透基板。基板和透镜由透光材料制成，并且间隔件由不透明材料制成，用于屏蔽来自外部的杂散光，从而提高图像传感器的感测性能。

3. 发明申请

US20120268375A1 MOUSE WHEEL ASSEMBLY 审中-公开
标题翻译：小鼠轮组件
公开(公告)号：US20120268375A1
公开(公告)日：2012-10-25
申请号：US13544530
申请日：2012-07-09
申请人： Chih Hung LU , Wei Chung WANG
发明人： Chih Hung LU , Wei Chung WANG
IPC分类号： G06F3/033
CPC分类号： G06F3/03543 , G06F3/0317
摘要： A mouse wheel assembly is provided according to the present invention. The mouse wheel assembly includes a member and an optical module. The member has a pattern formed thereon. The optical module is adapted to illuminate the pattern on the member, capture an image of the pattern as a result of the illumination and recognize a feature change of the image of the pattern to obtain the change direction and change speed of the member.
摘要翻译：根据本发明提供了一种鼠标轮组件。鼠标轮组件包括构件和光学模块。构件具有形成在其上的图案。光学模块适于照亮构件上的图案，作为照明的结果捕获图案的图像，并且识别图案的图像的特征变化以获得构件的改变方向和变化速度。

4. 发明申请

US20120168945A1 CHIP PACKAGE STRUCTURE AND CHIP PACKAGING PROCESS 有权
标题翻译：芯片包装结构和芯片包装过程
公开(公告)号：US20120168945A1
公开(公告)日：2012-07-05
申请号：US13210485
申请日：2011-08-16
申请人： Wei-Chung Wang , Sen-Huang Huang
发明人： Wei-Chung Wang , Sen-Huang Huang
IPC分类号： H01L21/78 , H01L23/498
CPC分类号： H01L23/3114 , H01L21/561 , H01L24/19 , H01L24/20 , H01L27/14618 , H01L27/14683 , H01L2224/12105 , H01L2924/14 , H01L2924/00
摘要： A chip package structure includes a silicon substrate, a sensing component, a metal circuit layer, a first insulating layer and a conductive metal layer. The silicon substrate has opposite first and second surfaces. The sensing component is disposed on the first surface. The metal circuit layer is disposed on the first surface and electrically connected to the sensing component. The first insulating layer covers the second surface and has a first through hole to expose a portion of the second surface. The conductive metal layer is disposed on the first insulating layer and includes first leads and a second lead. The first leads are electrically connected to the metal circuit layer. The second lead is filled in the first through hole to electrically connect to the silicon substrate and one of the first leads. A chip packaging process for fabricating the chip package structure is also provided.
摘要翻译：芯片封装结构包括硅衬底，感测部件，金属电路层，第一绝缘层和导电金属层。硅衬底具有相对的第一和第二表面。感测部件设置在第一表面上。金属电路层设置在第一表面上并电连接到感测部件。第一绝缘层覆盖第二表面并且具有第一通孔以暴露第二表面的一部分。导电金属层设置在第一绝缘层上，并且包括第一引线和第二引线。第一引线电连接到金属电路层。第二引线被填充在第一通孔中以电连接到硅衬底和第一引线之一。还提供了用于制造芯片封装结构的芯片封装工艺。

5. 发明授权

US08158888B2 Circuit substrate and method of fabricating the same and chip package structure 有权
标题翻译：电路基板及其制造方法及芯片封装结构
公开(公告)号：US08158888B2
公开(公告)日：2012-04-17
申请号：US12490077
申请日：2009-06-23
申请人： Chi-Chih Shen , Jen-Chuan Chen , Wei-Chung Wang
发明人： Chi-Chih Shen , Jen-Chuan Chen , Wei-Chung Wang
IPC分类号： H05K1/16
CPC分类号： H05K3/3452 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L24/48 , H01L25/105 , H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K3/3436 , H05K2201/0191 , H05K2203/0577 , Y10T29/49117 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A circuit substrate suitable for being connected to at least one solder ball is provided. The circuit substrate includes a substrate, at least one bonding pad, and a solder mask. The substrate has a surface. The bonding pad is disposed on the surface of the substrate for being connected to the solder ball. The solder mask covers the surface of the substrate and has an opening for exposing a portion of the bonding pad. The opening has a first end and a second end. As compared with the second end, the first end is much farther from the bonding pad, and a diameter of the first end is larger than that of the second end.
摘要翻译：提供适于连接至少一个焊球的电路基板。电路基板包括基板，至少一个焊盘和焊接掩模。基板具有表面。接合焊盘设置在衬底的表面上以连接到焊球。焊接掩模覆盖基板的表面，并且具有用于暴露焊接区的一部分的开口。开口具有第一端和第二端。与第二端相比，第一端远离接合焊盘，第一端的直径大于第二端的直径。

6. 发明授权

US08110837B2 Sensing module 有权
标题翻译：感应模块
公开(公告)号：US08110837B2
公开(公告)日：2012-02-07
申请号：US12325005
申请日：2008-11-28
申请人： Hung-Ching Lai , Kuo-Hsiung Li , Hui-Hsuan Chen , Wei-Chung Wang
发明人： Hung-Ching Lai , Kuo-Hsiung Li , Hui-Hsuan Chen , Wei-Chung Wang
IPC分类号： H01L31/12
CPC分类号： H01L27/14618 , H01L2224/48091 , H01L2224/48145 , H01L2224/73265 , H01S5/02248 , H01S5/06825 , H01L2924/00014 , H01L2924/00012
摘要： A sensing module comprises a carrier, a sensor, a substrate, and a plurality of chips. The carrier has a carrying surface and a back surface opposite to the carrying surface. The sensor and the substrate are disposed on the carrying surface and are electrically connected to the carrier respectively. The chips are disposed on the substrate and are electrically connected to the substrate respectively. The production cost of the sensing module is low.
摘要翻译：感测模块包括载体，传感器，基板和多个芯片。载体具有承载表面和与承载表面相对的后表面。传感器和基板分别设置在载体表面上并与载体电连接。芯片设置在基板上，分别与基板电连接。传感模块的生产成本低。

7. 发明申请

US20120019715A1 DISPLAY PANEL AND ASSEMBLING METHOD OF THE SAME 有权
标题翻译：显示面板及其组装方法
公开(公告)号：US20120019715A1
公开(公告)日：2012-01-26
申请号：US12892717
申请日：2010-09-28
申请人： Chi Chih Shen , Hui Hsuan Chen , Wei Chung Wang
发明人： Chi Chih Shen , Hui Hsuan Chen , Wei Chung Wang
IPC分类号： H04N5/225 , H05K13/00
CPC分类号： G06F1/1637 , G06F1/1626 , H04M1/0264 , H04M1/0266 , H04N1/00307 , Y10T29/49002
摘要： A display panel and an assembling method of the same are described. An image capture module is electrically disposed on a substrate of a display module, such that the image capture module and the display module are combined into an integrated structure, so as to reduce the overall size of a display assembled by using the display panel.
摘要翻译：对显示面板及其组装方法进行说明。图像捕获模块电气地布置在显示模块的基板上，使得图像捕获模块和显示模块组合成一体结构，以便减少通过使用显示面板组装的显示器的总体尺寸。

8. 发明申请

US20110285643A1 OPTICAL TOUCH DISPLAY DEVICE 审中-公开
标题翻译：光触摸显示设备
公开(公告)号：US20110285643A1
公开(公告)日：2011-11-24
申请号：US12940590
申请日：2010-11-05
申请人： Chih-Hung Lu , Hui-Hsuan Chen , Wei-Chung Wang
发明人： Chih-Hung Lu , Hui-Hsuan Chen , Wei-Chung Wang
IPC分类号： G06F3/041
CPC分类号： G06F3/0428
摘要： An optical touch display device includes a display unit and at least one light sensing module. The display unit includes a first substrate and a display layer. The first substrate has a display area and a non-display area surrounding the display area. The display layer is disposed on the display area of the first substrate. The light sensing module is disposed on an upper surface of the non-display area of the first substrate. A side surface of the light sensing module has a light sensing window, and at least a portion of the light sensing window is adapted to receive light above the display unit. The optical touch display device has a thin thickness.
摘要翻译：光学触摸显示装置包括显示单元和至少一个光感测模块。显示单元包括第一基板和显示层。第一基板具有显示区域和围绕显示区域的非显示区域。显示层设置在第一基板的显示区域上。光感测模块设置在第一基板的非显示区域的上表面上。光感测模块的侧表面具有感光窗口，并且光感测窗口的至少一部分适于接收显示单元上方的光。光学触摸显示装置具有薄的厚度。

9. 发明申请

US20100267285A1 Circuit interface device 有权
标题翻译：电路接口设备
公开(公告)号：US20100267285A1
公开(公告)日：2010-10-21
申请号：US12585720
申请日：2009-09-23
申请人： Wei-Chung Wang
发明人： Wei-Chung Wang
IPC分类号： H01R24/00
CPC分类号： H01R13/506 , H01R13/6582 , H01R13/6658
摘要： A circuit interface device is presented. A circuit board is secured by a circuit board cover, a plurality of electrical contacts is disposed on the circuit board, and a connector cover is coupled to a front end of the circuit board, such that a socket disposed at one end of the connector cover is corresponding to an upper side of the electrical contacts of the circuit board, thereby forming a connector of the circuit interface device. As such, through a structural design of buckling the connector cover on the circuit board without completely covering the connector cover on outer edge of the circuit board, a thickness of the connector cover covering the circuit board cover is reduced.
摘要翻译：提出一种电路接口装置。电路板由电路板盖固定，多个电触头设置在电路板上，连接器盖与电路板的前端连接，使得插座设置在连接器盖的一端对应于电路板的电触点的上侧，从而形成电路接口装置的连接器。因此，通过将电路板上的连接器盖弯曲而不完全覆盖电路板外缘上的连接器盖的结构设计，覆盖电路板盖的连接器盖的厚度减小。

10. 发明授权

US07811858B2 Package and the method for making the same, and a stacked package 有权
标题翻译：包装和制作方法，以及堆叠包装
公开(公告)号：US07811858B2
公开(公告)日：2010-10-12
申请号：US12185879
申请日：2008-08-05
申请人： Meng-Jen Wang , Wei-Chung Wang
发明人： Meng-Jen Wang , Wei-Chung Wang
IPC分类号： H01L21/48 , H01L21/50
CPC分类号： H01L23/5389 , H01L21/481 , H01L21/568 , H01L23/3128 , H01L24/19 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/15311 , H01L2924/181 , H01L2924/18301 , H01L2224/82 , H01L2924/00
摘要： A package and the method for making the same, and a stacked package, the method for making the package includes the following steps: (a) providing a carrier having a plurality of platforms; (b) providing a plurality of dice, and disposing the dice on the platforms; (c) performing a reflow process so that the dice are self-aligned on the platforms; (d) forming a molding compound in the gaps between the dice, and (e) performing a cutting process so as to form a plurality of packages. Since the dice are self-aligned on the platforms during the reflow process, a die attach machine with low accuracy can achieve highly accurate placement.
摘要翻译：一种包装及其制造方法以及堆叠包装，制造包装的方法包括以下步骤：（a）提供具有多个平台的载体; （b）提供多个骰子，并将骰子放置在平台上; （c）进行回流处理，使得骰子在平台上自对准; （d）在骰子之间的间隙中形成模塑料，和（e）进行切割处理以便形成多个包装。由于在回流过程中骰子在平台上自对准，所以精度低的贴片机可以实现高精度的放置。

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