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1. 发明授权

US09171768B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US09171768B2
公开(公告)日：2015-10-27
申请号：US14239042
申请日：2012-09-03
申请人： Yoshikazu Takamiya , Yoshihiro Kodaira , Kazunaga Onishi
发明人： Yoshikazu Takamiya , Yoshihiro Kodaira , Kazunaga Onishi
IPC分类号： H01L23/04 , H01L23/055 , H01L23/498 , H01L23/049 , H01L21/52 , H01L23/00 , H01L23/373 , H01L25/07
CPC分类号： H01L23/055 , H01L21/52 , H01L23/049 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/29101 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/4911 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： A semiconductor device includes an insulating substrate joined with a semiconductor chip, a case covering a surface of the insulating substrate where the semiconductor chip is joined, and a control terminal in which one end portion is electrically connected to the semiconductor chip, and another end portion passes through the case and is exposed to outside of the case. A portion of the control terminal exposed to the outside of the case includes a cut-out section where a part of the exposed portion is cut out, and a blocking section formed by bending a portion surrounded by the cut-out section and remaining on the control terminal. The blocking section contacts the case from the outside of the case and blocks a movement of the control terminal.
摘要翻译：半导体器件包括与半导体芯片接合的绝缘基板，覆盖半导体芯片接合的绝缘基板的表面的壳体和其中一个端部电连接到半导体芯片的控制端子，以及另一个端部穿过外壳并暴露在外壳外面。暴露于壳体外部的控制端子的一部分包括：切除部分，其中暴露部分的一部分被切除;以及阻挡部分，其通过弯曲被切出部分包围的部分并保留在控制终端。阻挡部分从壳体的外部接触壳体并阻止控制端子的移动。

2. 发明申请

US20140210067A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件及制造半导体器件的方法
公开(公告)号：US20140210067A1
公开(公告)日：2014-07-31
申请号：US14239042
申请日：2012-09-03
申请人： Yoshikazu Takamiya , Yoshihiro Kodaira , Kazunaga Onishi
发明人： Yoshikazu Takamiya , Yoshihiro Kodaira , Kazunaga Onishi
IPC分类号： H01L23/055 , H01L21/52
CPC分类号： H01L23/055 , H01L21/52 , H01L23/049 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/29101 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/4911 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： A semiconductor device includes an insulating substrate joined with a semiconductor chip, a case covering a surface of the insulating substrate where the semiconductor chip is joined, and a control terminal in which one end portion is electrically connected to the semiconductor chip, and another end portion passes through the case and is exposed to outside of the case. A portion of the control terminal exposed to the outside of the case includes a cut-out section where a part of the exposed portion is cut out, and a blocking section formed by bending a portion surrounded by the cut-out section and remaining on the control terminal. The blocking section contacts the case from the outside of the case and blocks a movement of the control terminal.
摘要翻译：半导体器件包括与半导体芯片接合的绝缘基板，覆盖半导体芯片接合的绝缘基板的表面的壳体和其中一个端部电连接到半导体芯片的控制端子，以及另一个端部穿过外壳并暴露在外壳外面。暴露于壳体外部的控制端子的一部分包括：切除部分，其中暴露部分的一部分被切除;以及阻挡部分，其通过弯曲被切出部分包围的部分并保留在控制终端。阻挡部分从壳体的外部接触壳体并阻止控制端子的移动。

3. 发明授权

US08664765B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08664765B2
公开(公告)日：2014-03-04
申请号：US13638955
申请日：2011-09-08
申请人： Kazunaga Onishi , Yoshikazu Takamiya , Takaaki Funakoshi , Yoshihiro Kodaira
发明人： Kazunaga Onishi , Yoshikazu Takamiya , Takaaki Funakoshi , Yoshihiro Kodaira
IPC分类号： H01L23/48
CPC分类号： H01L24/32 , H01L23/3735 , H01L23/49811 , H01L23/49838 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L25/072 , H01L2224/26175 , H01L2224/291 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/49111 , H01L2224/49113 , H01L2224/49175 , H01L2224/73265 , H01L2224/83051 , H01L2224/83447 , H01L2224/85447 , H01L2224/92247 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/19107 , H01L2924/30107 , H01L2924/3512 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes a substrate, an insulating substrate mounted on the substrate, a metal pattern formed on the insulating substrate, an electronic part mounted on the metal pattern across a bond, and a wire member, separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal pattern and around the electronic part.
摘要翻译：一种半导体器件，包括基板，安装在基板上的绝缘基板，形成在绝缘基板上的金属图案，安装在金属图案上的电子部件，以及与布线分离的线材，并且形成在金属图案上以及电子部件周围。

4. 发明申请

US20130285231A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件及制造半导体器件的方法
公开(公告)号：US20130285231A1
公开(公告)日：2013-10-31
申请号：US13978323
申请日：2012-06-11
申请人： Yoshihiro Kodaira
发明人： Yoshihiro Kodaira
IPC分类号： H01L23/10
CPC分类号： H01L23/10 , H01L23/053 , H01L23/34 , H01L23/36 , H01L23/49811 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device has an insulation substrate formed with a conductive pattern; an independent terminal, which is an externally leading terminal, soldered to the conductive pattern of the insulation substrate; a case disposed over the insulation substrate such that a top surface of the independent terminal is exposed; an opening provided on a side surface of the case; a nut glove inserted from the opening so as to be below the independent terminal, and fix the independent terminal; and a first projection part formed on a side surface of the nut glove, and having tapers in a frontward direction and a rearward direction of insertion of the nut glove, respectively. The rearward taper of the first projection part is pressure contacting with a sidewall surface of the opening.
摘要翻译：半导体器件具有形成有导电图案的绝缘基板; 作为外部引线端子的独立端子焊接到绝缘基板的导电图案上; 设置在所述绝缘基板上以使得所述独立端子的顶表面露出的壳体; 设置在所述壳体的侧面上的开口部; 一个从开口插入以便在独立端子下方的螺母手套，固定独立端子; 以及形成在所述螺母手套的侧面上并分别在所述螺母手套的插入方向的前后方向上具有锥形的第一突出部。第一突出部分的向后锥形与开口的侧壁表面压力接触。

5. 发明申请

US20130020725A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件及制造半导体器件的方法
公开(公告)号：US20130020725A1
公开(公告)日：2013-01-24
申请号：US13638955
申请日：2011-09-08
申请人： Kazunaga Onishi , Yoshikazu Takamiya , Takaaki Funakoshi , Yoshihiro Kodaira
发明人： Kazunaga Onishi , Yoshikazu Takamiya , Takaaki Funakoshi , Yoshihiro Kodaira
IPC分类号： H01L23/49 , H01L21/60
CPC分类号： H01L24/32 , H01L23/3735 , H01L23/49811 , H01L23/49838 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L25/072 , H01L2224/26175 , H01L2224/291 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/49111 , H01L2224/49113 , H01L2224/49175 , H01L2224/73265 , H01L2224/83051 , H01L2224/83447 , H01L2224/85447 , H01L2224/92247 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/19107 , H01L2924/30107 , H01L2924/3512 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes a substrate, an insulating substrate mounted on the substrate, a metal pattern formed on the insulating substrate, an electronic part mounted on the metal pattern across a bond, and a wire member, separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal pattern and around the electronic part.
摘要翻译：一种半导体器件，包括基板，安装在基板上的绝缘基板，形成在绝缘基板上的金属图案，安装在金属图案上的电子部件，以及与布线分开的线构件，并且形成在金属图案上以及电子部件周围。

6. 发明授权

US09078355B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US09078355B2
公开(公告)日：2015-07-07
申请号：US14232780
申请日：2012-08-24
申请人： Yoshihiro Kodaira
发明人： Yoshihiro Kodaira
IPC分类号： H05K5/02 , H01L25/07 , H01L23/049 , H01L23/498 , H01L23/373
CPC分类号： H01L23/544 , H01L21/56 , H01L23/049 , H01L23/053 , H01L23/10 , H01L23/147 , H01L23/29 , H01L23/3121 , H01L23/3142 , H01L23/315 , H01L23/34 , H01L23/36 , H01L23/3735 , H01L23/49811 , H01L25/072 , H01L29/66325 , H01L2224/291 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H05K5/0247 , H01L2924/014 , H01L2924/00
摘要： A semiconductor device has a control terminal attached to a patterned insulating substrate; a first projection formed on the control terminal; a second projection formed on the control terminal; a concave formed between the first projection and the second projection; a resin case disposed to cover the patterned insulating substrate, and having an opening for passing the control terminal therethrough; a first concave portion; a beam portion disposed at the opening of the resin case; a second concave portion formed in the beam portion; a resin block inserted into the opening of the resin case and sandwiching the control terminal together with the sidewall of the opening of the resin case to fix the control terminal to the resin case; a convex step portion; a third projection formed on a side surface of the resin block; and a fourth projection thinned on a bottom surface of the resin block.
摘要翻译：半导体器件具有附接到图案化绝缘基板的控制端子; 形成在控制终端上的第一突起; 形成在控制终端上的第二突起; 形成在所述第一突起和所述第二突起之间的凹部; 设置成覆盖图案化的绝缘基板的树脂壳体，并且具有用于使控制端子通过的开口; 第一凹部; 设置在树脂壳体的开口处的梁部; 形成在所述梁部中的第二凹部; 将树脂块插入到树脂壳体的开口中并将控制端子与树脂壳体的开口的侧壁一起夹持以将控制端子固定到树脂壳体; 凸台阶部; 形成在树脂块的侧表面上的第三突起; 以及在树脂块的底面上变薄的第四突起。

7. 发明授权

US08933554B2 Semiconductor device and method for manufacturing semiconductor device 有权
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US08933554B2
公开(公告)日：2015-01-13
申请号：US13978323
申请日：2012-06-11
申请人： Yoshihiro Kodaira
发明人： Yoshihiro Kodaira
IPC分类号： H01L23/10 , H01L23/34 , H01L25/07 , H01L25/18 , H01L23/36 , H01L23/498 , H01L23/053
CPC分类号： H01L23/10 , H01L23/053 , H01L23/34 , H01L23/36 , H01L23/49811 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device has an insulation substrate formed with a conductive pattern; an independent terminal, which is an externally leading terminal, soldered to the conductive pattern of the insulation substrate; a case disposed over the insulation substrate such that a top surface of the independent terminal is exposed; an opening provided on a side surface of the case; a nut glove inserted from the opening so as to be below the independent terminal, and fix the independent terminal; and a first projection part formed on a side surface of the nut glove, and having tapers in a frontward direction and a rearward direction of insertion of the nut glove, respectively. The rearward taper of the first projection part is pressure contacting with a sidewall surface of the opening.
摘要翻译：半导体器件具有形成有导电图案的绝缘基板; 作为外部引线端子的独立端子焊接到绝缘基板的导电图案上; 设置在所述绝缘基板上以使得所述独立端子的顶表面露出的壳体; 设置在所述壳体的侧面上的开口部; 一个从开口插入以便在独立端子下方的螺母手套，固定独立端子; 以及形成在所述螺母手套的侧面上并分别在所述螺母手套的插入方向的前后方向上具有锥形的第一突出部。第一突出部分的向后锥形与开口的侧壁表面压力接触。

8. 发明申请

US20140168922A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20140168922A1
公开(公告)日：2014-06-19
申请号：US14232780
申请日：2012-08-24
申请人： Yoshihiro Kodaira
发明人： Yoshihiro Kodaira
IPC分类号： H05K5/02
CPC分类号： H01L23/544 , H01L21/56 , H01L23/049 , H01L23/053 , H01L23/10 , H01L23/147 , H01L23/29 , H01L23/3121 , H01L23/3142 , H01L23/315 , H01L23/34 , H01L23/36 , H01L23/3735 , H01L23/49811 , H01L25/072 , H01L29/66325 , H01L2224/291 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H05K5/0247 , H01L2924/014 , H01L2924/00
摘要： A semiconductor device has a control terminal attached to a patterned insulating substrate; a first projection formed on the control terminal; a second projection formed on the control terminal; a concave formed between the first projection and the second projection; a resin case disposed to cover the patterned insulating substrate, and having an opening for passing the control terminal therethrough; a first concave portion; a beam portion disposed at the opening of the resin case; a second concave portion formed in the beam portion; a resin block inserted into the opening of the resin case and sandwiching the control terminal together with the sidewall of the opening of the resin case to fix the control terminal to the resin case; a convex step portion; a third projection formed on a side surface of the resin block; and a fourth projection thinned on a bottom surface of the resin block.
摘要翻译：半导体器件具有附接到图案化绝缘基板的控制端子; 形成在控制终端上的第一突起; 形成在控制终端上的第二突起; 形成在所述第一突起和所述第二突起之间的凹部; 设置成覆盖图案化的绝缘基板的树脂壳体，并且具有用于使控制端子通过的开口; 第一凹部; 设置在树脂壳体的开口处的梁部; 形成在所述梁部中的第二凹部; 将树脂块插入到树脂壳体的开口中并将控制端子与树脂壳体的开口的侧壁一起夹持以将控制端子固定到树脂壳体; 凸台阶部; 形成在树脂块的侧表面上的第三突起; 以及在树脂块的底面上变薄的第四突起。

9. 发明申请

US20130334676A1 SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体模块及其制造方法
公开(公告)号：US20130334676A1
公开(公告)日：2013-12-19
申请号：US14002043
申请日：2011-11-15
申请人： Yoshihiro Kodaira
发明人： Yoshihiro Kodaira
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L23/498 , H01L21/76838 , H01L23/142 , H01L23/24 , H01L23/49811 , H01L25/072 , H01L2924/0002 , H05K2201/10166 , H05K2201/1031 , Y02P70/611 , H01L2924/00
摘要： A semiconductor module is manufactured by bonding a resin case having a first opening through which surfaces of main circuit terminals and control terminals are exposed, onto a metal heat-dissipating substrate onto which is bonded, a conductive-patterned insulating substrate onto which are bonded, semiconductor chips, the main circuit terminals, and the control terminals; inserting into and attaching to a second opening formed on a side wall constituting a resin case, a resin body having a nut embedded therein to fix the main circuit terminals and the control terminals; and filling the resin case with a resin material. A side wall of the first opening is tapered toward the surface thereof; a tapered contact portion contacting the tapered side wall is disposed on the control terminal; and the resin body having the embedded nut fixes the control terminal having a one-footing structure that is an independent terminal.
摘要翻译：半导体模块通过将具有第一开口的主体电路端子和控制端子露出的第一开口的树脂壳体接合到粘合的导电图案化绝缘基板上的金属散热基板上，半导体芯片，主电路端子和控制端子; 插入并附接到形成在构成树脂壳体的侧壁上的第二开口，具有嵌入其中的螺母的树脂体，以固定主电路端子和控制端子; 并用树脂材料填充树脂壳体。第一开口的侧壁朝向其表面逐渐变细; 在所述控制端子上设置与所述锥形侧壁接触的锥形接触部; 并且具有嵌入螺母的树脂体固定具有作为独立端子的单脚结构的控制端子。

10. 发明授权

US08941228B2 Semiconductor module and manufacturing method thereof 有权
标题翻译：半导体模块及其制造方法
公开(公告)号：US08941228B2
公开(公告)日：2015-01-27
申请号：US14002043
申请日：2011-11-15
申请人： Yoshihiro Kodaira
发明人： Yoshihiro Kodaira
IPC分类号： H01L23/498 , H01L21/768 , H01L23/14 , H01L23/24 , H01L25/07
CPC分类号： H01L23/498 , H01L21/76838 , H01L23/142 , H01L23/24 , H01L23/49811 , H01L25/072 , H01L2924/0002 , H05K2201/10166 , H05K2201/1031 , Y02P70/611 , H01L2924/00
摘要： A semiconductor module is manufactured by bonding a resin case having a first opening through which surfaces of main circuit terminals and control terminals are exposed, onto a metal heat-dissipating substrate onto which is bonded, a conductive-patterned insulating substrate onto which are bonded, semiconductor chips, the main circuit terminals, and the control terminals; inserting into and attaching to a second opening formed on a side wall constituting a resin case, a resin body having a nut embedded therein to fix the main circuit terminals and the control terminals; and filling the resin case with a resin material. A side wall of the first opening is tapered toward the surface thereof; a tapered contact portion contacting the tapered side wall is disposed on the control terminal; and the resin body having the embedded nut fixes the control terminal having a one-footing structure that is an independent terminal.
摘要翻译：半导体模块通过将具有第一开口的主体电路端子和控制端子露出的第一开口的树脂壳体接合到粘合的导电图案化绝缘基板上的金属散热基板上，半导体芯片，主电路端子和控制端子; 插入并附接到形成在构成树脂壳体的侧壁上的第二开口，具有嵌入其中的螺母的树脂体，以固定主电路端子和控制端子; 并用树脂材料填充树脂壳体。第一开口的侧壁朝向其表面逐渐变细; 在所述控制端子上设置与所述锥形侧壁接触的锥形接触部; 并且具有嵌入螺母的树脂体固定具有作为独立端子的单脚结构的控制端子。

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