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1. 发明授权

US11633821B2 Cutting apparatus 有权
公开(公告)号：US11633821B2
公开(公告)日：2023-04-25
申请号：US17649710
申请日：2022-02-02
申请人： DISCO CORPORATION
发明人： Kuniharu Izumi , Zhibo Su
IPC分类号： B23Q3/157 , B26D7/26 , B23Q3/155 , B28D5/02 , B24B45/00 , B24B49/08
摘要： A cutting apparatus includes a cutting unit that has a spindle with an annular cutting blade mounted to a tip part of the spindle through a blade mount, and a determining unit. The determining unit has a second flow path that is connected to a first flow path in a mounter of the blade mount for causing a negative or positive pressure to act on the first flow path, a measuring device that obtains a measured value of at least one of a pressure and a flow rate in the second flow path, and a screw-engaged state determining section that determines that a screw-engaged state of a fixed nut with a boss section of the mounter where the cutting blade is disposed is defective in a case where the measured value when the negative or positive pressure acts on the first flow path indicates an abnormal value.

2. 发明申请

US20200249384A1 PATTERN STRUCTURE AND METHOD OF MANUFACTURING THE PATTERN STRUCTURE 审中-公开
公开(公告)号：US20200249384A1
公开(公告)日：2020-08-06
申请号：US16858129
申请日：2020-04-24
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Sunghoon LEE , Joonyong PARK , Dongouk KIM , Jihyun BAE , Bongsu SHIN , Dongsik SHIM , Jaeseung CHUNG
IPC分类号： G02B5/30 , G03F7/00 , B28D5/02
摘要： A method for manufacturing a pattern structure includes preparing a wafer that has a plurality of fine patterns, generating a first trench by processing the wafer from a first surface to a first depth, and generating a second trench connected to the first trench by processing the wafer from a second surface which is opposite to the first surface to a second depth, thereby cutting the wafer.

3. 发明授权

US10677974B2 Pattern structure and method of manufacturing the pattern structure 有权
公开(公告)号：US10677974B2
公开(公告)日：2020-06-09
申请号：US15646836
申请日：2017-07-11
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Sunghoon Lee , Joonyong Park , Dongouk Kim , Jihyun Bae , Bongsu Shin , Dongsik Shim , Jaeseung Chung
IPC分类号： G02B5/30 , G03F7/00 , B28D5/02 , G02F1/1335
摘要： A method for manufacturing a pattern structure includes preparing a wafer that has a plurality of fine patterns, generating a first trench by processing the wafer from a first surface to a first depth, and generating a second trench connected to the first trench by processing the wafer from a second surface which is opposite to the first surface to a second depth, thereby cutting the wafer.

4. 发明授权

US10607865B2 Plate-shaped workpiece processing method 有权
公开(公告)号：US10607865B2
公开(公告)日：2020-03-31
申请号：US15940411
申请日：2018-03-29
申请人： DISCO CORPORATION
发明人： Kenji Takenouchi
IPC分类号： H01L21/67 , H01L21/304 , H01L21/78 , H01L21/687 , B28D5/02 , H01L23/31
摘要： A method for processing a plate-shaped workpiece having a division line and a metal member formed on the division line or in an area corresponding to the division line includes a holding step of holding the plate-shaped workpiece on a chuck table where the metal member is exposed, a first cutting step of cutting the plate-shaped workpiece along the division line by using a first cutting blade after performing the holding step, thereby forming a first cut groove dividing the metal member, and a second cutting step of cutting the plate-shaped workpiece along the first cut groove by using a second cutting blade after performing the first cutting step, thereby forming a second cut groove fully cutting the plate-shaped workpiece. The first cutting step includes the step of supplying a cutting fluid containing an organic acid and an oxidizing agent to the plate-shaped workpiece.

5. 发明申请

US20190389091A1 Semiconductor Sawing Method and System 审中-公开
公开(公告)号：US20190389091A1
公开(公告)日：2019-12-26
申请号：US16013926
申请日：2018-06-20
申请人： TEXAS INSTRUMENTS INCORPORATED
发明人： Chi-Hung Chen , Tung-Mei Tien , Hung-Yu Wang
IPC分类号： B28D5/02 , B28D5/00 , H01L21/78 , H01L21/683
摘要： In one instance, a method of manufacturing an integrated circuit includes a method for dicing a semiconductor wafer that includes disposing the semiconductor wafer on a moveable cutting table, cutting the semiconductor wafer, and ejecting a clearing fluid across an exposed side of the semiconductor wafer, with full coverage across the semiconductor wafer, at least during the cutting of the semiconductor wafer. The ejecting clearing fluid is ejected to form a layer or membrane of fluid that clears or reduces other fluids from the exposed side or surface of the semiconductor wafer. Other aspects are presented.

6. 发明申请

US20190275700A1 CHUCK TABLE AND PROCESSING APPARATUS INCLUDING THE SAME 审中-公开
公开(公告)号：US20190275700A1
公开(公告)日：2019-09-12
申请号：US16295706
申请日：2019-03-07
申请人： DISCO CORPORATION
发明人： Kazuma SEKIYA
IPC分类号： B28D5/00 , H01L21/82 , G01N29/14 , H01L21/683 , H01L21/67 , B28D5/02
摘要： A chuck table having a holding portion for holding a workpiece and a frame for supporting the holding portion. The holding portion includes a substrate having a plurality of fine holes arranged like a matrix at given intervals and a plurality of acoustic emission sensors arranged like a matrix on the substrate and spaced from each other so that each fine hole of the substrate is located between any adjacent ones of the acoustic emission sensors. The plurality of fine holes are connected through the frame to a vacuum source, thereby holding the workpiece on the acoustic emission sensors under suction. An elastic wave generated from the workpiece in processing the workpiece is collected at a plurality of positions by the plurality of acoustic emission sensors.

7. 发明授权

US10131147B2 Methods of making an inkjet print head by sawing discontinuous slotted recesses 有权
公开(公告)号：US10131147B2
公开(公告)日：2018-11-20
申请号：US14941898
申请日：2015-11-16
申请人： STMICROELECTRONICS, INC.
发明人： Kenneth J. Stewart
IPC分类号： B41J2/16 , B41J2/14 , H01L21/78 , B41J2/145 , B28D5/02
摘要： A method of making an inkjet print head may include forming, by sawing with a rotary saw blade, first discontinuous slotted recesses in a first surface of a wafer. The first discontinuous slotted recesses may be arranged in parallel, spaced apart relation. The method may further include forming, by sawing with the rotary saw blade, second discontinuous slotted recesses in a second surface of the wafer aligned and coupled in communication with the first continuous slotted recesses to define through-wafer channels. In another embodiment, the first and second plurality of discontinuous recesses may be formed by respective first and second rotary saw blades.

8. 发明申请

US20180286757A1 METHOD OF PROCESSING WORKPIECE 审中-公开
公开(公告)号：US20180286757A1
公开(公告)日：2018-10-04
申请号：US15941131
申请日：2018-03-30
申请人： DISCO CORPORATION
发明人： Kenji Takenouchi
IPC分类号： H01L21/78 , B28D5/00 , B28D5/02
CPC分类号： H01L21/78 , B28D5/0076 , B28D5/0094 , B28D5/023 , H01L21/67092
摘要： A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines, includes the steps of holding the workpiece on a holding table, and thereafter, cutting the workpiece along the projected dicing lines with an annular cutting blade, thereby separating the layered bodies. The cutting blade has a slit which is open at an outer peripheral edge thereof. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

9. 发明申请

US20180104852A1 CUTTING SYSTEM AND METHOD FOR A CUTTING SYSTEM 审中-公开
公开(公告)号：US20180104852A1
公开(公告)日：2018-04-19
申请号：US15561308
申请日：2016-03-13
申请人： D. SWAROVSKI KG
发明人： Johannes Schweigl , Hubert Schwabegger , Joachim Karger , Gerhard Lindenthaler , Andreas Mimm
IPC分类号： B28D5/02
摘要： The invention relates to a cutting system. The cutting system (1) is designed to extend in the direction of a first system axis (7) which extends horizontally along a width (B) of the cutting system (1), in the direction of a second system axis (8) which extends vertically relative to the first system axis (7), and in the direction of a third system axis (9) which extends along the depth (T) of the cutting system orthogonally to the first system axis (7) and the second system axis (8). The cutting system has a support (2), a tool (3; 4) which is received on the support (2) in the form of a saw with a spindle shaft (13; 14), the operating direction of the tool following the direction of the first system axis (7), and an additional tool (5) which is received on the support (2) in the form of a chop saw with a third spindle shaft (15), the operating direction of the additional tool following the direction of the first system axis (7). The tools (3; 4; 5) are used to machine a blank, and the tools (3; 4; 5) are arranged in series in the direction of the first system axis (7). The cutting system (1) has a support element (10) which is received on the support (2) in a movable manner along the first system axis (7) and the second system axis (8), and the support element (10) is provided for supporting the blank. The support element (10) can be rotated about the second system axis (8), and according to the invention, the spindle shaft (13; 14) is orthogonal to the third spindle shaft (15).

10. 发明申请

US20180044220A1 METHOD OF CUTTING OUT GLASS PLATE AND POSITIONING CUT-OUT GLASS PLATE AND APPARATUS THEREOF 审中-公开
公开(公告)号：US20180044220A1
公开(公告)日：2018-02-15
申请号：US15549654
申请日：2016-05-26
申请人： BANDO KIKO CO., LTD.
发明人： Kazuaki BANDO
IPC分类号： C03B33/03 , G05B19/4093 , B28D5/02 , B65G49/06 , C03B33/037 , C03B33/027
CPC分类号： C03B33/03 , B28D1/22 , B28D5/023 , B65G49/064 , B65G2249/04 , B65G2249/045 , C03B33/027 , C03B33/037 , G05B19/401 , G05B19/40932 , G05B2219/50033
摘要： A cut-out glass plate positioning apparatus includes: a cut line forming device 4 provided in a cut line forming position 4a; a bend-breaking and separating device 6 for cutting out unworked plate glasses 5 from an unworked plate glass 2 along the cut lines 3; a pair of position and angle correcting devices 8 for effecting correction of the position and angle with respect to the unworked plate glass 5; a pair of sucking and transporting devices 9 for suckingly lifting and transporting the unworked plate glass 5 to each position and angle correcting device 8; and two CCD cameras 10 respectively installed above the position and angle correcting devices 8.

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