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    • 4. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20110186999A1
    • 2011-08-04
    • US12879940
    • 2010-09-10
    • Fumihiko MomoseKazumasa KidoYoshitaka NishimuraFumio Shigeta
    • Fumihiko MomoseKazumasa KidoYoshitaka NishimuraFumio Shigeta
    • H01L23/52H01L21/50
    • H01L24/80H01L21/50H01L23/52H01L2924/1305H01L2924/13055H01L2924/00
    • Hardness of bonding end portions of an external connection terminal to be bonded to circuit patterns of an insulating substrate which is not lower than 90 in Vickers hardness is disclosed. An ultrasonic welding tool is used. In the external connection terminal in which the bonding end portions are provided integrally with a bar, one of the bonding end portion located substantially in the lengthwise center of the bar is first bonded, and the other bonding end portions are bonded alternately in order toward either end. The hardness of the bonding end portions is increased so that strength of the ultrasonic welding portions is increased. Since the external connection terminal including the bonding end portions is bonded in such a manner that the bonding end portion located substantially in the center is first bonded and the other bonding end portions are then bonded in order of increasing distance substantially from the central bonding end portion, displacement of the bonding end portion in either end from its regular position can be suppressed to keep bonding strength high. In this manner, the bonding strength of the ultrasonic welding portions between the external connection terminal and the circuit patterns of the insulating substrate can be increased so that long-term reliability can be secured in a semiconductor device.
    • 公开了将待接合的外部连接端子的端部与维氏硬度不低于90的绝缘基板的电路图案的接合端的硬度。 使用超声波焊接工具。 在接合端部与棒一体设置的外部连接端子中,首先将位于棒的纵向中心的接合端部中的一个接合,并且另一个接合端部交替地接合以朝向 结束。 接合端部的硬度增加,使得超声波焊接部的强度增加。 由于包括接合端部的外部连接端子以这样的方式被接合,使得基本上位于中心的接合端部被首先接合,并且接着另外的接合端部按照与中心接合端部 可以抑制任一端的接合端部从其规则位置的位移,保持接合强度高。 以这种方式,可以增加外部连接端子和绝缘基板的电路图案之间的超声波焊接部分的接合强度,从而可以确保半导体器件的长期可靠性。
    • 10. 发明授权
    • Apparatus for recovering sequentially controlled apparatus
    • 用于恢复顺序控制的装置的装置
    • US5111383A
    • 1992-05-05
    • US412820
    • 1989-09-27
    • Katsunori KimuraShinichi HataYoshitaka Nishimura
    • Katsunori KimuraShinichi HataYoshitaka Nishimura
    • G05B9/02G05B19/02G05B19/042G05B23/02
    • G05B19/0428
    • An automatic operation recovery system for automatically removing an operational failure caused in an apparatus whose complete operation is controlled by actuators operated in a predetermined sequence, thereby recovering the apparatus to its normal operating condition, comprises an actuator driver for controllably driving the actuators in a sequence suitable for a type of operational failure so as to remove the operational failure, a memory for accumulatively storing data of a type of operational failure and a sequence taken to remove the type of operational failure through the actuator driver and an automatic recovery controller for, when an operational failure is detected, assigning an order of priority to sequences available for removing the same type of operational failure accumulatively stored in the memory and automatically actuating the actuator driver to operate the actuators in a sequence assigned the first order of priority.
    • 一种自动操作恢复系统,用于自动消除在其完整操作由按照预定顺序操作的致动器控制的设备中引起的操作故障,从而将设备恢复到其正常操作状态,包括用于按顺序可控地驱动致动器的致动器驱动器 适用于一种操作故障,以便消除操作故障,用于累积存储一种操作故障类型的数据的存储器以及通过致动器驱动器和自动恢复控制器去除操作故障类型的顺序,当时 检测到操作故障,为可用于去除累积存储在存储器中的相同类型的操作故障的序列分配优先级顺序,并且自动地致动致动器驱动器以按照优先级顺序分配的顺序操作致动器。