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    • 9. 发明授权
    • Method of forming patterns for semiconductor device
    • 形成半导体器件图案的方法
    • US08318603B2
    • 2012-11-27
    • US12653588
    • 2009-12-16
    • Young-Ho LeeJae-Hwang SimSang-Yong ParkKyung-Lyul Moon
    • Young-Ho LeeJae-Hwang SimSang-Yong ParkKyung-Lyul Moon
    • H01L21/311
    • H01L23/528H01L21/0337H01L21/0338H01L21/3086H01L21/3088H01L21/31144H01L21/76229H01L21/76816H01L21/76838H01L27/10814H01L27/10855H01L27/11519H01L27/11526H01L2924/0002H01L2924/00
    • Provided is a method of forming patterns for a semiconductor device in which fine patterns and large-width patterns are formed simultaneously and adjacent to each other. In the method, a first layer is formed on a substrate so as to cover a first region and a second region which are included in the substrate. Both a blocking pattern covering a portion of the first layer in the first region and a low-density large-width pattern covering a portion of the first layer in the second region are simultaneously formed. A plurality of sacrificial mask patterns are formed on the first layer and the blocking pattern in the first region. A plurality of spacers covering exposed sidewalls of the plurality of sacrificial mask patterns are formed. The plurality of sacrificial mask patterns are removed. The first layer in the first and second regions are simultaneously etched by using the plurality of spacers and the blocking pattern as etch masks in the first region and using the low-density large-width pattern as an etch mask in the second region.
    • 提供一种形成半导体器件的图案的方法,其中精细图案和大幅图案同时并且彼此相邻地形成。 在该方法中,在衬底上形成第一层以覆盖包括在衬底中的第一区域和第二区域。 同时形成覆盖第一区域中的第一层的一部分的阻挡图案和覆盖第二区域中的第一层的一部分的低密度大图案。 在第一层上形成多个牺牲掩模图案,并在第一区域中形成阻挡图案。 形成覆盖多个牺牲掩模图案的暴露侧壁的多个间隔物。 去除多个牺牲掩模图案。 通过使用多个间隔物和阻挡图案作为第一区域中的蚀刻掩模并且在第二区域中使用低密度大宽度图案作为蚀刻掩模,同时蚀刻第一和第二区域中的第一层。