专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US11183949B2 Power conversion device with a coolant passage 有权
公开(公告)号：US11183949B2
公开(公告)日：2021-11-23
申请号：US16806309
申请日：2020-03-02
申请人： DENSO CORPORATION
发明人： Hiromi Ichijo , Kazuya Takeuchi , Kenichi Hasegawa
IPC分类号： H02M7/537 , B60L15/00 , H01L23/367 , H01L23/473 , H05K7/20
摘要： A power conversion device includes a semiconductor stack, a reactor, and a capacitor. The semiconductor stack includes a plurality of semiconductor modules stacked on one another in a stacking direction. Each semiconductor module includes a semiconductor element. The reactor constitutes a boost circuit that boosts a direct-current voltage. The capacitor is electrically connected to the plurality of semiconductor modules. The semiconductor stack, the reactor, and the capacitor each include a coolant flow passage, and the reactor and the capacitor are located adjacent to each other.

2. 发明授权

US11432440B2 Power conversion apparatus 有权
公开(公告)号：US11432440B2
公开(公告)日：2022-08-30
申请号：US16782468
申请日：2020-02-05
申请人： DENSO CORPORATION
发明人： Hiromi Ichijo , Kazuya Takeuchi
IPC分类号： H05K7/20 , H02K9/19
摘要： A power conversion apparatus includes an electric component, a housing, and a flow channel formation unit. The electric component configures at least a part of a power conversion circuit. The housing stores the electric component, and the electric component is fixed to the housing. The flow channel formation unit forms a refrigerant flow channel through which a refrigerant flows, and is thermally connected to the electric component. The flow channel formation unit is a member different from the housing, and an elastically deformable spacer is provided between the flow channel formation unit and the housing.

3. 发明授权

US10321611B2 Power conversion apparatus 有权
公开(公告)号：US10321611B2
公开(公告)日：2019-06-11
申请号：US15978507
申请日：2018-05-14
申请人： DENSO CORPORATION
发明人： Naoki Hirasawa , Ryota Tanabe , Taijiro Momose , Hiromi Ichijo
IPC分类号： H05K7/20 , H02M7/00 , H05K7/14 , H05K5/02
摘要： A power conversion apparatus includes a semiconductor module, an electronic component, a cooling member, a casing and a pressurizing member. The electronic component includes a load application part that receives a load caused by pressurizing force on a surface in a pressurizing member side with respect to the lamination direction; a load supporting part that comes into contact with a contact part of the casing on a surface opposite to the pressurizing member side with respect to the lamination direction; and a fastening part fastened to a casing fastening part. The load supporting part is disposed between the load application part and the fastening part; moment of force around the load supporting part is produced in the electronic component by the load applied to the load application part; and the moment causes the electronic component to be pressed towards a pressed part of the casing.

4. 发明授权

US11563384B2 Capacitor device 有权
公开(公告)号：US11563384B2
公开(公告)日：2023-01-24
申请号：US17170978
申请日：2021-02-09
申请人： DENSO CORPORATION
发明人： Masaya Tonomoto , Tetsuya Matsuoka , Hiromi Ichijo
IPC分类号： H05K5/02 , H02M7/00 , H05K7/14
摘要： In a power converter, electronic components constituting a power conversion circuit is provided. A capacitor module and a converter case are also provided in the power converter. Fastening members, which include a first fastening member and a second fastening member, are configured to fasten the capacitor module to the converter case. The first and second fastening members are mounted on the inner bottom surface of the converter case. At least one of the electronic components is mounted to the capacitor module and is arranged between the first fastening member and the second fastening member when viewed in a view direction perpendicular to an alignment direction of the first and second fastening members. The view direction is parallel to the inner bottom surface of the converter case.

5. 发明授权

US10136564B2 Power converter 有权
公开(公告)号：US10136564B2
公开(公告)日：2018-11-20
申请号：US15718526
申请日：2017-09-28
申请人： DENSO CORPORATION
发明人： Kazuya Takeuchi , Naoki Hirasawa , Hiromi Ichijo , Shingo Oono , Takuya Oizumi
IPC分类号： H05K7/20 , H01L23/46 , H02M7/00 , H02M3/158 , H02M7/5387 , H02M1/00 , H02M1/32
摘要： A power converter includes a stack of a plurality of semiconductor modules, each of which incorporates semiconductor elements, and a plurality of cooling conduits, though each of which a coolant flows to cool the semiconductor modules, at least one electronic component electrically connected to the semiconductor modules, and a cooling plate for cooling the at least one electronic component. The stack, the at least one electronic component, and the cooling plate are arranged in a stacking direction of the stack. The cooling plate is connected to the cooling conduits and has an intra-plate pathway formed therein thorough which the coolant flows in a direction perpendicular to the stacking direction. The cooling plate has a larger area than each cooling conduit when viewed from the stacking direction.

6. 发明授权

US09773759B2 Electric power converter 有权
公开(公告)号：US09773759B2
公开(公告)日：2017-09-26
申请号：US15353009
申请日：2016-11-16
申请人： DENSO CORPORATION
发明人： Naoki Hirasawa , Ryota Tanabe , Hiromi Ichijo , Takashi Kawashima
IPC分类号： H01L25/065 , B60L11/18 , H01L23/053 , H01L23/32 , H01L23/473 , H02M7/00 , H05K7/20
CPC分类号： H01L25/0657 , B60L11/1874 , H01L23/053 , H01L23/32 , H01L23/473 , H01L2225/06555 , H01L2225/06582 , H01L2225/06589 , H02M7/003 , H02M2001/327 , H05K7/20927
摘要： An electric power converter includes a semiconductor module, an electronic component, a plurality of cooling tubes, a case, a main pressure member for pressing a stacked semiconductor section in a stacking direction, and a sub-pressure member for pressing a stacked component section in the stacking direction. The stacked semiconductor section and the stacked component section are stacked in line. A pressing force of the main pressure member is greater than a pressure pressing force of the sub-pressure member. The main pressure member is disposed at an end portion of the stacked component section far from the stacked semiconductor section. A supporting portion that supports the stacked semiconductor section from the stacked component section side is disposed in the case so as to prevent the pressing force of the main pressure member from acting on the stacked component section.

7. 发明授权

US09713293B2 Electric power converter 有权
公开(公告)号：US09713293B2
公开(公告)日：2017-07-18
申请号：US14919161
申请日：2015-10-21
申请人： DENSO CORPORATION
发明人： Kazuya Takeuchi , Makoto Okamura , Yuuichi Handa , Naoki Hirasawa , Hiromi Ichijo , Ryota Tanabe , Tetsuya Matsuoka
IPC分类号： H05K7/20 , H01L23/473 , H01G4/35 , H01G4/40 , H01G2/08 , H01G4/236 , H02M7/00 , H01L23/40
CPC分类号： H05K7/20927 , H01G2/08 , H01G4/236 , H01G4/35 , H01G4/40 , H01L23/473 , H01L2023/4025 , H02M7/003 , Y02T10/7022
摘要： An electric power converter includes a semiconductor module constituting a power conversion circuit, a capacitor electrically connected to the semiconductor module, and a cooling member for cooling the capacitor. The capacitor includes an element body provided with internal electrode, and a pair of end-face-electrodes provided on both end faces of the element body and connected to the internal electrode. The pair of end-face-electrodes are connected with a pair of bus bars, respectively, in a manner of surface contact. The capacitor is disposed in a state where one of the pair of end-face-electrodes is facing the cooling member. The end-face-electrode facing the cooling member is in contact with the cooling member via the bus bar.

8. 发明授权

US08958225B2 Electric power converter 有权
标题翻译：电力转换器
公开(公告)号：US08958225B2
公开(公告)日：2015-02-17
申请号：US13932110
申请日：2013-07-01
申请人： Denso Corporation
发明人： Hiromi Ichijo , Shoji Sakai
IPC分类号： H02M1/00 , H01L23/473 , H01L23/40 , H01L25/11 , H02M7/00
CPC分类号： H02M1/00 , H01L23/4006 , H01L23/473 , H01L25/117 , H01L2924/0002 , H02M7/003 , H01L2924/00
摘要： An electric power converter has a semiconductor module that has a switching element therein, cooling pipes that contact with heat radiating surfaces of the semiconductor module and cool the semiconductor module, and a capacitor module formed by sealing a capacitor element therein by a potting material. A piled unit is formed by piling the semiconductor module and the cooling pipes. A direction in which the semiconductor module and the cooling pipes are piled is defined as a piling direction. The piled unit is sandwiched between the capacitor module disposed in a first end side in the piling direction of the piled unit and a pressing member disposed in a second end side in the piling direction of the piled unit. The first end of the piled unit is contacted to a potting surface that is a surface of the potting material in the capacitor module.
摘要翻译：电力转换器具有其中具有开关元件的半导体模块，与半导体模块的散热表面接触并冷却半导体模块的冷却管，以及通过灌封材料密封电容器元件而形成的电容器模块。通过堆叠半导体模块和冷却管形成堆叠单元。将半导体模块和冷却管堆叠的方向定义为打桩方向。堆叠单元被夹在设置在堆叠单元的打桩方向的第一端侧的电容器模块和布置在堆叠单元的打桩方向的第二端侧的按压构件之间。堆叠单元的第一端与作为电容器模块中的灌封材料的表面的灌封表面接触。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式