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1. 发明授权

US10700788B2 Method and apparatus for compensating for wavelength drift 有权
公开(公告)号：US10700788B2
公开(公告)日：2020-06-30
申请号：US16283903
申请日：2019-02-25
申请人： WUHAN TELECOMMUNICATION DEVICES CO., LTD.
发明人： Zhenfeng Xue , Yongan Fu , Liping Sun , Jun Zhang , Yaping Lv , Ting Gao , Chao Luo , Chaoqun Wu
IPC分类号： H04B10/572 , H01S5/0683 , H04B10/272 , H01S3/067 , H04J14/02 , H01S5/024 , H01S5/06
摘要： A method and an apparatus for compensating for wavelength drift are disclosed. The method includes: generating, by a burst control circuit, a burst bias current; sending, by the burst control circuit, the burst bias current to a light emitting part and a trigger; converting, by the trigger, the received burst bias current into burst DA data; sending, by the trigger, the burst DA data to a synthesizer circuit; receiving, by the synthesizer circuit, the burst DA data sent by the trigger and the calibrated DA data sent by the MCU respectively; synthesizing, by the synthesizer circuit, the burst DA data and the calibrated DA data to obtain a synthesized signal; and sending, by the synthesizer circuit, the synthesized signal to a temperature control part.

2. 发明授权

US10531585B2 Mechanism for locking and unlocking photoelectric module 有权
公开(公告)号：US10531585B2
公开(公告)日：2020-01-07
申请号：US15533044
申请日：2014-12-18
申请人： WUHAN TELECOMMUNICATION DEVICES CO., LTD.
发明人： Yaoxin Luo , Benqing Quan , Beili Song , Yi Jiang
IPC分类号： H05K5/02 , G02B6/42 , H04B10/00 , H05K5/03 , H05K7/14 , H05K9/00 , H01R13/627
摘要： A mechanism for locking and unlocking a photoelectric module, comprising: a base, and a handle, a clipping cover (3), a lock latch (4) and a hood placed above the base—the base is provided with a cuboid-shaped lock latch limiting slot and two sides of the lock latch limiting slot latch turning slots (1-3); an upper end on a left side face of the base (1) is provided with a handle turning slot a left end of the lock latch is a handle fitting position (4-1), an upper bottom face of a right end of the lock latch is provided with a tab (4-3), and lock latch rotation shafts (4-2)are provided between the handle fitting position and the tab solves the problems of restricted internal room of the tube shell and complicated tube shell installation procedure.

3. 发明授权

US10451805B2 Wavelength division multiplexing/demultiplexing optical transceiving assembly based on diffraction grating 有权
$Wavelength division multiplexing/demultiplexing optical transceiving assembly based on diffraction grating$
公开(公告)号：US10451805B2
公开(公告)日：2019-10-22
申请号：US15770371
申请日：2015-12-28
申请人： WUHAN TELECOMMUNICATION DEVICES CO.,LTD.
发明人： Xuesheng Tang , Di Zhang , Shenglei Hu , Yongan Fu , Yanfeng Fu , Chenggang Liu , Shiyu Li , Liping Sun , Weidong Ma
IPC分类号： G02B6/293 , H04J14/02 , H04B10/40 , G02B6/42
摘要： The present invention provides a wavelength division multiplexing/demultiplexing optical transceiving assembly based on a diffraction grating, which is an uplink optical emitting unit and a downlink optical receiving unit that comprise a laser chip array, a light receiving detector array, a first fast axis collimating lens, a second fast axis collimating lens, a first slow axis collimating lens, a diffraction grating, a slow axis focusing lens, a second slow axis collimating lens, an optical isolator, a coupling output lens, a coupling input lens, a coupling outputting optical fiber and a coupling inputting optical fiber. The wavelength division multiplexing/demultiplexing optical transceiving assembly solves the technical problem of sharing a diffraction grating to realize a wavelength division multiplexing/demultiplexing function, achieves the beneficial effects of better diffraction grating filtering property, smaller light path coupling loss and insertion loss correlative with wavelength, larger independent optical element sizes, and simpler assembly process, and is more suitable for manufacturing a multi-channel wavelength division multiplexing/demultiplexing optical transceiving assembly.

4. 发明申请

US20190131764A1 COB BONDING LASER DIODE INTERFACE MATING DEVICE 审中-公开
公开(公告)号：US20190131764A1
公开(公告)日：2019-05-02
申请号：US16094462
申请日：2016-12-16
申请人： Wuhan Telecommunication Devices Co., Ltd.
发明人： Yan Qin , Fanrong Gao
IPC分类号： H01S5/022 , H01S5/042 , H01S5/0683
摘要： A COB bonding laser diode interface mating device comprises a laser diode and a driver integrated circuit (2). The laser diode includes a light-emitting chip (11). The light-emitting chip (11) is a bare die directly bonded to a circuit board. The driver integrated circuit (2) is a driver chip that is a packaged chip. The light-emitting chip (11) and the driver chip are connected through a capacitor-resistor network (3). The capacitor-resistor network (3) allows the driver integrated circuit (2) to provide a bias current and a modulation current to the laser diode such that the laser diode is in an activated state. The capacitor-resistor network (3) realizes interface mating between the COB bonding laser diode and the driver integrated circuit (2), thereby solving a problem that the interface mating cannot be easily achieved, reducing costs, and improving production efficiency.

5. 发明授权

US09482831B2 Silica-on-silicon-based hybrid integrated optoelectronic chip and manufacturing method therefor 有权
标题翻译：硅基硅基混合集成光电芯片及其制造方法
公开(公告)号：US09482831B2
公开(公告)日：2016-11-01
申请号：US14758416
申请日：2013-12-26
申请人： Wuhan Telecommunication Devices Co., Ltd.
发明人： Liang Zhou , Xiaoge Cao , Xianghong Yu
IPC分类号： G02B6/12 , G02B6/42 , G02B6/30 , G02B6/122 , H01L31/12 , H01L31/18
CPC分类号： G02B6/4257 , G02B6/122 , G02B6/305 , G02B6/42 , G02B6/4224 , G02B6/4232 , H01L31/02327 , H01L31/12 , H01L31/18
摘要： Provided are a silica-on-silicon-based hybrid integrated optoelectronic chip and a manufacturing method therefor. The hybrid integrated optoelectronic chip comprises a silicon substrate (1), wherein the surface of the silicon substrate (1) is provided with a platform (8), lug bosses (6,7) and a groove (10); a silica waveguide element (2) is arranged in the groove (10), the lug bosses (6,7) are protruded from the surface of the platform (8), and the surface of the platform (8) is provided with a discontinuous metal electrode layer (3); and the surface of the metal electrode layer (3) is provided with solder bumps (4), and an active optoelectronic chip (5) is arranged above the solder bumps (4) and the lug bosses (6, 7). In the manufacturing method, multi-step processes including material growth, hot oxygen bonding, flip-chip bonding, lithography alignment and the like are adopted, thereby guaranteeing the high-efficiency light coupling among waveguide devices of different materials, and reducing the light reflection between waveguide end faces. A high-frequency electrode composed of alternating current electrode areas (26) is manufactured between the alignment lug bosses (6, 7). Due to the fact that flip-chip bonding technology is beneficial to the transmission of high-frequency signals, integration level between devices is improved. Meanwhile, the process design not only can achieve the chip-level probe test, but also can be used for the subsequent gold ball bonding or wedge bonding process, thereby facilitating the achievement of encapsulation and mass production of hybrid integrated chips.
摘要翻译：提供了一种基于硅的硅基混合集成光电芯片及其制造方法。所述混合集成光电芯片包括硅衬底（1），其中所述硅衬底（1）的表面设置有平台（8），凸耳凸起（6,7）和凹槽（10）; 在所述凹槽（10）中布置有二氧化硅波导元件（2），所述凸耳凸起（6,7）从所述平台（8）的表面突出，并且所述平台（8）的表面设置有不连续金属电极层（3）; 并且金属电极层（3）的表面设置有焊锡凸块（4），并且在焊料凸块（4）和凸耳凸起（6,7）上方布置有源光电芯片（5）。在制造方法中，采用包括材料生长，热氧键合，倒装芯片接合，光刻对准等多步法，从而保证不同材料的波导器件之间的高效率的光耦合，并减少光反射在波导端面之间。在对准凸耳凸起（6,7）之间制造由交流电极区域（26）构成的高频电极。由于倒装芯片接合技术有利于高频信号的传输，提高了器件之间的集成度。同时，该工艺设计不仅可以实现芯片级探头测试，而且可以用于随后的金球接合或楔形粘合工艺，从而有助于实现混合集成芯片的封装和批量生产。

6. 发明申请

US20150355424A1 SILICA-ON-SILICON-BASED HYBRID INTEGRATED OPTOELECTRONIC CHIP AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：二氧化硅 - 基于硅的混合光电芯片及其制造方法
公开(公告)号：US20150355424A1
公开(公告)日：2015-12-10
申请号：US14758416
申请日：2013-12-26
申请人： WUHAN TELECOMMUNICATION DEVICES CO., LTD.
发明人： Liang ZHOU , Xiaoge CAO , Xianghong YU
IPC分类号： G02B6/42 , G02B6/122 , G02B6/30
CPC分类号： G02B6/4257 , G02B6/122 , G02B6/305 , G02B6/42 , G02B6/4224 , G02B6/4232 , H01L31/02327 , H01L31/12 , H01L31/18
摘要： Provided are a silica-on-silicon-based hybrid integrated optoelectronic chip and a manufacturing method therefor. The hybrid integrated optoelectronic chip comprises a silicon substrate (1), wherein the surface of the silicon substrate (1) is provided with a platform (8), lug bosses (6,7) and a groove (10); a silica waveguide element (2) is arranged in the groove (10), the lug bosses (6,7) are protruded from the surface of the platform (8), and the surface of the platform (8) is provided with a discontinuous metal electrode layer (3); and the surface of the metal electrode layer (3) is provided with solder bumps (4), and an active optoelectronic chip (5) is arranged above the solder bumps (4) and the lug bosses (6, 7). In the manufacturing method, multi-step processes including material growth, hot oxygen bonding, flip-chip bonding, lithography alignment and the like are adopted, thereby guaranteeing the high-efficiency light coupling among waveguide devices of different materials, and reducing the light reflection between waveguide end faces. A high-frequency electrode composed of alternating current electrode areas (26) is manufactured between the alignment lug bosses (6, 7). Due to the fact that flip-chip bonding technology is beneficial to the transmission of high-frequency signals, integration level between devices is improved. Meanwhile, the process design not only can achieve the chip-level probe test, but also can be used for the subsequent gold ball bonding or wedge bonding process, thereby facilitating the achievement of encapsulation and mass production of hybrid integrated chips.
摘要翻译：提供了一种基于硅的硅基混合集成光电芯片及其制造方法。所述混合集成光电芯片包括硅衬底（1），其中所述硅衬底（1）的表面设置有平台（8），凸耳凸起（6,7）和凹槽（10）; 在所述凹槽（10）中布置有二氧化硅波导元件（2），所述凸耳凸起（6,7）从所述平台（8）的表面突出，并且所述平台（8）的表面设置有不连续金属电极层（3）; 并且金属电极层（3）的表面设置有焊锡凸块（4），并且在焊料凸块（4）和凸耳凸起（6,7）上方布置有源光电芯片（5）。在制造方法中，采用包括材料生长，热氧键合，倒装芯片接合，光刻对准等多步法，从而保证不同材料的波导器件之间的高效率的光耦合，并减少光反射在波导端面之间。在对准凸耳凸起（6,7）之间制造由交流电极区域（26）构成的高频电极。由于倒装芯片接合技术有利于高频信号的传输，提高了器件之间的集成度。同时，该工艺设计不仅可以实现芯片级探头测试，而且可以用于随后的金球接合或楔形粘合工艺，从而有助于实现混合集成芯片的封装和批量生产。

7. 发明申请

US20210373263A1 Optical Assembly And Manufacturing Method Thereof 有权
公开(公告)号：US20210373263A1
公开(公告)日：2021-12-02
申请号：US17263059
申请日：2018-12-25
申请人： Wuhan Telecommunication Devices Co., Ltd
发明人： Fen Xiong , Tingyu Li , Rikai Zhou , Yongan Fu , Liping Sun
IPC分类号： G02B6/42
摘要： Disclosed are an optical assembly and a manufacturing method therefor. The optical assembly comprises a laser component (2) and a crystal (1). The crystal (1) is disposed on the laser component (2). The laser component (2) is used to produce a laser beam. The crystal (1) is used to split the laser beam incident onto the crystal (1) so as to generate a first beam (15) and a second beam (16). The first beam (15) is used for front light emission and the second beam (16) is used for backlight monitoring. The optical assembly can split a laser beam to achieve the backlight monitoring function without adding a splitter film. It has good stability in light splitting and reduces the risk of failure in an optical device.

8. 发明授权

US11181702B2 Planar optical waveguide structure, and coupling structure thereof and coupling method thereof 有权
公开(公告)号：US11181702B2
公开(公告)日：2021-11-23
申请号：US16843882
申请日：2020-04-09
申请人： Wuhan Telecommunication Devices Co., Ltd.
发明人： Ben Chen , Xuerui Liang , Baiquan Hu , Chenggang Liu , Di Zhang , Yongan Fu , Liping Sun , Weidong Ma , Xianghong Yu
IPC分类号： G02B6/42 , G02B6/122
摘要： A coupling structure includes a single mode active device and a planar optical waveguide. Specifically, the planar optical waveguide includes a silica waveguide for transmitting an optical signal, where the silica waveguide includes a coupling section and a conduction section; the coupling section is of a regular trapezoidal structure or an inverted trapezoidal structure, where a surface of the coupling section coupled to the single mode active device is a trapezoid top, and a surface of the coupling section connected with the conduction section is a trapezoid bottom; and a coupling gap is preset between the single mode active device and the planar optical waveguide.

9. 发明申请

US20210263246A1 Dual-Carrier Integrated Optical Device And Photoelectric Module 有权
公开(公告)号：US20210263246A1
公开(公告)日：2021-08-26
申请号：US17254074
申请日：2018-12-25
申请人： Wuhan Telecommunication Devices Co., Ltd
发明人： Yangyang Yue , Xiaoping Song , Chengpeng Fu , Jian Li , Qinlian Bu , Hongchun Xu , Wuping Zhang , Chenggang Liu
IPC分类号： G02B6/42
摘要： Disclosed are a dual-carrier integrated optical device and a photoelectric module. The optical device comprises: an encapsulation unit, and a ceramic substrate and two independent carrier assemblies arranged in the encapsulation unit. Every carrier assembly comprises a DWDM active chip arranged on the first heat sink, a first heat sink arranged on the independent control element, and an independent control element for adjusting the temperature of the DWDM active chip to adjust an output wavelength of the DWDM active chip. The DWDM active chip and the independent control element are respectively connected to the ceramic substrate. According to the characteristic that the wavelength of the active chip will shift with the temperature, an output laser wavelength of each active chip is independently controlled by means of the independent control element, which achieves higher wavelength stability and can realize optical signal transmission at different rates.

10. 发明申请

US20210116647A1 Optical Fiber Adapter Structure 有权
公开(公告)号：US20210116647A1
公开(公告)日：2021-04-22
申请号：US16767927
申请日：2017-12-26
申请人： Wuhan Telecommunication Devices Co., Ltd , Accelink Technologies Co., Ltd.
发明人： Xuguang Chen , Qiangpeng Hu , Jun Zhang , Zhiqiang Chen , Hong Zhu , Po Liang
IPC分类号： G02B6/38
摘要： An optical fiber adapter structure, comprises a metal flange, a tubular housing, an insulating ring, an optical fiber stub, and a shielding annulus. The optical fiber stub is embedded into the metal flange; the shielding annulus is fixed at a bottom of the metal flange by means of a conductive adhesive; the shielding annulus covers an end of the optical fiber stub and is provided with a reserved hole only for laser signals to pass through; the tubular housing is sleeved to the bottom of the metal flange; and the tubular housing is insulated from the metal flange by means of the insulating ring. The conductive adhesive adheres the shielding annulus made of conductive material to a tail end of the metal flange and maintains complete electrical contact therebetween, such that the electromagnetic wave radiation between the interior of optical device and the exterior of metal flange is reduced.

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