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1. 发明授权

US08791579B2 Adjusting sizes of connectors of package components 有权
标题翻译：调整包装组件连接器的尺寸
公开(公告)号：US08791579B2
公开(公告)日：2014-07-29
申请号：US13299100
申请日：2011-11-17
申请人： Chih-Wei Lai , Ming-Che Ho , Tzong-Hann Yang , Chien Rhone Wang , Chia-Tung Chang , Hung-Jui Kuo , Chung-Shi Liu
发明人： Chih-Wei Lai , Ming-Che Ho , Tzong-Hann Yang , Chien Rhone Wang , Chia-Tung Chang , Hung-Jui Kuo , Chung-Shi Liu
IPC分类号： H01L23/52 , H01L23/48 , H01L23/485 , H01L23/495
CPC分类号： G06F17/5077 , G06F17/5072 , H01L23/488 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/034 , H01L2224/03912 , H01L2224/0401 , H01L2224/05016 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05552 , H01L2224/05572 , H01L2224/05666 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14132 , H01L2924/00014 , H01L2924/00012 , H01L2924/01047 , H01L2924/01029
摘要： A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.
摘要翻译：一种装置包括在包装部件的顶表面上的多个连接器。多个连接器包括具有第一横向尺寸的第一连接器和具有第二横向尺寸的第二连接器。第二横向尺寸大于第一横向尺寸。第一和第二横向尺寸在平行于包装部件的主表面的方向上测量。

2. 发明申请

US20130127059A1 Adjusting Sizes of Connectors of Package Components 有权
公开(公告)号：US20130127059A1
公开(公告)日：2013-05-23
申请号：US13299100
申请日：2011-11-17
申请人： Chih-Wei Lai , Ming-Che Ho , Tzong-Hann Yang , Chien Rhone Wang , Chia-Tung Chang , Hung-Jui Kuo , Chung-Shi Liu
发明人： Chih-Wei Lai , Ming-Che Ho , Tzong-Hann Yang , Chien Rhone Wang , Chia-Tung Chang , Hung-Jui Kuo , Chung-Shi Liu
IPC分类号： H01L23/48 , H01L21/66 , G06F17/50
CPC分类号： G06F17/5077 , G06F17/5072 , H01L23/488 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/034 , H01L2224/03912 , H01L2224/0401 , H01L2224/05016 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05552 , H01L2224/05572 , H01L2224/05666 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14132 , H01L2924/00014 , H01L2924/00012 , H01L2924/01047 , H01L2924/01029
摘要： A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.

3. 发明申请

US20130024019A1 APPARATUS AND METHODS FOR END POINT DETERMINATION IN SEMICONDUCTOR PROCESSING 审中-公开
标题翻译：用于半导体处理中端点测定的装置和方法
公开(公告)号：US20130024019A1
公开(公告)日：2013-01-24
申请号：US13285679
申请日：2011-10-31
申请人： Chien Rhone Wang , Tzu-Cheng Lin , Yu-Jen Cheng , Chih-Wei Lai , Hung-Pin Chang , Tsang-Jiuh Wu
发明人： Chien Rhone Wang , Tzu-Cheng Lin , Yu-Jen Cheng , Chih-Wei Lai , Hung-Pin Chang , Tsang-Jiuh Wu
IPC分类号： G05B13/04
CPC分类号： G05B19/41875 , G05B2219/32201 , G05B2219/32205 , G05B2219/45031 , Y02P90/20 , Y02P90/22
摘要： Methods and apparatus for performing end point determination are disclosed. An embodiment includes an apparatus comprising a process tool and a programmable processor. The process tool has an output for signaling in-situ measurements of physical parameters during processing of a wafer in the process tool, and the process tool has an input for receiving a signal indicating a modification of a recipe for the processing. The programmable processor is for executing a virtual metrology model of the process tool to estimate an estimated characteristic of the wafer achieved during the processing. The estimated characteristic is based on the in-situ measurements and the virtual metrology model. The programmable processor has an output for transmitting the signal when the estimated characteristic exceeds a predetermined threshold based on a target characteristic.
摘要翻译：公开了用于执行终点确定的方法和装置。实施例包括一种包括处理工具和可编程处理器的装置。处理工具具有用于在处理工具中的晶片处理期间信号化物理参数的原位测量的输出，并且处理工具具有用于接收指示用于处理的配方的修改的信号的输入。可编程处理器用于执行处理工具的虚拟计量模型以估计在处理期间实现的晶片的估计特性。估计的特征是基于原位测量和虚拟计量模型。可编程处理器具有用于当估计特性基于目标特性超过预定阈值时发送信号的输出。

4. 发明申请

US20130244346A1 Packaging Methods, Material Dispensing Methods and Apparatuses, and Automated Measurement Systems 有权
标题翻译：包装方法，材料分配方法和装置以及自动测量系统
公开(公告)号：US20130244346A1
公开(公告)日：2013-09-19
申请号：US13420383
申请日：2012-03-14
申请人： Chien Rhone Wang , Chih-Wei Lai , Chih-Chiang Chang , Kewei Zuo , Jing-Cheng Lin
发明人： Chien Rhone Wang , Chih-Wei Lai , Chih-Chiang Chang , Kewei Zuo , Jing-Cheng Lin
IPC分类号： H01L21/66 , G06F17/00
CPC分类号： G06F17/00 , H01L22/12 , H01L22/20 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/83951 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/181 , H01L2224/81 , H01L2924/00012 , H01L2924/00
摘要： Packaging methods, material dispensing methods and apparatuses, and automatic measurement systems are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a second die to a top surface of a first die, dispensing a first amount of underfill material between the first die and the second die, and capturing an image of the underfill material. Based on the image captured, a second amount or no additional amount of underfill material is dispensed between the first die and the second die.
摘要翻译：公开了包装方法，材料分配方法和装置以及自动测量系统。在一个实施例中，包装半导体器件的方法包括将第二管芯耦合到第一管芯的顶表面，在第一管芯和第二管芯之间分配第一量的底部填充材料，以及捕获底部填充材料的图像。基于所捕获的图像，在第一模具和第二模具之间分配第二量或不需要额外量的底部填充材料。

5. 发明申请

US20130023065A1 Apparatus and Methods for End Point Determination in Reactive Ion Etching 有权
标题翻译：反应离子蚀刻中终点测定的装置和方法
公开(公告)号：US20130023065A1
公开(公告)日：2013-01-24
申请号：US13189287
申请日：2011-07-22
申请人： Chien Rhone Wang , Tzu-Cheng Lin , Yu-Jen Cheng , Chih-Wei Lai , Hung-Pin Chang , Tsang-Jiuh Wu
发明人： Chien Rhone Wang , Tzu-Cheng Lin , Yu-Jen Cheng , Chih-Wei Lai , Hung-Pin Chang , Tsang-Jiuh Wu
IPC分类号： H01L21/66
CPC分类号： H01J37/32963
摘要： Methods and apparatus for performing end point determination. A method includes receiving a wafer into an etch tool chamber for performing an RIE etch; beginning the RIE etch to form vias in the wafer; receiving in-situ measurements of one or more physical parameters of the etch tool chamber that are correlated to the RIE etch process; providing a virtual metrology model for the RIE etch in the chamber; inputting the received in-situ measurements to the virtual metrology model for the RIE etch in the chamber; executing the virtual metrology model to estimate the current via depth; comparing the estimated current via depth to a target depth; and when the comparing indicates the current via depth is within a predetermined threshold of the target depth; outputting a stop signal. An apparatus for use with the method embodiment is disclosed.
摘要翻译：执行终点确定的方法和装置。一种方法包括将晶片接收到用于进行RIE蚀刻的蚀刻工具室中; 开始RIE蚀刻以在晶片中形成通孔; 接收与RIE蚀刻工艺相关的蚀刻工具室的一个或多个物理参数的原位测量; 为腔室中的RIE蚀刻提供虚拟计量模型; 将接收到的原位测量值输入到腔室中的RIE蚀刻的虚拟测量模型; 执行虚拟计量模型以通过深度估计电流; 将经过深度的估计电流与目标深度进行比较; 并且当比较指示当前经过深度在目标深度的预定阈值内时; 输出停止信号。公开了一种用于该方法实施例的装置。

6. 发明授权

US09390060B2 Packaging methods, material dispensing methods and apparatuses, and automated measurement systems 有权
标题翻译：包装方法，材料分配方法和装置以及自动测量系统
公开(公告)号：US09390060B2
公开(公告)日：2016-07-12
申请号：US13420383
申请日：2012-03-14
申请人： Chien Rhone Wang , Chih-Wei Lai , Chih-Chiang Chang , Kewei Zuo , Jing-Cheng Lin
发明人： Chien Rhone Wang , Chih-Wei Lai , Chih-Chiang Chang , Kewei Zuo , Jing-Cheng Lin
IPC分类号： H01L21/66 , G06F17/00 , H01L23/00 , H01L25/065
CPC分类号： G06F17/00 , H01L22/12 , H01L22/20 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/83951 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/181 , H01L2224/81 , H01L2924/00012 , H01L2924/00
摘要： Packaging methods, material dispensing methods and apparatuses, and automatic measurement systems are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a second die to a top surface of a first die, dispensing a first amount of underfill material between the first die and the second die, and capturing an image of the underfill material. Based on the image captured, a second amount or no additional amount of underfill material is dispensed between the first die and the second die.
摘要翻译：公开了包装方法，材料分配方法和装置以及自动测量系统。在一个实施例中，包装半导体器件的方法包括将第二管芯耦合到第一管芯的顶表面，在第一管芯和第二管芯之间分配第一量的底部填充材料，以及捕获底部填充材料的图像。基于所捕获的图像，在第一模具和第二模具之间分配第二量或不需要额外量的底部填充材料。

7. 发明授权

US08445296B2 Apparatus and methods for end point determination in reactive ion etching 有权
标题翻译：用于反应离子蚀刻终点测定的装置和方法
公开(公告)号：US08445296B2
公开(公告)日：2013-05-21
申请号：US13189287
申请日：2011-07-22
申请人： Chien Rhone Wang , Tzu-Cheng Lin , Yu-Jen Cheng , Chih-Wei Lai , Hung-Pin Chang , Tsang-Jiuh Wu
发明人： Chien Rhone Wang , Tzu-Cheng Lin , Yu-Jen Cheng , Chih-Wei Lai , Hung-Pin Chang , Tsang-Jiuh Wu
IPC分类号： H01L21/02
CPC分类号： H01J37/32963
摘要： Methods and apparatus for performing end point determination. A method includes receiving a wafer into an etch tool chamber for performing an RIE etch; beginning the RIE etch to form vias in the wafer; receiving in-situ measurements of one or more physical parameters of the etch tool chamber that are correlated to the RIE etch process; providing a virtual metrology model for the RIE etch in the chamber; inputting the received in-situ measurements to the virtual metrology model for the RIE etch in the chamber; executing the virtual metrology model to estimate the current via depth; comparing the estimated current via depth to a target depth; and when the comparing indicates the current via depth is within a predetermined threshold of the target depth; outputting a stop signal. An apparatus for use with the method embodiment is disclosed.
摘要翻译：执行终点确定的方法和装置。一种方法包括将晶片接收到用于进行RIE蚀刻的蚀刻工具室中; 开始RIE蚀刻以在晶片中形成通孔; 接收与RIE蚀刻工艺相关的蚀刻工具室的一个或多个物理参数的原位测量; 为腔室中的RIE蚀刻提供虚拟计量模型; 将接收到的原位测量值输入到腔室中的RIE蚀刻的虚拟测量模型; 执行虚拟计量模型以通过深度估计电流; 将经过深度的估计电流与目标深度进行比较; 并且当比较指示当前经过深度在目标深度的预定阈值内时; 输出停止信号。公开了一种用于该方法实施例的装置。

8. 发明授权

US07634325B2 Prediction of uniformity of a wafer 失效
标题翻译：预测晶圆的均匀性
公开(公告)号：US07634325B2
公开(公告)日：2009-12-15
申请号：US11744107
申请日：2007-05-03
申请人： Jean Wang , Francis Ko , Ping-Hsu Chen , Henry Lo , Chih-Wei Lai
发明人： Jean Wang , Francis Ko , Ping-Hsu Chen , Henry Lo , Chih-Wei Lai
IPC分类号： G06F19/00
CPC分类号： H01L22/20 , G01N21/9501 , H01L22/12
摘要： A method of monitoring uniformity of a wafer is provided. A wafer parameter is selected. Manufacturing data is collected. The manufacturing data includes measurements of the selected wafer parameter. An average offset profile of the wafer parameter for a first and second wafer is determined using the manufacturing data. The first and second wafer are associated with a product type and were processed by a processing tool. An offset profile for a third wafer is predicted for a wafer using the average offset profile. The third wafer is associated with the product type and was processed by the processing tool.
摘要翻译：提供了一种监测晶片均匀性的方法。选择晶圆参数。收集制造数据。制造数据包括所选晶片参数的测量。使用制造数据确定第一和第二晶片的晶片参数的平均偏移轮廓。第一和第二晶片与产品类型相关联并且由处理工具处理。使用平均偏移轮廓为晶片预测第三晶片的偏移轮廓。第三个晶片与产品类型相关联，并由加工工具处理。

9. 发明申请

US20080305563A1 Method and system for controlling copper chemical mechanical polish uniformity 有权
标题翻译：控制铜化学机械抛光均匀性的方法和系统
公开(公告)号：US20080305563A1
公开(公告)日：2008-12-11
申请号：US11810720
申请日：2007-06-07
申请人： Francis Ko , Chun-Hsien Lin , Jean Wang , Chih-Wei Lai , Ping-Hsu Chen , Henry Lo
发明人： Francis Ko , Chun-Hsien Lin , Jean Wang , Chih-Wei Lai , Ping-Hsu Chen , Henry Lo
IPC分类号： H01L21/306
CPC分类号： H01L22/20 , H01L21/3212 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A system and method for controlling resistivity uniformity in a Copper trench structure by controlling the CMP process is provided. A preferred embodiment comprises a system and a method in which a plurality of CMP process recipes may be created comprising at least a slurry arm position. A set of metrological data for at least one layer of the semiconductor substrate may be estimated, and an optimum CMP process recipe may be selected based on the set of metrological data. The optimum CMP process recipe may be implemented on the semiconductor substrate.
摘要翻译：提供了一种通过控制CMP工艺来控制铜沟槽结构中的电阻率均匀性的系统和方法。优选实施例包括系统和方法，其中可以创建包括至少浆料臂位置的多个CMP工艺配方。可以估计用于至少一层半导体衬底的一组计量数据，并且可以基于该组计量数据来选择最佳CMP工艺配方。可以在半导体衬底上实现最佳CMP工艺配方。

10. 发明授权

US07450095B2 Single-cluster lamp drive device 失效
标题翻译：单簇灯驱动装置
公开(公告)号：US07450095B2
公开(公告)日：2008-11-11
申请号：US11087554
申请日：2005-03-24
申请人： Te-Cheng Yu , Shang-Che Sun , Chih-Wei Lai , Huang-Ta Chiu , Wan-Chih Lin , Hao-Fan Liao , Ming-Chu Hsu
发明人： Te-Cheng Yu , Shang-Che Sun , Chih-Wei Lai , Huang-Ta Chiu , Wan-Chih Lin , Hao-Fan Liao , Ming-Chu Hsu
IPC分类号： G09G3/32
CPC分类号： G09G3/32 , G09G3/2011 , G09G2310/027
摘要： A single-cluster lamp drive device makes use of a controller to receive video data from a control system and then divides the video data into three sub video data. Next, these three sub video data are simultaneously and repetitively outputted to a digital-to-analog converter in every fixed time interval. Subsequently, the digital-to-analog converter converts these three sub video data to three analog voltages outputted to a voltage-to-current converter. Finally, the voltage-to-current converter converts these three analog voltages to three analog currents for driving light emitting devices to emit light, hence accomplishing voltage-in-current-out driving. The drive device drives a single-cluster lamp composed of one LED or several LEDs to adjust their brightness through current change, thereby coordinating with the control system to produce various color and pattern variations.
摘要翻译：单簇灯驱动装置利用控制器从控制系统接收视频数据，然后将视频数据分成三个子视频数据。接下来，这三个副视频数据在每个固定的时间间隔中被同时且重复地输出到数模转换器。随后，数模转换器将这三个子视频数据转换成输出到电压 - 电流转换器的三个模拟电压。最后，电压 - 电流转换器将这三个模拟电压转换为三个模拟电流，用于驱动发光器件发光，从而实现电流输出驱动。驱动装置驱动由一个LED或多个LED组成的单个集群灯，以通过电流变化来调节其亮度，从而与控制系统协调以产生各种颜色和图案变化。

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