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1. 发明授权

US09063305B2 Methods and systems for dissipating heat in optical communications modules 有权
标题翻译：在光通信模块中散热的方法和系统
公开(公告)号：US09063305B2
公开(公告)日：2015-06-23
申请号：US13684802
申请日：2012-11-26
申请人： Avago Technologies General IP (Singapore) Pte. Ltd.
发明人： Laurence R. McColloch , David J. K. Meadowcroft , Seng-Kum Chan
IPC分类号： G02B6/42 , H05K7/20 , H01S5/024 , H04B10/40 , H01S5/022 , H01S5/42
CPC分类号： G02B6/4269 , H01S5/02208 , H01S5/02248 , H01S5/02469 , H01S5/423 , H04B10/40 , H05K7/20409 , H05K7/20436
摘要： A heat dissipation solution is provided that is suitable for use in, but not limited to use in, CXP modules. The heat dissipation solution allows the performance of a CXP module to be significantly improved without having to increase the size of the heat dissipation device that is currently used with known CXP modules. The heat dissipation solution thermally decouples the heat dissipation path associated with the laser diodes from the heat dissipation path associated with other heat-generating components of the module, such as the laser diode driver IC and the receiver IC. Decoupling these heat dissipation paths allows the temperature of the laser diodes to be kept cooler as they are operated at higher speeds while allowing the temperatures of the other components to run hotter, if desired or necessary.
摘要翻译：提供了一种散热解决方案，适用于但不限于使用CXP模块。散热解决方案可以显着提高CXP模块的性能，而无需增加当前使用的已知CXP模块的散热装置的尺寸。散热解决方案将与激光二极管相关联的散热路径与与模块的其它发热部件（例如激光二极管驱动器IC和接收器IC）相关联的散热路径热分解。去除这些散热路径允许激光二极管的温度保持较冷，因为它们以更高的速度运行，同时允许其他部件的温度运行更热，如果需要或必要的话。

2. 发明授权

US09052484B2 Connector assembly, a system and method for interconnecting one or more parallel optical transceiver modules with a system circuit board 有权
标题翻译：连接器组件，用于将一个或多个并行光收发器模块与系统电路板互连的系统和方法
公开(公告)号：US09052484B2
公开(公告)日：2015-06-09
申请号：US13661150
申请日：2012-10-26
申请人： Avago Technologies General IP (Singapore) Pte. Ltd.
发明人： Laurence R. McColloch , Faouzi Chaahoub , Georgios Asmanis
IPC分类号： H04B10/00 , G02B6/42 , H04B10/80
CPC分类号： G02B6/428 , G02B6/4246 , H04B10/801
摘要： A connector assembly is provided that mates on one side with an optical transceiver module holder and that electrically connects on the opposite side with an external system circuit board. When the connector assembly is mated with an optical transceiver module holder, a base of a parallel optical transceiver module held in the holder mates with a socket of the connector assembly such that respective arrays of electrical contacts disposed on the base and in the socket come into contact with one another. At least one gearbox IC for performing data rate conversion is mounted on the assembly circuit board. A lower surface of the assembly circuit board has an array of electrical contacts on it that are in contact with an array of electrical contacts disposed on the surface of the external system circuit board on which the connector assembly is mounted.
摘要翻译：提供了一个连接器组件，其一侧与光收发器模块保持器配合，并且在相对侧上与外部系统电路板电连接。当连接器组件与光收发器模块保持器配合时，保持在保持器中的平行光收发器模块的基座与连接器组件的插座配合，使得设置在基座和插座中的相应的电触头阵列进入彼此接触。用于执行数据速率转换的至少一个齿轮箱IC安装在组装电路板上。组装电路板的下表面上具有与其上安装有连接器组件的外部系统电路板的表面上的电触点阵列接触的电触点阵列。

3. 发明申请

US20140010514A1 METAL STRAIN RELIEF DEVICE FOR USE IN AN OPTICAL COMMUNICATIONS SYSTEM, AN OPTICAL FIBER CABLE THAT EMPLOYS THE STRAIN RELIEF DEVICE, AND A METHOD 有权
标题翻译：用于光通信系统的金属应变消除装置，使用应变消除装置的光纤电缆以及方法
公开(公告)号：US20140010514A1
公开(公告)日：2014-01-09
申请号：US13731576
申请日：2012-12-31
申请人： Avago Technologies General IP (Singapore) Pte. Ltd.
发明人： Laurence R. McColloch
IPC分类号： G02B6/44
CPC分类号： G02B6/44 , G02B6/4246 , G02B6/4261 , G02B6/4269 , G02B6/4292 , G02B6/4471
摘要： A strain relief device and method are provided for use with an optical fiber cable of an optical communications system. The strain relief device comprises a plurality of metal wires, or rods, grouped into a bundle of parallel metal wires and a clamping mechanism for clamping first and second ends of the metal wires to an optical fiber cable. The clamped bundle of metal wires forms a spring having a spring constant that provides it with a desired stiffness and a desired flexibility.
摘要翻译：提供了一种与光通信系统的光纤电缆一起使用的应变消除装置和方法。应变消除装置包括分组成一束平行金属线的多个金属线或棒，以及用于将金属线的第一和第二端夹持到光纤电缆的夹持机构。夹紧的金属丝束形成具有弹簧常数的弹簧，其使其具有期望的刚度和期望的柔性。

4. 发明申请

US20160238805A1 METHODS AND SYSTEMS FOR IMPROVING HEAT DISSIPATION, SIGNAL INTEGRITY AND ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING IN OPTICAL COMMUNICATIONS MODULES 有权
标题翻译：用于改善光通信模块中的散热，信号完整性和电磁干扰（EMI）屏蔽的方法和系统
公开(公告)号：US20160238805A1
公开(公告)日：2016-08-18
申请号：US14620291
申请日：2015-02-12
申请人： Avago Technologies General IP (Singapore) Pte. Ltd.
发明人： Laurence R. McColloch
IPC分类号： G02B6/42
CPC分类号： G02B6/4268 , G02B6/4246 , G02B6/4257 , G02B6/4261 , G02B6/4277 , G02B6/428
摘要： An optical communications module is provided that has improved heat dissipation, signal integrity and/or EMI shielding solutions. The heat dissipation solution thermally decouples the light source driver circuitry from the light source such that heat generated by the light source driver circuitry does not increase the temperature of the light source to the point that its performance is degraded. The heat dissipation solution may also include convective heat transfer features for further improving heat dissipation. The EMI solution includes features that increase the number of contact points between the outer surface of the module housing and EMI fingers of a cage that receives the module. The signal integrity solution includes features that reduce inductive coupling to improve impedance matching between electrical interconnections, thereby improving signal integrity.
摘要翻译：提供了具有改进的散热，信号完整性和/或EMI屏蔽解决方案的光通信模块。散热解决方案使光源驱动器电路与光源热分离，使得由光源驱动器电路产生的热量不会将光源的温度提高到其性能降低的程度。散热解决方案还可以包括对流传热特征，以进一步改善散热。 EMI解决方案包括增加模块壳体的外表面和接收模块的保持架的EMI指状件之间的接触点数量的特征。信号完整性解决方案包括减少电感耦合以改善电互连之间的阻抗匹配的特征，从而提高信号完整性。

5. 发明申请

US20160181709A1 SOCKETLESS LAND GRID ARRAY 有权
标题翻译：无接地线阵列
公开(公告)号：US20160181709A1
公开(公告)日：2016-06-23
申请号：US14573857
申请日：2014-12-17
申请人： Avago Technologies General IP (Singapore) Pte. Ltd
发明人： Laurence R. McColloch
IPC分类号： H01R12/52
CPC分类号： H01R12/523
摘要： A socketless land grid array (LGA) is provided that uses an adhesive material rather than a socket to secure the optical communications module to the LGA and to provide the clamping force that is needed to maintain contact between the module and the LGA and to maintain a flat profile for the module and the LGA. Eliminating the LGA socket eliminates the need to drill holes in the host circuit board and the need for additional hardware (e.g., backing plates, screws, etc.) to secure a socket to the host circuit board. This allows the area of the host circuit board underneath the array of electrical contacts of the LGA to be used for routing electrically-conductive pathways of the host circuit board (e.g., vias and traces) and reduces the amount of time and effort that are needed to secure modules to the respective LGAs.
摘要翻译：提供了一种使用粘合剂材料而不是插座的无接地焊盘阵列（LGA），以将光通信模块固定到LGA，并提供维持模块与LGA之间的接触所需的夹紧力并保持模块和LGA的平面轮廓。消除LGA插座消除了在主电路板中钻孔和需要附加硬件（例如背板，螺钉等）以将插座固定到主电路板的需要。这允许在LGA的电触点阵列下方的主机电路板的区域用于路由主电路板的导电路径（例如，通路和迹线），并减少所需的时间和精力将模块固定到相应的LGA。

6. 发明授权

US09140862B2 Methods, apparatuses and systems for blind mating multi-optical fiber connector modules 有权
标题翻译：盲配多光纤连接器模块的方法，装置和系统
公开(公告)号：US09140862B2
公开(公告)日：2015-09-22
申请号：US14168522
申请日：2014-01-30
申请人： Avago Technologies General IP (Singapore) Pte. Ltd.
发明人： Laurence R. McColloch
IPC分类号： G02B6/38
CPC分类号： G02B6/3885 , G02B6/3853 , G02B6/3883
摘要： Apparatuses, systems and methods are provided that enable N female multi-optical fiber connector modules disposed on a first structure to be simultaneously blind mated with N male multi-optical fiber connector modules disposed on a second structure, where N is a positive integer that is equal to or greater than one. Enabling the male and female multi-optical fiber connector modules to blind mate with one another obviates the need to individually interconnect the modules with optical cables. Each module is mounted on either a male or female socket, which, in turn, is mounted on the first or second structure. The first structure may be, for example, a rack having at least one slot configured to receive a server box, in which case the second structure is the server box itself.
摘要翻译：提供了使得设置在第一结构上的N个母多光纤连接器模块能够与设置在第二结构上的N个公头多光纤连接器模块同时盲配的装置，系统和方法，其中N是正整数等于或大于1。使阳/阴多光纤连接器模块能够彼此盲配，避免了将光模块与光缆单独互连的需要。每个模块安装在公插座或母插座上，而插座又安装在第一或第二结构上。第一结构可以是例如具有被配置为接收服务器盒的至少一个槽的机架，在这种情况下，第二结构是服务器盒本身。

7. 发明申请

US20140010553A1 AN ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING DEVICE AND METHOD FOR USE IN AN OPTICAL COMMUNICATIONS SYSTEM 有权
标题翻译：电磁干扰（EMI）屏蔽装置及其在光通信系统中的使用方法
公开(公告)号：US20140010553A1
公开(公告)日：2014-01-09
申请号：US13685304
申请日：2012-11-26
申请人： Avago Technologies General IP (Singapore) Pte. Ltd.
发明人： Laurence R. McColloch
IPC分类号： H04B10/00
CPC分类号： H04B10/14 , G02B6/4278 , Y10T29/49117
摘要： An electromagnetic interference (EMI) shielding device and method are provided for use with an optical communications module (OCM) that is configured to be plugged into a front panel of a box or housing of an optical communications system. The EMI shielding device is mechanically coupled to an end of a housing of the OCM such that when the OCM is fully inserted through an opening formed in the front panel, the EMI shielding device comes into abutment with the front panel to form an EMI seal around the opening that prevents, or at least helps prevent, EMI from escaping from the system housing through the opening formed in the front panel.
摘要翻译：提供了一种电磁干扰（EMI）屏蔽装置和方法，用于与被配置为插入光通信系统的盒子或外壳的前面板的光通信模块（OCM）一起使用。 EMI屏蔽装置机械耦合到OCM的壳体的端部，使得当OCM完全插入通过形成在前面板中的开口时，EMI屏蔽装置与前面板邻接以形成EMI密封该开口防止或至少有助于防止EMI从系统壳体通过形成在前面板中的开口逸出。

8. 发明授权

US09810873B2 Method and device for measuring alignment of an optical surface of a lens block 有权
公开(公告)号：US09810873B2
公开(公告)日：2017-11-07
申请号：US14695315
申请日：2015-04-24
申请人： Avago Technologies General IP (Singapore) Pte. Ltd.
发明人： Laurence R. McColloch , Omid Momtahan
IPC分类号： G02B7/00 , G02B6/42
CPC分类号： G02B7/003 , G02B6/42 , G02B6/4214 , G02B6/4215 , G02B6/4221 , G02B6/423 , G02B6/4246 , G02B6/4286
摘要： An alignment feature formed in a lens block during manufacturing has a precise spatial relationship to an optical surface of the lens block such that precise alignment of the alignment feature within the lens block ensures precise alignment of the optical surface within the lens block. Precise alignment of the alignment feature within the lens block is readily assessable whereas precise alignment of the optical surface within the lens block is not. A determination is made as to whether the optical surface is aligned within the lens block by determining whether the alignment feature is aligned within the lens block, and if not, the extent of any misalignment. The extent of misalignment may then be used to adjust the manufacturing process to eliminate the alignment error.

9. 发明申请

US20170317752A1 WALL PLATE HAVING A BUILT-IN MODEM FOR PERFORMING ELECTRICAL-TO-OPTICAL CONVERSION, OPTICAL-TO-ELECTRICAL CONVERSION AND PROTOCOL-TO-PROTOCOL CONVERSION 审中-公开
公开(公告)号：US20170317752A1
公开(公告)日：2017-11-02
申请号：US15143525
申请日：2016-04-30
申请人： Avago Technologies General IP (Singapore) Pte. Ltd
发明人： Laurence R. McColloch
IPC分类号： H04B10/25 , G02B6/42 , H04B10/27
CPC分类号： H04B10/2503 , G02B6/3897 , G02B6/4246 , G02B6/426 , G02B6/428 , G02B6/4284 , G02B6/4292 , H04B10/27
摘要： A wall plate is provided having a built-in modem on the backside of the wall plate that performs O/E, E/O and protocol conversions. The backside of the wall plate has an optical port for connecting an end of an optical fiber cable to the wall plate. A printed circuit board (PCB) disposed on the backside of the wall plate has electrical circuitry mounted thereon that performs protocol conversion and communicates with an optical transceiver module also mounted on the PCB. The optical transceiver module receives optical signals transmitted to the customer premises and transmits optical signals from the customer premises and performs O/E and E/O conversion. A front face of the wall plate has at least one socket therein for connection with an electrical connector disposed on an end of an electrical cable. The wall plate does not require a separate power supply.

10. 发明授权

US09733441B2 Heat dissipation clamp and methods, devices and systems for facilitating heat dissipation in optical communications modules 有权
公开(公告)号：US09733441B2
公开(公告)日：2017-08-15
申请号：US14926306
申请日：2015-10-29
申请人： Avago Technologies General IP (Singapore) Pte. Ltd.
发明人： Laurence R. McColloch
IPC分类号： G02B6/42 , G02B6/43
CPC分类号： G02B6/4269 , G02B6/426 , G02B6/428 , G02B6/4292 , G02B6/43
摘要： A heat dissipation system for an optical communications module is provided that includes a heat dissipation clamp having a plurality of force-application devices for applying respective, precisely-controlled forces to respective optical communications modules of an array to maintain electrical interconnectivity between the modules of the array and respective electrical sockets. The force-application devices are independent of one another such that the respective electrical interconnectivity forces applied to the respective modules are independent of one another. This independence ensures that the proper amount of electrical interconnectivity force is applied to each module of the array, which ensures that the planarity of the system PCB is maintained without the need for a backing, or bolstering, plate. Inner walls of the heat dissipation clamp are in contact with the modules so that heat generated by the modules is transferred into the heat dissipation clamp where some or all of the heat is dissipated.

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