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    • 1. 发明申请
    • INSULATED GATE BIPOLAR TRANSISTOR AND METHOD FOR MANUFACTURING SAME
    • 绝缘栅双极晶体管及其制造方法
    • US20070290237A1
    • 2007-12-20
    • US11763558
    • 2007-06-15
    • Akio NAKAGAWA
    • Akio NAKAGAWA
    • H01L29/80
    • H01L29/7397H01L29/0834H01L29/36
    • An insulated gate bipolar transistor has a p-type emitter layer; an n-type buffer layer provided on the p-type emitter layer; an n-type base layer provided on the n-type buffer layer and having a higher resistivity than the n-type buffer layer; a p-type base layer provided in part of an upper surface of the n-type base layer; an n-type source layer provided in part of an upper surface of the p-type base layer; a trench extending through the n-type source layer and the p-type base layer to the n-type base layer; a gate electrode provided in the trench; and a gate insulating film provided between the gate electrode and an inner surface of the trench. The p-type emitter layer has a thickness of 5 to 50 μm and a dopant concentration of 2×1016 to 1×1018 cm−3.
    • 绝缘栅双极晶体管具有p型发射极层; 设置在p型发射极层上的n型缓冲层; 设置在n型缓冲层上并具有比n型缓冲层更高的电阻率的n型基极层; 设置在n型基底层的上表面的一部分的p型基底层; 设置在p型基底层的上表面的一部分的n型源极层; 通过n型源极层和p型基极层延伸到n型基极层的沟槽; 设置在沟槽中的栅电极; 以及栅极绝缘膜,设置在所述栅电极和所述沟槽的内表面之间。 p型发射极层的厚度为5〜50μm,掺杂剂浓度为2×10 16〜1×10 8 cm -3以下。
    • 2. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20080185640A1
    • 2008-08-07
    • US12050822
    • 2008-03-18
    • Akio NAKAGAWA
    • Akio NAKAGAWA
    • H01L29/94
    • H01L29/7813H01L29/0634H01L29/0878H01L29/1095H01L29/41766H01L29/4236H01L29/66727
    • A first main electrode is provided on one surface thereof. On the other surface thereof, a second semiconductor layer of the first conduction type and a third semiconductor layer of the second conduction type are arranged alternately along the surface. A fourth semiconductor layer of the second conduction type and a fifth semiconductor layer of the first conduction type are stacked on the surfaces of the second and third semiconductor layers. The semiconductor device further comprises a control electrode formed in a trench with an insulator interposed therebetween. The trench passes through the fourth and fifth semiconductor layers and reaches the second semiconductor layer. A sixth semiconductor layer of the first conduction type is diffused from the bottom of the trench. A second main electrode is connected to the fourth and fifth semiconductor layers.
    • 第一主电极设置在其一个表面上。 在其另一个表面上,第一导电类型的第二半导体层和第二导电类型的第三半导体层沿表面交替布置。 第二导电类型的第四半导体层和第一导电类型的第五半导体层堆叠在第二和第三半导体层的表面上。 半导体器件还包括形成在沟槽中的控制电极,绝缘体插入其间。 沟槽穿过第四和第五半导体层并到达第二半导体层。 第一导电类型的第六半导体层从沟槽的底部扩散。 第二主电极连接到第四和第五半导体层。