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    • 3. 发明申请
    • Jack Connector
    • 插孔连接器
    • US20120309220A1
    • 2012-12-06
    • US13487551
    • 2012-06-04
    • Yu Sheng SuJames R. Kirk
    • Yu Sheng SuJames R. Kirk
    • H01R13/627
    • H01R13/6275
    • A jack connector includes a main body, contact terminals, and an engaging assembly. The main body has a lateral opening on its one side surface and a top opening on a top surface connected to the side surface. A portion of the contact terminals are provided in the main body. The engaging assembly is mounted on the top surface of the main body to surround the top opening. The engaging assembly has two engaging plates protruding from the top opening. When a plug is inserted into the jack connector via the lateral opening, the two engaging plates of the jack connector are engaged with the plug, so that the plug can be electrically connected to the jack connector via the contact terminals.
    • 插座连接器包括主体,接触端子和接合组件。 主体在其一个侧表面上具有侧向开口,在顶表面上具有与侧表面连接的顶部开口。 接触端子的一部分设置在主体中。 接合组件安装在主体的顶表面上以围绕顶部开口。 接合组件具有从顶部开口突出的两个接合板。 当插头经由侧开口插入插座连接器时,插座连接器的两个接合板与插头接合,使得插头可以经由接触端子电连接到插座连接器。
    • 8. 发明申请
    • WET PROCESSING APPARATUSES
    • 湿处理设备
    • US20080295874A1
    • 2008-12-04
    • US11754843
    • 2007-05-29
    • Kuang-Nian TangYang-Kai FanYu-Sheng SuMing-Tsao ChiangYu-Cheng Shih
    • Kuang-Nian TangYang-Kai FanYu-Sheng SuMing-Tsao ChiangYu-Cheng Shih
    • B08B3/10
    • H01L21/67023H01L21/67057
    • A semiconductor apparatus includes a first tank configured to accommodate a first fluid. A second tank is configured to receive overflow of the first fluid into an upper portion of the second tank and to accommodate a second fluid. A cycling system including a first conduit is configured between the first tank and the second tank. The first conduit has an end substantially below a surface of the second fluid. A fluid providing system including a second conduit is fluidly coupled to the second tank and configured to provide the second fluid into the second tank. The second conduit has an end substantially below the surface of the second fluid. An overflow system is coupled to the second tank and configured to remove an upper portion of the second fluid when the surface of the second fluid is substantially equal to or higher than a pre-determined level.
    • 半导体装置包括配置成容纳第一流体的第一罐。 第二罐被配置为接收第一流体溢流到第二罐的上部并容纳第二流体。 包括第一管道的循环系统配置在第一罐和第二罐之间。 第一导管具有基本上低于第二流体表面的端部。 包括第二导管的流体提供系统流体地联接到第二罐并且被配置为将第二流体提供到第二罐中。 第二导管具有基本上低于第二流体表面的端部。 溢流系统联接到第二罐,并且构造成当第二流体的表面基本上等于或高于预定水平时,去除第二流体的上部。