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1. 发明授权

US11245058B2 Light emitting diode constructions and methods for making the same 有权
公开(公告)号：US11245058B2
公开(公告)日：2022-02-08
申请号：US16416032
申请日：2019-05-17
申请人： Bridgelux, Inc.
发明人： Vladimir A. Odnoblyudov , R. Scott West
IPC分类号： H01L33/58 , H01L33/62 , H01L21/56
摘要： Light emitting diode (LED) constructions comprise an LED having a pair of electrical contacts along a bottom surface. A lens is disposed over the LED and covers a portion of the LED bottom surface. A pair of electrical terminals is connected with respective LED contacts, are sized larger than the contacts, and connect with the lens material along the LED bottom surface. A wavelength converting material may be interposed between the LED and the lens. LED constructions may comprise a number of LEDs, where the light emitted by each LED differs from one another by about 2.5 nm or less. LED constructions are made by attaching 2 or more LEDs to a common wafer by adhesive layer, forming a lens on a wafer level over each LED to provide a rigid structure, removing the common wafer, forming the electrical contacts on a wafer level, and then separating the LEDs.

2. 发明授权

US10297731B2 Light emitting diode constructions and methods for making the same 有权
公开(公告)号：US10297731B2
公开(公告)日：2019-05-21
申请号：US14555508
申请日：2014-11-26
申请人： Bridgelux, Inc.
发明人： Vladimir A. Odnoblyudov , R. Scott West
IPC分类号： H01L33/58 , H01L33/62 , H01L21/56
摘要： Light emitting diode (LED) constructions comprise an LED having a pair of electrical contacts along a bottom surface. A lens is disposed over the LED and covers a portion of the LED bottom surface. A pair of electrical terminals is connected with respective LED contacts, are sized larger than the contacts, and connect with the lens material along the LED bottom surface. A wavelength converting material may be interposed between the LED and the lens. LED constructions may comprise a number of LEDs, where the light emitted by each LED differs from one another by about 2.5 nm or less. LED constructions are made by attaching 2 or more LEDs to a common wafer by adhesive layer, forming a lens on a wafer level over each LED to provide a rigid structure, removing the common wafer, forming the electrical contacts on a wafer level, and then separating the LEDs.

3. 发明申请

US20190341535A1 LIGHT EMITTING DIODE PACKAGE HAVING SERIES CONNECTED LEDS 审中-公开
公开(公告)号：US20190341535A1
公开(公告)日：2019-11-07
申请号：US16297374
申请日：2019-03-08
申请人： Bridgelux, Inc.
发明人： Vladimir A. Odnoblyudov
IPC分类号： H01L33/62 , H01L25/075
摘要： Light emitting diode packages as disclosed herein include a monolithic chip including at least a first and a second light emitting diode (LED) that are electrically coupled in series, wherein the first and the second LEDs each include at least one electrical terminal configured to be electrically coupled to a power source. The monolithic chip is mounted onto a connection substrate having first and second landing pads formed from metallic material and electrically isolated from each other. The monolithic chip is mounted to the connection substrate such that the electrical terminal of the first LED is electrically connected to the first landing pad and the electrical terminal of the second LED is electrically connected to the second landing pad. In an example, the monolithic chip includes a third and a fourth LED electrically coupled to each other in series, and electrically coupled to the first and second LEDs in parallel.

4. 发明授权

US09978724B2 Red flip chip light emitting diode, package, and method of making the same 有权
公开(公告)号：US09978724B2
公开(公告)日：2018-05-22
申请号：US14752803
申请日：2015-06-26
申请人： Bridgelux, Inc.
发明人： Vladimir A. Odnoblyudov
IPC分类号： H01L33/00 , H01L25/075 , H01L33/50 , H01L33/52 , H01L33/56
CPC分类号： H01L25/0753 , H01L33/0079 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/504 , H01L33/508 , H01L33/52 , H01L33/56 , H01L2224/16225 , H01L2924/181 , H01L2924/00012
摘要： Flip chip LEDs comprise a transparent carrier and an active material layer such as AlInGaP bonded to the carrier and that emits light between about 550 to 650 nm. The flip chip LED has a first electrical terminal in contact with a first region of the active material layer, and a second electrical terminal in contact with a second region of the active material layer, wherein the first and second electrical terminals are positioned along a common surface of the active material layer. Chip-on-board LED packages comprise a plurality of the flip chip LEDs with respective first and second electrical terminals interconnected with one another. The package may include Flip chip LEDs that emit light between 420 to 500 nm, and the flip chip LEDs are covered with a phosphorus material comprising a yellow constituent, and may comprise a transparent material disposed over the phosphorus material.

5. 发明申请

US20180123010A1 LIGHT EMITTING DIODE PACKAGE HAVING SERIES CONNECTED LEDS 审中-公开
公开(公告)号：US20180123010A1
公开(公告)日：2018-05-03
申请号：US15853413
申请日：2017-12-22
申请人： Bridgelux, Inc.
发明人： Vladimir A. Odnoblyudov
IPC分类号： H01L33/62 , H01L25/075
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/502 , H01L33/64 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： Light emitting diode packages as disclosed herein include a monolithic chip including at least a first and a second light emitting diode (LED) that are electrically coupled in series, wherein the first and the second LEDs each include at least one electrical terminal configured to be electrically coupled to a power source. The monolithic chip is mounted onto a connection substrate having first and second landing pads formed from metallic material and electrically isolated from each other. The monolithic chip is mounted to the connection substrate such that the electrical terminal of the first LED is electrically connected to the first landing pad and the electrical terminal of the second LED is electrically connected to the second landing pad. In an example, the monolithic chip includes a third and a fourth LED electrically coupled to each other in series, and electrically coupled to the first and second LEDs in parallel.

6. 发明授权

US09853197B2 Light emitting diode package having series connected LEDs 有权
公开(公告)号：US09853197B2
公开(公告)日：2017-12-26
申请号：US14869507
申请日：2015-09-29
申请人： Bridgelux, Inc.
发明人： Vladimir A. Odnoblyudov
IPC分类号： H01L33/62 , H01L25/07 , H01L25/075 , H01L33/50 , H01L33/64
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/502 , H01L33/64 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： Light emitting diode packages as disclosed herein include a monolithic chip including at least a first and a second light emitting diode (LED) that are electrically coupled in series, wherein the first and the second LEDs each include at least one electrical terminal configured to be electrically coupled to a power source. The monolithic chip is mounted onto a connection substrate having first and second landing pads formed from metallic material and electrically isolated from each other. The monolithic chip is mounted to the connection substrate such that the electrical terminal of the first LED is electrically connected to the first landing pad and the electrical terminal of the second LED is electrically connected to the second landing pad. In an example, the monolithic chip includes a third and a fourth LED electrically coupled to each other in series, and electrically coupled to the first and second LEDs in parallel.

7. 发明公开

US20230178525A1 RED FLIP CHIP LIGHT EMITTING DIODE, PACKAGE, AND METHOD OF MAKING THE SAME 审中-公开
公开(公告)号：US20230178525A1
公开(公告)日：2023-06-08
申请号：US17986805
申请日：2022-11-14
申请人： Bridgelux, Inc.
发明人： Vladimir A. Odnoblyudov
IPC分类号： H01L25/075 , H01L33/50 , H01L33/52 , H01L33/56
CPC分类号： H01L25/0753 , H01L33/501 , H01L33/52 , H01L33/502 , H01L33/508 , H01L33/504 , H01L33/56 , H01L2924/181 , H01L2224/16225 , H01L33/50 , H01L33/0093
摘要： Flip chip LEDs comprise a transparent carrier and an active material layer such as AlInGaP bonded to the carrier and that emits light between about 550 to 650 nm. The flip chip LED has a first electrical terminal in contact with a first region of the active material layer, and a second electrical terminal in contact with a second region of the active material layer, wherein the first and second electrical terminals are positioned along a common surface of the active material layer. Chip-on-board LED packages comprise a plurality of the flip chip LEDs with respective first and second electrical terminals interconnected with one another. The package may include Flip chip LEDs that emit light between 420 to 500 nm, and the flip chip LEDs are covered with a phosphorus material comprising a yellow constituent, and may comprise a transparent material disposed over the phosphorus material.

8. 发明授权

US11502066B2 Red flip chip light emitting diode, package, and method of making the same 有权
公开(公告)号：US11502066B2
公开(公告)日：2022-11-15
申请号：US16667540
申请日：2019-10-29
申请人： Bridgelux, Inc.
发明人： Vladimir A. Odnoblyudov
IPC分类号： H01L33/00 , H01L25/075 , H01L33/50 , H01L33/52 , H01L33/56
摘要： Flip chip LEDs comprise a transparent carrier and an active material layer such as AlInGaP bonded to the carrier and that emits light between about 550 to 650 nm. The flip chip LED has a first electrical terminal in contact with a first region of the active material layer, and a second electrical terminal in contact with a second region of the active material layer, wherein the first and second electrical terminals are positioned along a common surface of the active material layer. Chip-on-board LED packages comprise a plurality of the flip chip LEDs with respective first and second electrical terminals interconnected with one another. The package may include Flip chip LEDs that emit light between 420 to 500 nm, and the flip chip LEDs are covered with a phosphorus material comprising a yellow constituent, and may comprise a transparent material disposed over the phosphorus material.

9. 发明申请

US20180342487A1 RED FLIP CHIP LIGHT EMITTING DIODE, PACKAGE, AND METHOD OF MAKING THE SAME 审中-公开
公开(公告)号：US20180342487A1
公开(公告)日：2018-11-29
申请号：US15986748
申请日：2018-05-22
申请人： Bridgelux, Inc.
发明人： Vladimir A. Odnoblyudov
IPC分类号： H01L25/075 , H01L33/50 , H01L33/56 , H01L33/52 , H01L33/00
CPC分类号： H01L25/0753 , H01L33/0079 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/504 , H01L33/508 , H01L33/52 , H01L33/56 , H01L2224/16225 , H01L2924/181 , H01L2924/00012
摘要： Flip chip LEDs comprise a transparent carrier and an active material layer such as AlInGaP bonded to the carrier and that emits light between about 550 to 650 nm. The flip chip LED has a first electrical terminal in contact with a first region of the active material layer, and a second electrical terminal in contact with a second region of the active material layer, wherein the first and second electrical terminals are positioned along a common surface of the active material layer. Chip-on-board LED packages comprise a plurality of the flip chip LEDs with respective first and second electrical terminals interconnected with one another. The package may include Flip chip LEDs that emit light between 420 to 500 nm, and the flip chip LEDs are covered with a phosphorus material comprising a yellow constituent, and may comprise a transparent material disposed over the phosphorus material.

10. 发明申请

US20160093787A1 LIGHT EMITTING DIODE ARRAY CONSTRUCTIONS AND PACKAGES 有权
标题翻译：发光二极管阵列结构和封装
公开(公告)号：US20160093787A1
公开(公告)日：2016-03-31
申请号：US14869507
申请日：2015-09-29
申请人： Bridgelux, Inc.
发明人： Vladimir A. Odnoblyudov
IPC分类号： H01L33/62 , H01L33/50 , H01L25/075
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/502 , H01L33/64 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： Light emitting diode packages as disclosed herein comprise a monolithic chip including at least a first and a second light emitting diode (LED) that are electrically coupled in series, wherein the first and the second LEDs each include at least one electrical terminal configured to be electrically coupled to a power source. The monolithic chip is mounted onto a connection substrate having first and second landing pads formed from metallic material and electrically isolated from each other. The monolithic chip is mounted to the connection substrate such that the electrical terminal of the first LED is electrically connected to the first landing pad and the electrical terminal of the second LED is electrically connected to the second landing pad. In an example, the monolithic chip includes a third and a fourth LED electrically coupled to each other in series, and electrically coupled to the first and second LEDs in parallel.
摘要翻译：包括本文公开的发光二极管封装包括至少包括串联电耦合的第一和第二发光二极管（LED）的单片芯片，其中第一和第二LED各自包括至少一个电端子，其被配置为电气耦合到电源。单片芯片安装在具有由金属材料形成并彼此电隔离的第一和第二着陆焊盘的连接基板上。单片芯片安装到连接基板，使得第一LED的电端子电连接到第一着陆焊盘，并且第二LED的电端子电连接到第二着陆焊盘。在一个示例中，单片芯片包括串联电耦合的第三和第四LED，并且并联电耦合到第一和第二LED。

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