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    • 3. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07531891B2
    • 2009-05-12
    • US11006529
    • 2004-12-08
    • Koichi OhtoTatsuya UsamiYoichi Sasaki
    • Koichi OhtoTatsuya UsamiYoichi Sasaki
    • H01L23/58H01L29/00H01L21/31
    • H01L21/76801H01L23/53233H01L23/53238H01L23/53295H01L2924/0002Y10S438/931H01L2924/00
    • A semiconductor device having improved adhesiveness between films composing an interlayer insulating film is presented by providing multilayered films in the interlayer insulating films having film density distribution, in which the film density is gradually changes. A SiOC film is deposited to a thickness of 300 nm via a plasma CVD process, in which a flow rate of trimethylsilane gas is stepwise increased. In this case, the film density of the deposited SiOC film is gradually decreased by stepwise increasing the flow rate of trimethylsilane gas. Since trimethylsilane contains methyl group, trimethylsilane has more bulky molecular structure in comparison with monosilane or the like. Thus, the film density is decreased by increasing the amount of trimethylsilane in the reactant gas.
    • 通过在具有膜密度分布的层间绝缘膜中提供多层膜,其中膜密度逐渐变化,提供了具有改善的构成层间绝缘膜的膜之间粘附性的半导体器件。 通过等离子体CVD工艺沉积厚度为300nm的SiOC膜,其中三甲基硅烷气体的流量逐步增加。 在这种情况下,通过逐步增加三甲基硅烷气体的流量,沉积的SiOC膜的膜密度逐渐降低。 由于三甲基硅烷含有甲基,因此与甲硅烷等相比,三甲基硅烷具有更大的分子结构。 因此,通过增加反应气体中的三甲基硅烷的量来降低膜密度。