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1. 发明授权

US09369945B2 Wireless network system and wireless communication method for switching a wireless network mode 有权
标题翻译：无线网络系统和无线通信方式，用于切换无线网络模式
公开(公告)号：US09369945B2
公开(公告)日：2016-06-14
申请号：US12652952
申请日：2010-01-06
申请人： Akihiko Suyama , Tadashi Sugiyama
发明人： Akihiko Suyama , Tadashi Sugiyama
IPC分类号： H04K1/00 , H04W48/08 , H04L29/06 , H04W12/04
CPC分类号： H04W28/021 , H04L63/06 , H04L63/20 , H04W12/04 , H04W48/08 , H04W48/20 , H04W84/12
摘要： A wireless network system includes a user device, a client and an access point. In the wireless network system, a wireless network mode of the client is started in an AdHoc mode in response to specific operation, a wireless network mode of the user device is switched to an AdHoc mode when it is detected that the wireless network mode of the client is started in the AdHoc mode. Then, infrastructure network information including a network name and an encryption key for setting the wireless network communication in the infrastructure mode is transmitted from the user device to the client, and the wireless network mode of the client is switched to the infrastructure mode on the basis of the infrastructure network information.
摘要翻译：无线网络系统包括用户设备，客户端和接入点。在无线网络系统中，响应于特定操作，以AdHoc模式启动客户端的无线网络模式，当检测到用户设备的无线网络模式被检测到时，将用户设备的无线网络模式切换到AdHoc模式客户端以AdHoc模式启动。然后，从用户装置向客户端发送包括网络名称和用于将基础设施模式下的无线网络通信设定的加密密钥的基础设施网络信息，并且将客户端的无线网络模式基于的基础设施网络信息。

2. 发明申请

US20100115262A1 Wireless Network System and Wireless Communicaton Method 有权
标题翻译：无线网络系统和无线通信方法
公开(公告)号：US20100115262A1
公开(公告)日：2010-05-06
申请号：US12652952
申请日：2010-01-06
申请人： Akihiko SUYAMA , Tadashi Sugiyama
发明人： Akihiko SUYAMA , Tadashi Sugiyama
IPC分类号： G06F15/173 , H04L9/00
CPC分类号： H04W28/021 , H04L63/06 , H04L63/20 , H04W12/04 , H04W48/08 , H04W48/20 , H04W84/12
摘要： A wireless network system includes a user device, a client and an access point. In the wireless network system, a wireless network mode of the client is started in an AdHoc mode in response to specific operation, a wireless network mode of the user device is switched to an AdHoc mode when it is detected that the wireless network mode of the client is started in the AdHoc mode. Then, infrastructure network information including a network name and an encryption key for setting the wireless network communication in the infrastructure mode is transmitted from the user device to the client, and the wireless network mode of the client is switched to the infrastructure mode on the basis of the infrastructure network information.
摘要翻译：无线网络系统包括用户设备，客户端和接入点。在无线网络系统中，响应于特定操作，以AdHoc模式启动客户端的无线网络模式，当检测到用户设备的无线网络模式被检测到时，将用户设备的无线网络模式切换到AdHoc模式客户端以AdHoc模式启动。然后，从用户装置向客户端发送包括网络名称和用于将基础设施模式下的无线网络通信设定的加密密钥的基础设施网络信息，并且将客户端的无线网络模式基于的基础设施网络信息。

3. 发明授权

US08574080B2 Game controller, storage medium storing game program, and game apparatus 有权
标题翻译：游戏控制器，存储媒体存储游戏程序和游戏装置
公开(公告)号：US08574080B2
公开(公告)日：2013-11-05
申请号：US13313841
申请日：2011-12-07
申请人： Hitoshi Yamazaki , Takao Sawano , Tadashi Sugiyama
发明人： Hitoshi Yamazaki , Takao Sawano , Tadashi Sugiyama
IPC分类号： A63F9/24
CPC分类号： A63F13/245 , A63F13/06 , A63F13/212 , A63F13/214 , A63F13/218 , A63F13/235 , A63F2300/1006 , A63F2300/1025 , A63F2300/1056 , A63F2300/1068 , A63F2300/6045
摘要： A game controller includes at least four load sensors for detecting a load applied on a support board on which player's legs are ridden, and the game controller transmits a load value detected as manipulation data by the four load sensors to a game machine. The game machine determines a necessary quantity of load values, and the game machine computes the necessary quantity of load values based on the detected load value from the game controller. Then, game processing is performed based on the necessary quantity of computed load values.
摘要翻译：游戏控制器包括至少四个负载传感器，用于检测施加在玩家腿部的支撑板上的负载，游戏控制器将由四个负载传感器检测为操作数据的负载值发送到游戏机。游戏机确定必要数量的负载值，游戏机根据检测到的来自游戏控制器的负载值，计算必要的负荷值。然后，基于所计算的载荷值的必要量进行游戏处理。

4. 发明授权

US07888605B2 Multilayer printed circuit board 有权
标题翻译：多层印刷电路板
公开(公告)号：US07888605B2
公开(公告)日：2011-02-15
申请号：US12034572
申请日：2008-02-20
申请人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
发明人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
IPC分类号： H05K1/16
CPC分类号： H01L24/29 , H01L21/4846 , H01L21/4857 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L23/544 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/03 , H01L25/18 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2223/54486 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/16227 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/45144 , H01L2224/73267 , H01L2224/83192 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/18162 , H01L2924/30107 , H05K1/185 , H05K3/4602 , H05K2201/09036 , H05K2201/09563 , H05K2201/096 , H05K2201/09918 , H05K2201/10674 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2224/82 , H01L2924/3512 , H01L2924/00
摘要： A multilayer printed circuit board has an IC chip included in a core substrate in advance, and an intermediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the intermediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole, and to improve reliability.
摘要翻译：多层印刷电路板预先具有包括在芯基板中的IC芯片，以及设置在IC芯片的焊盘上的中间层。由此，可以在不使用引线部件和密封树脂的情况下将IC芯片电连接到多层印刷电路板。此外，通过在芯片焊盘上设置由铜制成的中间层，可以防止焊盘上的树脂残留物并改善焊盘和通孔之间的连接特性，并提高可靠性。

5. 发明授权

US07656755B2 Method and apparatus for recording digital audio to compact disc from a mass storage device 失效
标题翻译：从大容量存储装置将数字音频记录到光盘的方法和装置
公开(公告)号：US07656755B2
公开(公告)日：2010-02-02
申请号：US10985427
申请日：2004-11-10
申请人： Tadashi Sugiyama
发明人： Tadashi Sugiyama
IPC分类号： G11B21/08
CPC分类号： G11B27/34 , G11B27/002 , G11B27/034 , G11B27/105 , G11B27/36 , G11B2220/218 , G11B2220/2516 , G11B2220/2545
摘要： Audio data which are read out from a compact disc drive are written into a hard disk drive (6) at a rate that is higher than an audio playback rate. The written audio data are read out at a rate which is higher than the audio playback rate, and then output to audio output interfaces (buffer memories). The audio output interfaces read out the audio data at the playback rate and output the data. Since the hard disk drive (6) can perform reading/writing at a rate which is sufficiently higher than the playback rate of audio data, monitoring is enabled while performing ripping.
摘要翻译：从光盘驱动器读出的音频数据以高于音频播放速率的速率写入硬盘驱动器（6）。写入的音频数据以高于音频播放速率的速率读出，然后输出到音频输出接口（缓冲存储器）。音频输出接口以播放速率读出音频数据并输出数据。由于硬盘驱动器（6）可以以足够高于音频数据的重放速率的速率执行读取/写入，因此在执行翻录时能够进行监视。

6. 发明授权

US07575773B2 Optical compensatory sheet producing method and apparatus, thermal treating method and apparatus, and dust removing method and apparatus 有权
公开(公告)号：US07575773B2
公开(公告)日：2009-08-18
申请号：US11377672
申请日：2006-03-17
申请人： Seiji Ishizuka , Munehiro Ura , Tadashi Sugiyama , Kenji Nakajima , Kazuhiko Fujiwara , Naoyuki Kawanishi
发明人： Seiji Ishizuka , Munehiro Ura , Tadashi Sugiyama , Kenji Nakajima , Kazuhiko Fujiwara , Naoyuki Kawanishi
IPC分类号： B05D5/06 , B05D3/04
CPC分类号： B05D3/0413 , B05D7/04 , G02B5/3016 , G02B5/3083 , G02F1/13363 , G02F2001/133633
摘要： An optical compensatory sheet producing apparatus produces an optical compensatory sheet having a liquid crystal layer. In the apparatus, a rubbing unit is supplied with resin film having a first layer including resin, and subjects the first layer to a rubbing process, so as to form an orientation layer. A dust remover removes dust from the orientation layer by use of liquid such as perfluorocarbon, to which the orientation layer is insoluble. A liquid crystal layer coater is disposed downstream from the dust remover, for coating the orientation layer with coating liquid including liquid crystalline compound, so that the liquid crystal layer is formed.

7. 发明申请

US20080252059A1 Belt Guide Anchor and Seat Belt Unit Including the Same 有权
标题翻译：皮带指南及其安全带单位包括在内
公开(公告)号：US20080252059A1
公开(公告)日：2008-10-16
申请号：US12098177
申请日：2008-04-04
申请人： Yuki Tabata , Tadashi Sugiyama
发明人： Yuki Tabata , Tadashi Sugiyama
IPC分类号： B60R22/18
CPC分类号： B60R22/18 , B60R22/24 , B60R2022/1818
摘要： A belt guide anchor is provided to improve handling operability of a seat belt even when a belt opening angle between a portion of the seat belt adjacent to a retractor and that adjacent to an occupant is increased. A belt guide anchor has a belt insertion hole into which a seat belt is fitted so as to be slidable and expanded portions formed on surfaces of the belt guide anchor facing the interior and exterior, respectively, of the vehicle adjacent to the belt insertion hole. In one form, a thin portion is formed in the expanded portion on the surface facing the interior of the vehicle at a position adjoining a part of the belt insertion hole facing the front side of the vehicle, and a thin part is formed in the expanded portion on the surface facing the exterior of the vehicle at a position adjoining a part of the belt insertion hole facing the rear side of the vehicle. With this, even when a belt opening angle θ is large, the seat belt comes into light contact with the thin portions in the expanded portions. Thus, the friction during drawing of the seat belt is small, and the seat belt can be smoothly drawn out.
摘要翻译：即使当与牵开器相邻的座椅安全带的一部分和与乘客相邻的部分之间的带打开角度增加时，也提供带导向锚，以改善座椅安全带的处理操作性。带导向锚具具有带插入孔，安全带装配到该皮带插入孔中，以便分别形成在相邻于带插入孔的车辆内侧和外侧的带导向锚的表面上的可滑动和膨胀部分。在一种形式中，在与面向车辆前侧的带插入孔的一部分相邻的位置处，在面向车辆内部的表面的膨胀部分中形成薄壁部分，并且在扩展的在与面向车辆后方的带插入孔的一部分相邻的位置处的面向车辆外部的表面上的部分。由此，即使带开度θ较大，安全带与扩张部的薄壁轻微接触。因此，安全带拉伸期间的摩擦力小，能够平稳地拉出安全带。

8. 发明申请

US20080151519A1 MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD 有权
公开(公告)号：US20080151519A1
公开(公告)日：2008-06-26
申请号：US12034572
申请日：2008-02-20
申请人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang
发明人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang
IPC分类号： H05K1/18
CPC分类号： H01L24/29 , H01L21/4846 , H01L21/4857 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L23/544 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/03 , H01L25/18 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2223/54486 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/16227 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/45144 , H01L2224/73267 , H01L2224/83192 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/18162 , H01L2924/30107 , H05K1/185 , H05K3/4602 , H05K2201/09036 , H05K2201/09563 , H05K2201/096 , H05K2201/09918 , H05K2201/10674 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2224/82 , H01L2924/3512 , H01L2924/00
摘要： A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a mediate layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

9. 发明申请

US20080151517A1 MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD 有权
标题翻译：多层印刷电路板和多层印刷电路板制造方法
公开(公告)号：US20080151517A1
公开(公告)日：2008-06-26
申请号：US12034586
申请日：2008-02-20
申请人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
发明人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
IPC分类号： H05K1/18
CPC分类号： H01L24/29 , H01L21/4846 , H01L21/4857 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L23/544 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/03 , H01L25/18 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2223/54486 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/16227 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/45144 , H01L2224/73267 , H01L2224/83192 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/18162 , H01L2924/30107 , H05K1/185 , H05K3/4602 , H05K2201/09036 , H05K2201/09563 , H05K2201/096 , H05K2201/09918 , H05K2201/10674 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2224/82 , H01L2924/3512 , H01L2924/00
摘要： A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a mediate layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.
摘要翻译：多层印刷电路板预先包括在芯基板30中的IC芯片20和设置在IC芯片20的焊盘24上的中介层38。由此，可以在不使用引线部件和密封树脂的情况下将IC芯片电连接到多层印刷电路板。此外，通过在芯片焊盘24上设置由铜制成的中介层38，可以防止焊盘24上的树脂残留，并且改善焊盘24和通孔60之间的连接特性，并且可靠性。

10. 发明申请

US20050247081A1 Optical glass element and manufacturing method thereof 有权
标题翻译：光学玻璃元件及其制造方法
公开(公告)号：US20050247081A1
公开(公告)日：2005-11-10
申请号：US10940942
申请日：2004-09-14
申请人： Tadafumi Sakata , Tadashi Sugiyama
发明人： Tadafumi Sakata , Tadashi Sugiyama
IPC分类号： G02B3/00 , C03B11/00 , C03B11/08 , C03B11/12 , C03B11/16 , C03B23/00
CPC分类号： C03B11/08 , C03B11/122 , C03B11/16 , C03B2215/03 , C03B2215/49 , C03B2215/68
摘要： The present invention relates to a manufacturing method for an optical glass element, in which molten glass 9 is pressed between a lower mold 1 and an upper mold 8, and the pressing process is carried out while maintaining a space 10 between a border area (5, 6) of a molding face 2 belonging to the lower mold 1 and a circumferential face 3 located on the periphery thereof and glass 9, and an optical glass element manufactured by such a method.
摘要翻译：本发明涉及一种用于在下模1和上模8之间挤压熔融玻璃9的光学玻璃元件的制造方法，并且在边界区域（5）属于下模具1的模制面2和位于其周边的圆周面3和玻璃9，以及通过这种方法制造的光学玻璃元件。

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