会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Optical modulator
    • 光调制器
    • US08411349B2
    • 2013-04-02
    • US13022896
    • 2011-02-08
    • Osamu MitomiYasunori IwasakiYuji HoriKenji AokiJungo Kondo
    • Osamu MitomiYasunori IwasakiYuji HoriKenji AokiJungo Kondo
    • G02F1/01G02F1/03H04B10/04
    • G02F1/2255
    • An optical modulator includes an optical modulation substrate, an electrical length adjusting substrate, a package containing the substrates, and a plurality of input ports for inputting high frequency electrical signals. The optical modulation substrate includes a substrate body made of an electro-optic material, a ground electrode and a plurality of signal electrodes provided on the substrate body, optical waveguides propagating lights interacting with the signal electrodes, respectively, and electrode input ports inputting the high frequency electrical signals into the signal electrodes, respectively. The signal electrode includes an interacting part, an input end part provided between the electrode input port and interacting part, and a terminal part. The electrical length adjusting substrate includes conductive lines connected to the input ports for inputting the high frequency electrical signals, respectively. The conductive lines have electrical lengths different from each other for adjusting the phase differences among the ports.
    • 光调制器包括光调制基板,电长度调节基板,包含基板的封装以及用于输入高频电信号的多个输入端口。 光调制基板包括由电光材料制成的基板主体,接地电极和设置在基板主体上的多个信号电极,分别与信号电极相互作用的光波导传播光和输入高电平的电极输入端 频率电信号分别进入信号电极。 信号电极包括相互作用部分,设置在电极输入端口和相互作用部分之间的输入端部分和端子部分。 电长度调节基板包括分别连接到用于输入高频电信号的输入端口的导线。 导线具有彼此不同的电长度,用于调节端口之间的相位差。
    • 5. 发明申请
    • COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    • 复合基板及其制造方法
    • US20120126669A1
    • 2012-05-24
    • US13386854
    • 2010-07-21
    • Hiroki KobayashiYuji HoriYasunori Iwasaki
    • Hiroki KobayashiYuji HoriYasunori Iwasaki
    • H01L41/04H01L41/22
    • H03H3/08Y10T29/42
    • The composite substrate is a substrate used to manufacture an acoustic wave device, and includes a support substrate, a piezoelectric substrate, and a adhesive layer with which the support substrate and the piezoelectric substrate are bonded to each other. In the composite substrate, assuming that a surface of the piezoelectric substrate that is bonded to the support substrate is defined as a first surface and a surface at the side opposite to the first surface is defined as a second surface, the piezoelectric substrate is formed such that the first surface is inside the second surface when the first surface is projected onto the second surface in a direction perpendicular to the second surface. In other words, the composite substrate has an outer peripheral surface that is formed such that the circumference thereof increases toward the top surface of the piezoelectric substrate.
    • 复合衬底是用于制造声波器件的衬底,并且包括支撑衬底,压电衬底和支撑衬底和压电衬底彼此结合的粘合层。 在复合基板中,假定将与支撑基板接合的压电基板的表面定义为第一表面,将与第一表面相反的一侧的表面定义为第二表面,则形成压电基板 当第一表面在垂直于第二表面的方向上投影到第二表面上时,第一表面在第二表面内。 换句话说,复合基板具有外周面,其形成为使得其周向朝向压电基板的顶面增大。
    • 8. 发明申请
    • METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE
    • 制造复合基板的方法
    • US20110041987A1
    • 2011-02-24
    • US12861895
    • 2010-08-24
    • Yuji HORIHiroki KobayashiYasunori Iwasaki
    • Yuji HORIHiroki KobayashiYasunori Iwasaki
    • B32B38/10
    • H03H9/02574H01L21/6836H01L2221/6834H01L2221/68359H03H3/02
    • A method for manufacturing a composite substrate according to the present invention includes a formation step of forming a structural element portion on a front surface of a first substrate, a grinding step of fixing the first substrate and grinding a back surface of the first substrate, and a bonding step of bonding a second substrate to the ground back surface with an adhesion layer composed of an adhesive. In such a manner, before forming the adhesion layer, the handling properties of which are affected by heating, and before grinding the first substrate, the strength of which is decreased by grinding, a process of forming the structural element portion, including a heating step, is performed. Furthermore, a piezoelectric substrate may be used as the first substrate, and a supporting substrate which supports the piezoelectric substrate may be used as the second substrate.
    • 根据本发明的复合基板的制造方法包括在第一基板的前表面上形成结构元件部分的形成步骤,固定第一基板并研磨第一基板的后表面的研磨步骤,以及 将第二基板与由粘合剂构成的粘合层接合到接地背面的接合工序。 以这种方式,在形成粘合层之前,其处理性能受加热影响,并且在研磨第一基板之前,其强度通过研磨降低,形成结构元件部分的工艺包括加热步骤 ,执行。 此外,可以使用压电基板作为第一基板,并且可以使用支撑压电基板的支撑基板作为第二基板。