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    • 1. 发明授权
    • Methods for defining and utilizing sub-resolution features in linear topology
    • 在线性拓扑中定义和利用子分辨率特征的方法
    • US08225239B2
    • 2012-07-17
    • US12479674
    • 2009-06-05
    • Brian ReedMichael C. SmaylingJoseph N. HongStephen FairbanksScott T. Becker
    • Brian ReedMichael C. SmaylingJoseph N. HongStephen FairbanksScott T. Becker
    • G06F17/50
    • G06F17/5068G03F1/36G06F2217/12Y02P90/265
    • Regular layout shapes are placed in accordance with a virtual grate. A determination is made as to whether an unoccupied layout space adjacent to a regular layout shape to be reinforced, and extending in a direction perpendicular to the regular layout shape, is large enough to support placement of a sub-resolution shape. Upon determining that the unoccupied layout space is large enough to support placement of the sub-resolution shape, the sub-resolution shape is placed so as to be substantially centered upon a virtual line of the virtual grate within the unoccupied layout space. Also, one or more sub-resolution shapes are placed between and parallel with neighboring regular layout shapes when windows of lithographic reinforcement associated with each of the neighboring regular layout shapes permit. The sub-resolution shapes may be placed according to a virtual grate, or may be placed based on proximity to edges of the neighboring regular layout shapes.
    • 正常的布局形状根据虚拟炉排放置。 确定与正规布局形状相邻的未被占用的布局空间是否被加强并且沿与正常布局形状垂直的方向延伸的尺寸足够大以支持分分辨率形状的放置。 在确定未占用的布局空间足够大以支持分分辨率形状的放置时,子分辨率形状被放置为基本上位于未占用的布局空间内的虚拟格栅的虚拟线上。 此外,当与相邻的规则布局形状中的每一个相关联的光刻加固件的窗口允许时,一个或多个子分辨率形状被放置在相邻的规则布局形状之间并与其平行。 子分辨率形状可以根据虚拟格栅放置,或者可以基于邻近的规则布局形状的边缘的位置放置。
    • 2. 发明授权
    • Methods for controlling microloading variation in semiconductor wafer layout and fabrication
    • 用于控制半导体晶片布局和制造中的微加载变化的方法
    • US09122832B2
    • 2015-09-01
    • US12512932
    • 2009-07-30
    • Brian ReedMichael C. SmaylingScott T. Becker
    • Brian ReedMichael C. SmaylingScott T. Becker
    • G06F17/50
    • G06F17/5081G06F2217/12Y02P90/265
    • Problematic open areas are identified in a semiconductor wafer layout. The problematic open areas have a size variation relative to one or more neighboring open areas of the layout sufficient to cause adverse microloading variation. In one embodiment, the adverse microloading variation is controlled by shifting a number of layout features to interdict the problematic open areas. In another embodiment, the adverse microloading variation is controlled by defining and placing a number of dummy layout features to shield actual layout features that neighbor the problematic open areas. In another embodiment, the adverse microloading variation is controlled by utilizing sacrificial layout features which are actually fabricated on the wafer temporarily to eliminate microloading variation, and which are subsequently removed from the wafer to leave behind the desired permanent structures.
    • 在半导体晶片布局中识别有问题的开放区域。 有问题的开放区域相对于布局的一个或多个相邻开放区域具有尺寸变化,足以导致不利的微加载变化。 在一个实施例中,通过移动多个布局特征来阻止有问题的开放区域来控制不利的微加载变化。 在另一个实施例中,通过限定和放置多个虚拟布局特征来屏蔽相邻有问题的开放区域的实际布局特征来控制不利的微加载变化。 在另一个实施例中,通过利用实际上在晶片上制造的牺牲布局特征来暂时控制不利的微加载变化,以消除微载荷变化,并且随后从晶片中移除留下期望的永久结构。