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    • 7. 发明授权
    • Passivated polycrystalline semiconductors quantum well/superlattice
structures fabricated thereof
    • 其制造的钝化多晶半导体量子阱/超晶格结构
    • US5051786A
    • 1991-09-24
    • US426571
    • 1989-10-24
    • Edward H. NicollianArnold ReimanRaphael Tsu
    • Edward H. NicollianArnold ReimanRaphael Tsu
    • H01L21/324H01L29/15H01L29/16
    • H01L21/324H01L21/3245H01L29/154H01L29/1604
    • The internal grain boundaries and intergranular spaces of polycrystalline semiconductor material may be passivated with an amorphous material, to substantially eliminate the dangling bonds at the internal grain boundaries. The passivated polycrystalline material of the present invention exhibits a lower electrically active defect density at the grain boundaries and intergranular space compared to unpassivated polycrystalline material. Moreover, large classes of amorphous passivating materials may be used for each known semiconductor material so that the passivating process may be readily adapted to existing process parameters and other device constraints. Passivated polycrystalline material may be employed to form the well or low energy bandgap layer of a quantum well device or superlattice, while still maintaining the required tunneling effect. By freeing quantum well devices from the requirement to use monocrystalline well material deeper wells may be produced, and a wider range of materials may be used, with high yields and low cost processes.
    • 多晶半导体材料的内部晶界和晶间空间可以用无定形材料钝化,以基本上消除内部晶界处的悬挂键。 与未钝化的多晶材料相比,本发明的钝化多晶材料在晶界和晶间间隙处表现出较低的电活性缺陷密度。 而且,对于每种已知的半导体材料,可以使用大类非晶体钝化材料,使得钝化工艺可以容易地适应现有工艺参数和其它器件限制。 可以采用钝化多晶材料来形成量子阱器件或超晶格的阱或低能带隙层,同时仍然保持所需的隧道效应。 通过将量子阱器件从使用单晶阱材料的要求释放,可以生产较深的阱,并且可以使用更宽范围的材料,具有高产率和低成本的工艺。