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    • 4. 发明申请
    • ADAPTIVE PROCESSES FOR IMPROVING INTEGRITY OF SURFACES
    • 改善表面完整性的自适应方法
    • US20160026176A1
    • 2016-01-28
    • US14339125
    • 2014-07-23
    • Apple Inc.
    • William F. LeggettSimon Regis Louis Lancaster-Larocque
    • G05B19/418H05K13/00
    • G05B19/41875G06F1/1613H05K13/00Y02P90/04
    • A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.
    • 描述用于执行电子设备结构的局部校正动作的处理。 结构可以包括配置为接收另一结构的配合表面,使得两个结构可以例如粘合在一起。 局部校正动作被配置为不改善配合表面,而且还防止电子设备内的光逸出在电子设备的不期望的区域中。 在一些实施例中,校正动作包括使用移除工具去除表面的识别部分。 在其他实施例中,校正动作包括使用不同的工具来添加表面的材料识别部分。 所识别的装置可以包括自动检查系统。