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1. 发明申请

US20080183078A1 Ultrasound Imaging System 有权
标题翻译：超声成像系统
公开(公告)号：US20080183078A1
公开(公告)日：2008-07-31
申请号：US11669235
申请日：2007-01-31
申请人： Bruno Hans Haider , Kjell Kristoffersen , Rayette Ann Fisher , Thomas Halvorsrod , Robert Wodnicki
发明人： Bruno Hans Haider , Kjell Kristoffersen , Rayette Ann Fisher , Thomas Halvorsrod , Robert Wodnicki
IPC分类号： A61B8/00
CPC分类号： A61B8/00 , A61B1/0005 , B06B1/0622 , G01S7/5208 , G01S15/8925 , G01S15/8927 , G03B42/06
摘要： An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.
摘要翻译：超声成像系统（100）。示例性系统（100）包括形成在子阵列（140）中的多个换能器元件（136）和多个子阵列电路单元（160'），每个电路单元（160'）连接到子阵列换能器元件（136）。每个单元（160'）中的电路包括多个集成电路（330,340,350），其中至少第一（340）个集成电路以堆叠配置形成在第二（330）集成电路上。在示例图中，第一集成电路（340）包括沿着其表面（342）的第一多个第一接合焊盘（345），并且第二集成电路（330）包括沿着第一多个第二接合焊盘其具有在成对的第一和第二接合焊盘之间延伸的接合线（344），以在它们之间提供输入/输出信号连接。

2. 发明授权

US07687976B2 Ultrasound imaging system 有权
标题翻译：超声成像系统
公开(公告)号：US07687976B2
公开(公告)日：2010-03-30
申请号：US11669235
申请日：2007-01-31
申请人： Bruno Hans Haider , Kjell Kristoffersen , Rayette Ann Fisher , Thomas Halvorsrod , Robert Wodnicki
发明人： Bruno Hans Haider , Kjell Kristoffersen , Rayette Ann Fisher , Thomas Halvorsrod , Robert Wodnicki
IPC分类号： H01L41/09 , G01N24/00 , A61B8/14
CPC分类号： A61B8/00 , A61B1/0005 , B06B1/0622 , G01S7/5208 , G01S15/8925 , G01S15/8927 , G03B42/06
摘要： An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.
摘要翻译：超声成像系统（100）。示例性系统（100）包括形成在子阵列（140）中的多个换能器元件（136）和多个子阵列电路单元（160'），每个电路单元（160'）连接到子阵列换能器元件（136）。每个单元（160'）中的电路包括多个集成电路（330,340,350），其中至少第一（340）个集成电路以堆叠配置形成在第二（330）集成电路上。在示例图中，第一集成电路（340）包括沿着其表面（342）的第一多个第一接合焊盘（345），并且第二集成电路（330）包括沿着第一多个第二接合焊盘其具有在成对的第一和第二接合焊盘之间延伸的接合线（344），以在它们之间提供输入/输出信号连接。

3. 发明申请

US20100174195A1 ULTRASOUND IMAGING SYSTEM 有权
标题翻译：超声成像系统
公开(公告)号：US20100174195A1
公开(公告)日：2010-07-08
申请号：US12725536
申请日：2010-03-17
申请人： Bruno Hans Haider , Kjell Kristoffersen , Rayette Ann Fisher , Thomas Halvorsrod , Robert Wodnicki
发明人： Bruno Hans Haider , Kjell Kristoffersen , Rayette Ann Fisher , Thomas Halvorsrod , Robert Wodnicki
IPC分类号： A61B8/14
CPC分类号： A61B8/00 , A61B1/0005 , B06B1/0622 , G01S7/5208 , G01S15/8925 , G01S15/8927 , G03B42/06
摘要： An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.
摘要翻译：超声成像系统（100）。示例性系统（100）包括形成在子阵列（140）中的多个换能器元件（136）和多个子阵列电路单元（160'），每个电路单元（160'）连接到子阵列换能器元件（136）。每个单元（160'）中的电路包括多个集成电路（330,340,350），其中至少第一（340）个集成电路以堆叠配置形成在第二（330）集成电路上。在示例图中，第一集成电路（340）包括沿着其表面（342）的第一多个第一接合焊盘（345），并且第二集成电路（330）包括沿着第一多个第二接合焊盘其具有在成对的第一和第二接合焊盘之间延伸的接合线（344），以在它们之间提供输入/输出信号连接。

4. 发明申请

US20050096545A1 Methods and apparatus for transducer probe 审中-公开
标题翻译：换能器探头的方法和装置
公开(公告)号：US20050096545A1
公开(公告)日：2005-05-05
申请号：US10697518
申请日：2003-10-30
申请人： Bruno Haider , Robert Wodnicki
发明人： Bruno Haider , Robert Wodnicki
IPC分类号： A61B8/00 , G01S7/521 , G01S7/524 , G01S15/89 , G10K11/34 , A61B8/06
CPC分类号： G01S15/8925 , G01S7/5202 , G01S7/52079 , G01S7/5208 , G01S15/8918 , G10K11/341
摘要： A probe having a plurality of transducers also has a plurality of pulsers within the probe that are responsive to one or more transmit timing signals received from an external system to transmit pulses to the plurality of transducers. The external system may be, but need not be, an imaging system, and the transducers may be, but need not be, ultrasound transducers.
摘要翻译：具有多个换能器的探头还具有探针内的多个脉冲发生器，其响应于从外部系统接收的一个或多个发射定时信号，以向多个换能器发送脉冲。外部系统可以是但不必是成像系统，并且换能器可以是但不必是超声换能器。

5. 发明申请

US20050094490A1 Integrated interface electronics for reconfigurable sensor array 有权
标题翻译：用于可重构传感器阵列的集成接口电子设备
公开(公告)号：US20050094490A1
公开(公告)日：2005-05-05
申请号：US10977930
申请日：2004-10-29
申请人： Kai Thomenius , Rayette Fisher , Robert Wodnicki , William Burdick
发明人： Kai Thomenius , Rayette Fisher , Robert Wodnicki , William Burdick
IPC分类号： A61B8/00 , B06B1/02 , B06B1/06 , H04R17/00
CPC分类号： B06B1/0292 , G01N29/06 , G01N29/262 , G01N2291/106 , H01L2924/0002 , H01L2924/00
摘要： An integrated switch matrix for reconfiguring subelements of a mosaic sensor array to form elements. The configuration of the switch matrix is fully programmable. The switch matrix includes access switches that connect subelements to bus lines and matrix switches that connect subelements to subelements. Each subelement has a unit switch cell comprising at least one access switch, at least one matrix switch, a respective memory element for storing the future state of each switch, and a respective control circuit for each switch. The access and matrix switches are of a type having the ability to memorize control data representing the current switch state of the switch, which control data includes a data bit input to turn-on/off circuits incorporated in the control circuit. The sensor array and the switching matrix may be built in different strata of a co-integrated structure or they may be built on separate wafers that are electrically connected. If the sensors are arranged on a hexagonal grid, the unit switch cells may be arranged on either a hexagonal or rectangular grid.
摘要翻译：一种用于重新配置马赛克传感器阵列的子元素以形成元素的集成开关矩阵。开关矩阵的配置是完全可编程的。开关矩阵包括将子元件连接到总线线路的接入开关和将子元件连接到子元件的矩阵开关。每个子元件具有包括至少一个存取开关，至少一个矩阵开关，用于存储每个开关的未来状态的相应存储元件以及每个开关的相应控制电路的单元开关单元。存取和矩阵开关是具有存储表示开关的当前开关状态的控制数据的能力的类型，该控制数据包括输入到控制电路中的导通/截止电路的数据位。传感器阵列和开关矩阵可以内置在共同一体化结构的不同层中，或者它们可以被构建在电连接的分开的晶片上。如果传感器布置在六边形网格上，则单元开关单元可以布置在六边形或矩形网格上。

6. 发明申请

US20070180916A1 Capacitive micromachined ultrasound transducer and methods of making the same 审中-公开
标题翻译：电容式微机械超声换能器及其制作方法
公开(公告)号：US20070180916A1
公开(公告)日：2007-08-09
申请号：US11350424
申请日：2006-02-09
申请人： Wei-Cheng Tian , Lowell Smith , Ching-Yeu Wei , Robert Wodnicki , Rayette Fisher , David Mills , Stanley Chu , Hyon-Jin Kwon
发明人： Wei-Cheng Tian , Lowell Smith , Ching-Yeu Wei , Robert Wodnicki , Rayette Fisher , David Mills , Stanley Chu , Hyon-Jin Kwon
IPC分类号： G01H11/06 , H04R31/00 , G01R3/00
CPC分类号： B06B1/0292 , A61B2562/028 , Y10T29/49005
摘要： A method of making a capacitive micromachined ultrasound transducer cell is provided. The method includes providing a carrier substrate, where the carrier substrate comprises glass. The step of providing the glass substrate may include forming vias in the glass substrate. Further, the method includes providing a membrane such that at least one of the carrier substrate, or the membrane comprises support posts, where the support posts are configured to define a cavity depth. The method further includes bonding the membrane to the carrier substrate by using the support posts, where the carrier substrate, the membrane and the support posts define an acoustic cavity.
摘要翻译：提供了一种制造电容式微加工超声换能器的方法。该方法包括提供载体衬底，其中载体衬底包括玻璃。提供玻璃基板的步骤可以包括在玻璃基板中形成通路。此外，该方法包括提供膜，使得载体基底或膜中的至少一个包括支撑柱，其中支撑柱构造成限定腔深度。该方法还包括通过使用支撑柱将膜结合到载体基底，其中载体基底，膜和支撑柱限定声腔。

7. 发明申请

US20050148132A1 Alignment method for fabrication of integrated ultrasonic transducer array 失效
标题翻译：集成超声波换能器阵列的校准方法
公开(公告)号：US20050148132A1
公开(公告)日：2005-07-07
申请号：US10751290
申请日：2004-01-01
申请人： Robert Wodnicki
发明人： Robert Wodnicki
IPC分类号： G03F9/00 , B06B1/02 , B81B7/04 , B81C1/00 , H01L21/00 , H01L21/027
CPC分类号： B06B1/0292 , Y10T29/42
摘要： An integrated circuit is fabricated by micromachining a hexagonal array of cMUT elements on top of a substrate comprising a hexagonal array of CMOS cells. Each cMUT element overlies a respective CMOS cell in one-to-one correspondence. During layout of the mask for micromachining the cMUT layer, either the hexagonal pattern or the alignment key is rotated until an axis of symmetry of the hexagonal pattern is aligned with an axis of the alignment key. Later, when the mask is superimposed on the CMOS substrate, the alignment key on the mask is aligned with an alignment key on the substrate. This ensures that the cMUT elements formed by optical lithography will be matched to the CMOS cells.
摘要翻译：通过在包括六边形阵列的CMOS单元的衬底的顶部上微加工cMUT元件的六边形阵列来制造集成电路。每个cMUT元件一一对应地覆盖相应的CMOS单元。在用于微加工cMUT层的掩模的布局期间，旋转六边形图案或对准键直到六边形图案的对称轴线与对准键的轴线对准。之后，当掩模叠加在CMOS基板上时，掩模上的对准键与衬底上的对准键对齐。这确保了通过光学光刻形成的cMUT元件将与CMOS单元匹配。

8. 发明申请

US20050169107A1 Switching circuitry for reconfigurable arrays of sensor elements 有权
标题翻译：用于可重构阵列的传感器元件的开关电路
公开(公告)号：US20050169107A1
公开(公告)日：2005-08-04
申请号：US10978196
申请日：2004-10-29
申请人： Kai Thomenius , Rayette Fisher , Robert Wodnicki , Christopher Hazard , Lowell Smith , David Mills
发明人： Kai Thomenius , Rayette Fisher , Robert Wodnicki , Christopher Hazard , Lowell Smith , David Mills
IPC分类号： A61B8/00 , B06B1/02 , B06B1/06 , H04R17/00 , E03B7/07 , F16K37/00 , F17D3/00 , G01S15/00 , H04B1/02
CPC分类号： H03M11/00 , B06B1/0207 , B06B1/0292 , G01N29/262 , G01N2291/044 , G01N2291/106
摘要： A device comprising an array of sensors that are reconfigurable by means of a switching network. The sensors may be optical, thermal or pressure sensors or ultrasonic transducers. More specifically, the device comprises: a multiplicity of sensor elements; a plurality of bus lines; a set of access switches for selectively connecting a set of the sensor elements in a row to a bus line, one of the access switches being connected to a first sensor element; a multiplicity of sets of matrix switches, each of the sets of matrix switches selectively connecting a respective sensor element of the multiplicity of sensor elements to a respective set of adjacent sensor elements, one of the matrix switches being connected to the first sensor element and to a second sensor element that is not a member of the set of sensor elements; and control circuitry that controls the access switches and the matrix switches in accordance with a selected switching configuration such that the first sensor element is connected to the bus line via said one access switch, while at the same time the second sensor element is connected to said one access switch via said one matrix switch.
摘要翻译：一种包括可通过交换网络重新配置的传感器阵列的设备。传感器可以是光学，热或压力传感器或超声换能器。更具体地，该装置包括：多个传感器元件; 多条总线; 一组接入开关，用于选择性地将一行中的传感器元件连接到总线，其中一个接入开关连接到第一传感器元件; 多个矩阵开关组，每组矩阵开关选择性地将多个传感器元件的相应传感器元件连接到相应的一组相邻传感器元件，矩阵开关中的一个连接到第一传感器元件，并且第二传感器元件，其不是该组传感器元件的构件; 以及控制电路，其根据选择的开关配置来控制接入开关和矩阵开关，使得第一传感器元件经由所述一个接入开关连接到总线，同时第二传感器元件连接到所述一个接入开关经由所述一个矩阵开关。

9. 发明申请

US20050154300A1 Integrated low-voltage transmit/receive switch for ultrasound imaging system 失效
标题翻译：用于超声成像系统的集成低压发射/接收开关
公开(公告)号：US20050154300A1
公开(公告)日：2005-07-14
申请号：US10749977
申请日：2003-12-30
申请人： Robert Wodnicki , Rayette Fisher
发明人： Robert Wodnicki , Rayette Fisher
IPC分类号： A61B8/00 , B06B1/02 , G01N29/06 , G03B42/06 , H04B11/00
CPC分类号： H04B11/00 , B06B1/0215
摘要： A low-voltage transmit/receive switch that acts to protect sensitive low-voltage electronics from high-voltage pulse signals used to drive an ultrasonic transducer. The low-voltage transmit/receive switch comprises a series resistor and a parallel MOSFET pair. The parallel MOSFETs are low-voltage devices. The low-voltage transmit/receive switch is placed between the output of a high-voltage pulser and the input of a receive pre-amplifier. If dual high- and low-voltage pulsers are used, then the low-voltage pulser is connected so that it is also protected from the high-voltage pulse signals by the low-voltage transmit/receive switch. In an alternative embodiment, the low-voltage pulser and the receive pre-amplifier are protected from the high-voltage pulse signals by a high-voltage transmit/receive switch.
摘要翻译：低压发射/接收开关，用于保护敏感的低压电子元件免受用于驱动超声波换能器的高电压脉冲信号。低压发射/接收开关包括串联电阻和并联MOSFET对。并联MOSFET是低压器件。低压发射/接收开关位于高压脉冲发生器的输出端和接收前置放大器的输入端之间。如果使用双高压脉冲发生器，则连接低压脉冲发生器，以便通过低压发射/接收开关保护其免受高电压脉冲信号的影响。在替代实施例中，通过高压发射/接收开关来保护低压脉冲发生器和接收前置放大器免受高电压脉冲信号的影响。

10. 发明申请

US20050096546A1 Optimized switching configurations for reconfigurable arrays of sensor elements 失效
标题翻译：用于可重构阵列传感器元件的优化开关配置
公开(公告)号：US20050096546A1
公开(公告)日：2005-05-05
申请号：US10978175
申请日：2004-10-29
申请人： Christopher Hazard , Robert Wodnicki , Rayette Fisher , Kai Thomenius , Lowell Smith , David Mills
发明人： Christopher Hazard , Robert Wodnicki , Rayette Fisher , Kai Thomenius , Lowell Smith , David Mills
IPC分类号： A61B8/00 , B06B1/02 , B06B1/06 , H04R17/00 , A61B8/02
CPC分类号： G10K11/34 , A61B2562/028 , B06B1/0292 , G01S7/52046 , G01S15/8925
摘要： The reconfigurable ultrasound array disclosed herein is one that allows groups of subelements to be connected together dynamically so that the shape of the resulting element can be made to match the shape of the wave front. This can lead to improved performance and/or reduced channel count. Reconfigurability can be achieved using a switching network. A methodology and an algorithm are disclosed that allows the performance of this switching network to be improved by properly choosing the configuration of the switching network.
摘要翻译：本文公开的可重构超声波阵列是允许一组子元件动态地连接在一起的结构，使得所得到的元件的形状可以与波前的形状相匹配。这可以导致改进的性能和/或减少的通道数。可以使用交换网络实现可重构性。公开了一种通过适当选择交换网络的配置来改善该交换网络的性能的方法和算法。

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